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quality Quartz Crystal Oscillator 50MHz SMD Type CHANGXING ELECTRONICS 9ESC500C0033L RoHS Compliant Pb Free factory
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quality Quartz Crystal Oscillator 50MHz SMD Type CHANGXING ELECTRONICS 9ESC500C0033L RoHS Compliant Pb Free factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
50MHz
Mfr. Part #:
9ESC500C0033L
Package:
SMD5032-4P
Key Attributes
Model Number: 9ESC500C0033L
Product Description

Product Overview

The CHANGXING ELECTRONICS CO.,LTD. 9ESC500C0033L is a 5.0x3.2mm SMD Crystal Oscillator with CMOS Output, designed for automatic mounting and reflow soldering. It offers high precision across a wide frequency range, low jitter, low power consumption, and a Tri-State function. Ideal for wireless communication sets, PDAs, and DSCs, this RoHS Compliant and Pb Free oscillator operates within a supply voltage range of 1.8V to 5.0V.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Product Series: 9E Series
  • Product Type: Quartz Crystal Oscillator
  • Output Type: CMOS Output
  • Mounting Type: SMD (Surface Mount Device)
  • Compliance: RoHS Compliant / Pb Free
  • Origin: Fujian Province, China

Technical Specifications

Specification Value Unit
Model 9ESC500C0033L
Product No. 5.0x3.2 OSC 50.000000MHz
Nominal Frequency 50.000000 MHz
Tolerance @ 25 Degree 10 ppm
Stability over Operation Temp. 20 ppm
Operating Temperature Range -4085
Storage Temperature Range -55125
Supply Voltage (Vdd) 1.8V3.3V Vdc
Supply Current (Icc) 5 A max
Standby current 5 A max
Output State Control Enable/disable
Rise/Fall Time 10 ns max
Output Voltage VOL 70%Vdd min
Output Voltage VOH 30%Vdd min
Output Load 15 pF max
Output Waveform CMOS
Output Symmetry 5010%
Start-up Time 5 ms max
Phase Jitter(12KHz 20MHz) IPC/JEDEC J-STD-033C ps max
Aging 3 ppm/year
Dimensions 5.0x3.2x1.2mm SMD
Product Weight 55.653 mg

Reflow Condition

Soldering profile: Peak: 250+50; Soldering zone: 230 or more, 3010s; Pre-heating zone 1: 150180, 9030s.

Soldering iron method: Bit temperature: 35010; Application time of soldering iron: 31 s.

Material Composition Declaration

No Name of Part Material Name Constituent name CAS No. Material Analysis(%)
1 Base Ceramics Al2O3 Aluminum oxide 1344-28-1 63.88%
SiO2 Silica 14464-46-1 3.79%
Cr2o3 Chromium oxide 1308-38-9 1.29%
Mo Molybdenum 7439-98-7 1.00%
Fe Iron 7440-33-7 9.25%
Ni Nickel 7439-89-6 8.85%
Co Cobalt 7440-02-0 4.75%
Ag silver 7440-48-4 2.98%
Cu Copper 7440-22-4 2.80%
2 Metallization W Tungsten W Tungsten 7440-50-8 1.04%
Au Gold 7440-02-0 0.24%
Ni Nickel 7440-57-5 0.13%
3 Adhesive Resin - - 100.00%
4 Blank Quartz SiO2 Silicon oxide 14808-60-7 100.00%
5 Wire Gold Au Gold 7440-57-5 100.00%
6 IC s ilicon Silicon 7440-21-3 100.00%
7 Electrode Electrode Ag Silver 7440-22-4 100.00%
Silver Silver 7440-22-4 74.00%
Ethyl alcohol Ethyl alcohol 64-17-5 0.60%
Bisphenol A-epichlorohydrin polymer Bisphenol A-epichlorohydrin polymer 25068-38-6 0.60%
Xylenes (o-, m-, p-isomers) Xylenes (o-, m-, p-isomers) 1330-20-7 0.60%
Ethylbenzene Ethylbenzene 100-41-4 0.06%
Silicone resin Silicone resin - 8.62%
Silica Silica - 8.52%
Petroleum solvents Petroleum solvents - 7.00%
Lid Kovar 8.00
Epoxy Conductive Resin
Pin Solder
Plate

2512081627_CHANGXING-ELECTRONICS-9ESC500C0033L_C48927857.pdf

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