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Specifications
Mfr. Part #:
8DSC500G0009L
Package:
SMD3225-4P
Key Attributes
Model Number:
8DSC500G0009L
Product Description
Product Overview
The Seam3225 4PIN 50.000000MHz is a high-precision Quartz Crystal Resonator designed for demanding communication applications. It offers high frequency stability and is exceptionally effective at reducing EMI effects, making it an ideal choice for Bluetooth devices, wireless communication sets, DSCs, PDAs, and mobile phones. This product is RoHS Compliant and Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Model: Seam3225
- Series: 8D Series
- Crystal Cutting Type: AT CUT (thickness shear mode)
- Compliance: RoHS Compliant / Pb Free
- Packaging: EIA-481-2
- MSL Level: 1 (IPC/JEDEC J-STD-033C)
Technical Specifications
| Parameter | Units | Min. | Max. | Typical | Notes |
|---|---|---|---|---|---|
| Nominal Frequency | MHz | - | - | 50.000000 | |
| Frequency Tolerance | ppm | - | - | 10 | at 25 3 |
| Load Capacitance | pF | 0.01 | 100 | - | |
| Oscillation Mode | - | - | - | Fund | |
| Drive Level | uW | - | 100 | - | |
| Operating Temperature | -40 | +85 | - | ||
| Storage Temperature Range | -55 | +125 | - | ||
| Frequency Stability | ppm | - | - | 30 | Over Operating Temp. Range |
| Aging | ppm/year | - | - | 3 | 1st Year |
| Shunt Capacitance (C0) | pF | - | 5 | - | |
| Motional Capacitance (C1) | fF | - | - | - | |
| Effective Resistance (Rr) | - | 40 | - | ||
| Insulation Resistance | M | 500 | - | - | at DC 100V |
| Pulling Sensitivity (TS) | ppm/pF | - | - | - | |
| Spurious Response | dB | -3.0 | - | - | |
| Dimensions (L x W x H) | mm | - | - | 3.2 x 2.5 x 0.7 | SMD Seam Sealing Crystals |
| Reel Quantity | pcs per reel | - | - | 3,000 | (WHITE) |
Packing Details
| Dimension | Unit | Value | Tolerance |
|---|---|---|---|
| L | mm | 1.40 | 0.1 |
| L1 | mm | 4.00 | 0.1 |
| W | mm | 2.70 | 0.1 |
| W1 | mm | 1.55 | 0.05 |
| H | mm | 1.75 | 0.1 |
| Reel Diameter | mm | 178 | 1.0 |
| Tape Width | mm | 13 | 0.5 |
| Pocket Pitch | mm | 11.5 | 0.2 |
| Pocket Depth | mm | 8.0 | +1.0 |
Marking Code
The marking code consists of the following elements:
- LOGO
- Nominal Frequency (MHz)
- Line Code
- Last three digits of Production Batch Number
- Year and Month Code (4-year cycle for year, specific codes for month)
Example: CX50.0 ****
Reflow Condition
Standard reflow soldering conditions apply. Specific pre-heat and peak temperatures are detailed in the original document, with a recommended pre-heat temperature of 125 for a total test time of 12 hours.
Reliability Specifications
1. Mechanical Endurance
- Vibration: 10 ~ 2000 Hz, Perpendicular axes, 4 hours each test time.
- Mechanical Shock: Half sine wave (1000 G), 0.5 m sec. duration time, three mutually perpendicular axes each 3 times.
- Drop Test: 150 cm height, 3 times on concrete floor.
- Resistance To Soldering Heat: Test temperature 260 5 , Pre-heat time 60 ~ 120 sec., Immersion time 5 1 seconds.
2. Environmental Endurance
- High Temp & Humidity: 85 3 , RH 85%, 500Hrs.
- Low Temp. Storage: -40 3 for 500 12 hours.
- High Temp. Storage: +125 3 for 500 12 hours.
- Thermal Shock: Total 100 cycles of temperature cycling between -55 and +125 .
- Pressure Cooker Storage: 125 3, RH 100%, 2 bar, 240Hrs.
- Helium Bombing: 4.5 Kgf / cm2 for 2 hr.
- Gross Leak Test: Test Pressure: 2Kg / cm2.
- Fine Leak Test: Flux Rosin resin methyl alcohol solvent (1:4).
Material Composition Declaration
| Part Name | Material Name | Material Mass (mg) | Material Mass (%) | Constituent Name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|---|
| Base (Ceramics) | Al2O3 | 6.40 | 36.95% | Aluminum oxide | 1344-28-1 | 92.40% |
| SiO2 | Silicon oxide | 7631-86-9 | 4.31% | |||
| Cr2O3 | Chromium oxide | 1308-38-9 | 1.50% | |||
| MgO | Magnesium oxide | 1309-48-4 | 0.69% | |||
| CaO | Calcium oxide | 1305-78-8 | 1.10% | |||
| KV Ring | - | 2.60 | 15.01% | - | - | - |
| Solder | - | 4.00 | 23.09% | - | - | - |
| Cover (4J29 Substrate) | - | 3.62 | 20.91% | - | - | - |
| Adhesive (Polymer) | - | 0.20 | 1.15% | - | - | - |
| Electrode | - | 0.05 | 0.29% | - | - | - |
| Chip (Quartz) | SiO2 | 0.45 | 2.60% | Silicon oxide | 14808-60-7 | 100.00% |
| Metallizing | Cr | - | - | Chromium | 7440-47-3 | 5.56% |
| Ag | - | - | Silver | 7440-22-4 | 94.44% | |
| Metal (Fe, Ni, Co) | Fe | - | - | Iron | 7439-89-6 | 53.45% |
| Ni | - | - | Nickel | 7440-02-0 | 29.25% | |
| Co | - | - | Cobalt | 7440-48-4 | 17.30% | |
| Plating (Ni) | Ni | - | - | Nickel | 7440-02-0 | 100.00% |
| Metal (W, Au, Ni) | W | - | - | Tungsten | 7440-33-7 | 100.00% |
| Au | - | - | Gold | 7440-57-5 | 100.00% | |
| Ni | - | - | Nickel | 7440-02-0 | 100.00% | |
| Metal (Ag, C11H24, C12H26, Silicone resin) | Ag | - | - | Silver | 7440-22-4 | 75.00% |
| C11H24 | - | - | Undecane | 1120-21-4 | 5.00% | |
| C12H26 | - | - | Dodecane | 112-40-3 | 5.00% | |
| Silicone resin | - | - | Silicone resin | - | 15.00% |
2509161435_CHANGXING-ELECTRONICS-8DSC500G0009L_C51902153.pdf
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