Product Overview
The CHANGXING ELECTRONICS CO.,LTD. 2.0x1.6mm SMD Crystal Oscillators, specifically the 3E Series with CMOS Output, are ultra-small, seam-sealed clock crystal oscillator units designed for applications in WLAN, Bluetooth, DSC, DSL, and other IT products. These oscillators feature a tri-state function and are RoHS Compliant / Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Series: 3E Series
- Output Type: CMOS Output
- Package Type: SMD (Surface Mount Device)
- Sealing: Seam sealed
- Compliance: RoHS Compliant / Pb Free
- Origin: Fujian Province, China
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 30.000000 | MHz | |
| Product Model | 3ESC300C0033L | ||
| Dimensions | 2.0 x 1.6 x 0.75 | mm | SMD Crystal Oscillators |
| Tolerance @ 25 Degree | 10 | ppm | |
| Stability over Operation Temp. | 20 | ppm | |
| Aging | 3 | ppm/year | |
| Input Voltage (VDD) | 1.83.3 | Vdc | |
| Input Current (IDD) | 5 | A max | |
| Standby current | 5010% | A max | |
| Output State Control | Enable/disable | Tri-state function available | |
| Rise/Fall Time | 10 | ns max | |
| Output Voltage VOL | 90%VDD | ||
| Output Voltage VOH | 10%VDD | ||
| Output Load | 15 | pF max | |
| Output Waveform | COMS | ||
| Output Symmetry | 5010% | ||
| Start-up Time | 10 | ms max | |
| Jitter (rms) | 5 | ps max | |
| Operating Temperature Range | -4085 | ||
| Storage Temperature Range | -55125 | ||
| MSL Level | 1 | IPC/JEDEC J-STD-033C | |
| Reflow Condition Peak Temp. | 250+50 | ||
| Reflow Condition Soldering Zone Temp. | 230 | or more | 3010s |
| Reflow Condition Pre-heating Zone 1 Temp. | 150180 | 9030s | |
| Soldering Iron Method Bit Temp. | 35010 | 3+1 s | |
| Production Weight | 8.144 | mg |
Marking: LOGO, Nominal Frequency (MHz), Line Code, Last three digits of Production Batch Number, Year-Month Code.
Packing: EIA-481-2 Standard.
Reliability Specifications: Includes tests for Solderability, Terminal Strength, High Temperature Storage, Shock, Drop, Vibration, Resistance to Soldering Heat, Temperature Cycle, Low Temperature Storage, and Humidity, with specified frequency change limits (5ppm) and visual inspection criteria.
Material Composition Declaration: Details the composition of the Base (Ceramics), Lid (Kovar), Pin (Solder, Plating), Metallization (Tungsten, Gold, Nickel), Adhesive Resin, Blank (Quartz), Wire (Gold), IC (Silicon), and Electrode (Silver), including constituent elements, CAS numbers, and percentages.
2508051500_CHANGXING-ELECTRONICS-3ESC300C0033L_C48927829.pdf
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