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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
18pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
60Ω
Frequency:
12.288MHz
Mfr. Part #:
9ASC122G0018L
Package:
SMD5032-2P
Key Attributes
Model Number:
9ASC122G0018L
Product Description
Product Overview
The Glass5032 2PIN 12.288000MHz 9ASC122G0018L is a high-reliability SMD glass-sealed quartz crystal resonator designed for automatic mounting and reflow soldering. It offers tight tolerance and stability, making it an ideal choice for portable PCs, PDAs, DSCs, and USB interface cards. The product features high environmental performance and a reasonable cost with good delivery performance. It contains Pb in sealing glass, exempted by RoHS directive.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Type: Quartz Crystal Resonator
- Series: 9A Series
- Sealing Type: Glass Sealed
- Mounting Type: SMD
- RoHS Exemption: Contains Pb in sealing glass exempted by RoHS directive.
Technical Specifications
| Parameter | Specification | Notes |
|---|---|---|
| Nominal Frequency | 12.288000 MHz | |
| Oscillation Mode | Fund | |
| Load Capacitance | 18 | |
| Frequency Tolerance (at 25) | 10 ppm | |
| Frequency Tolerance (Over Operating Temp. Range) | 30 ppm | |
| Operating Temperature | -40+85 | |
| Aging (1st Year) | 3 | |
| Drive Level | 100 uW | |
| Effective Resistance (Rr) | 60 Max. | |
| Shunt Capacitance (C0) | 5 Max. pF | |
| Insulation Resistance | 500 Min. M | at DC 100V |
| Spurious Response | -3.0 dB | |
| Pulling Sensitivity (TS) | 125 ppm/pF | |
| Storage Temperature Range | -55+125 | |
| Crystal Cutting Type | AT CUT (thickness shear mode) | |
| Dimensions (L x W x H) | 5.0 x 3.2 x 1.2 mm | |
| Marking | LOGO, Nominal Frequency (MHz), Line Code, Last three digits of Batch No., Year/Month Code | |
| Standard Reel Quantity | 1,000 pcs per reel | (WHITE) |
| Material Composition - Base (Ceramics) | Al2O3 (92.41%), SiO2 (4.30%), Cr2O3 (1.51%), MgO (0.69%), CaO (1.09%) | |
| Material Composition - Cover (Glass) | PbO (57.29%), PbF2 (19.29%), Bi2O3 (5.30%), Nb2O5 (4.30%), B2O3 (2.30%), ZnO (2.30%), CuO (1.30%), CaO (0.30%), TiO2 (5.30%), Fe2O3 (2.30%) | |
| Material Composition - Electrode (Metal) | Tungsten (100.00%) | |
| Material Composition - Plating (Metal) | Gold (17.69%), Nickel (82.31%) | |
| Material Composition - Adhesive (Polymer) | Ag (75.00%), SiO2 (5.00%), Petroleum solvent (5.00%), Silicone resin (15.00%) | |
| Material Composition - Quartz (Wafer) | SiO2 (100.00%) |
2510091049_CHANGXING-ELECTRONICS-9ASC122G0018L_C46613815.pdf
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