Product Overview
The CHANGXING ELECTRONICS CO.,LTD. 8ESC250C0033L is a 3.2x2.5mm SMD Quartz Crystal Oscillator with CMOS output, designed for IT products such as WLAN, Bluetooth, DSC, and DSL. It features an ultra-small seam-sealed design and offers a tri-state function. This RoHS Compliant and Pb Free product is suitable for various electronic applications requiring precise frequency control.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Type: Quartz Crystal Oscillator
- Series: 8E Series
- Output Type: CMOS
- Compliance: RoHS Compliant / Pb Free
- Origin: Fujian, China
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 25.000000 | MHz | |
| Tolerance @ 25 Degree | 10 | ppm | |
| Stability over Operation Temp. | 20 | ppm/year | |
| Supply Voltage (Vdd) | 1.83.3 | Vdc | |
| Supply Current (Icc) | 5 | mA max | |
| Standby current | 8 | A max | |
| Output State Control | Enable/disable | ||
| Rise/Fall Time | 5 | ns max | |
| Output Voltage VOL | 10%VDD | ||
| Output Voltage VOH | 90%VDD | ||
| Output Load | 15 | pF max | |
| Output Waveform | CMOS | ||
| Output Symmetry | 5010% | ||
| Start-up Time | 5 | ms max | |
| Phase Jitter(12KHz20MHz) | 1.8 | ps max | |
| Fundamental Oscillation mode | Level 1 | ||
| Enable Voltage High | 70%Vdd min | ||
| Disable Voltage Low | 30%Vdd max | ||
| Operating Temperature Range | -4085 | ||
| Storage Temperature Range | -55125 | ||
| Aging | 3 | ppm/year | |
| Dimensions | 3.2 x 2.5 x 1.0mm | SMD | |
| Product No. | 8ESC250C0033L | ||
| Model | OSC 25.000000MHz | ||
| Product Weight | 29.568 | mg |
Other Information
Marking: LOGO, Nominal Frequency (MHz), Line Code, Last three digits of Production Batch Code, Year-Month Code.
Reflow Condition: Peak: 250+50, Soldering zone: 230 or more, 3010s. Pre-heating zone 1: 150180, 9030s.
Soldering Iron Method: Bit temperature: 35010, Application time: 3+1 s.
Packing: EIA-481-2 (TAPE CARRIER DIMENSIONS)
Reliability Specifications: Includes tests for Frequency change after test (5ppm), Solderability, Terminal Strength, Resistance to Soldering Heat, Temperature Cycle, Drop, Vibration, Shock, Low Temperature Storage, High Temperature Storage, and Humidity. Standard test conditions and specific test methods (e.g., GB/T standards) are detailed.
Material Composition Declaration: Includes Base (Ceramics), Lid (Kovar), Metallization (Tungsten, Gold, Nickel, Iron, Cobalt), Adhesive Resin, Blank (Quartz), Wire (Gold), IC (Silicon), Electrode (Silver), and Plate (Solder, Nickel plating).
2512081627_CHANGXING-ELECTRONICS-8ESC250C0033L_C48927812.pdf
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