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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
30MHz
Mfr. Part #:
7ESC300C0033L
Package:
SMD7050-4P
Key Attributes
Model Number:
7ESC300C0033L
Product Description
Product Overview
The CHANGXING ELECTRONICS CO.,LTD. 7E Series Quartz Crystal Oscillator is a small SMD seam-sealed clock crystal oscillator unit designed for automatic mounting and reflow soldering. It offers high precision across a wide frequency range, featuring a Tri-State function, a supply voltage range of 1.8 V to 5.0 V, high stability, low jitter, and low power consumption. This product is RoHS Compliant and Pb Free, making it suitable for applications in wireless communication, PCs, and LCDMs.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Origin: Fujian, China
- Certifications: RoHS Compliant / Pb Free
- Series: 7E Series
- Packaging: EIA-481-2
- MSL Level: 1 (IPC/JEDEC J-STD-033C)
Technical Specifications
| Specification | Value | Unit |
|---|---|---|
| Nominal Frequency | 30.000000 | MHz |
| Tolerance @ 25 Degree | 10 | ppm |
| Stability over Operation Temp. | 20 | ppm/year |
| Operating Temperature Range | -4085 | |
| Storage Temperature Range | -55125 | |
| Supply Voltage (Vdd) | 1.8V3.3V | Vdc |
| Supply Current (Icc) | 5 | A max |
| Standby current (1.8V~3.3V) | 5010% | A max |
| Phase Jitter (12KHz 20MHz) | 5 | ps max |
| Rise/Fall Time | 5 | ns max |
| Output Voltage VOL | 30%Vdd max | |
| Output Voltage VOH | 70%Vdd min | |
| Output Load | 15 | pF |
| Start-up Time | 10 | ms max |
| Output Symmetry | 5010% | |
| Fundamental Oscillation mode | ||
| Output State Control | Enable/disable | |
| Product Model | 7.0x5.0x1.3mm SMD Crystal Oscillators CMOS Output / 7E Series | |
| Product Code | 7ESC300C0033L | |
| Product Weight | 123.031 | mg |
| Dimensions | 7.05.0x1.3mm | SMD |
Reflow Condition
Temperature profile for reflow soldering:
Peak: 250+50
Soldering zone: 230 or more, 3010s.
Pre-heating zone 1: 150180, 9030s
Soldering iron method:
Bit temperature: 35010
Application time of soldering iron: 31 s
For other procedures, refer to IEC 60068-2-20.
Reliability Specifications
| ITEM | TEST METHOD | SPECIFICATION |
|---|---|---|
| Temperature Cycle | GB/T2423.22-2002, Method Nb (10 cycles from -25C to 85C. Measurement taken after DUT being left at room temperature for 242 hours.) | Frequency change after test5ppm. |
| Low Temperature Storage | GB/T2423.1-2001, Method Aa (Spending 72 hrs at -55C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours.) | Frequency change after test5ppm. |
| Humidity | GB/T2423.3-2006, Method Cab (Spending 96 hrs at 40 C 3 C, with 90 3% R.H. Measurement taken after DUT being left at room temperature for 242 hours.) | Frequency change after test5ppm. |
| High Temperature Storage | GB/T2423.2-2001, Method Ba (Spending 72 hrs at 125C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours.) | Frequency change after test5ppm. No visible damages. |
| Drop | GB/T 2423.8-1995, Method Ed (Free drop to the wooden plate from 1.0 m heights for 3 times.) | Frequency change after test5ppm. |
| Vibration | GB/T 2423.10-1995, Method Fc (Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h. 10 cycles in each direction of 3 axis. Measurement taken after 1 hour.) | Frequency change after test5ppm. |
| Resistance to Soldering Heat | GB/T 2423.28-2005, Test Tb Method 1B (Passed through the re-flow oven under the following condition. Preheat to 150 C5C for 60 to 120sec, and peak 265 C5C for 10s3sec. Measurement taken after DUT being left at room temperature for at 242 hours.) | Frequency change after test5ppm. |
| Shock | GB/T 2423.5-1995, Method Ea (Peak 1000m/s2, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axis of samples, 3 cycles /direction, total 18 cycles. Measurement taken after 1 hour.) | Frequency change after test5ppm. |
| Solderability | GB/T 2423.28-2005, Method Tc (In 255 5 solder bath for 2 0.5 seconds. 8-12X magnifier.) | Terminals shall be covered more then 95% with solder. No visible damage. |
| Terminal Strength | JIS-C-6429 Method 1 & 2 (Mount on a glass-epoxy board (100x50x1.6mm), then bend to 2mm displacement (velocity 1mm/sec) and keep for 5 seconds. or pulling force 0.5 kg for at least 60 seconds.) | Frequency change after test5ppm. No visible damages. |
Material Composition Declaration
| No. | Name of Part | Material Name | Constituent name | CAS No. | Material Analysis(%) |
|---|---|---|---|---|---|
| 1 | Base | Ceramics | Al2O3 | 1344-28-1 | 63.88% |
| SiO2 | 14464-46-1 | 3.79% | |||
| Cr2o3 | 1308-38-9 | 1.29% | |||
| Mo | 7439-98-7 | 1.00% | |||
| Fe | 7439-89-6 | 8.85% | |||
| Ni | 7440-02-0 | 4.75% | |||
| Co | 7440-48-4 | 2.98% | |||
| Ag | 7440-22-4 | 2.80% | |||
| Cu | 7440-50-8 | 1.04% | |||
| Pin | Solder | W | 7440-33-7 | 9.25% | |
| Au | 7440-57-5 | 0.13% | |||
| Ni | 7440-02-0 | 0.24% | |||
| Fe | 54.00% | ||||
| Co | 7440-48-4 | 17.02% | |||
| Ni | 7440-02-0 | 28.32% | |||
| Plate | Ni | Ni | 7440-02-0 | 0.66% | |
| 2 | Adhesive Resin | - | - | - | 100.00% |
| 3 | Blank | Quartz | SiO2 | 14808-60-7 | 100.00% |
| 4 | Wire | Gold | Au | 7440-57-5 | 100.00% |
| 5 | IC | Silicon | Silicon | 7440-21-3 | 100.00% |
| 6 | Electrode | Electrode | Ag | 7440-22-4 | 100.00% |
| Silver | Silver | 7440-22-4 | 74.00% | ||
| Ethyl alcohol | 64-17-5 | 0.60% | |||
| Bisphenol A-epichlorohydrin polymer | 25068-38-6 | 0.60% | |||
| Xylenes (o-, m-, p-isomers) | 1330-20-7 | 0.60% | |||
| Ethylbenzene | 100-41-4 | 0.06% | |||
| Silicone resin | - | 8.62% | |||
| Silica | - | 8.52% | |||
| Petroleumsolvents | - | 7.00% | |||
| 7 | Lid | Kovar | |||
| Epoxy Conductive Resin |
2512081627_CHANGXING-ELECTRONICS-7ESC300C0033L_C48927863.pdf
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