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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
12pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
8MHz
Mfr. Part #:
9ASC080G0012L
Package:
SMD5032-2P
Key Attributes
Model Number:
9ASC080G0012L
Product Description
Product Overview
The CHANGXING 9ASC080G0012L is a 5.0x3.2x1.2mm SMD Glass Sealing Quartz Crystal Resonator from the 9A Series. Designed for automatic mounting and reflow soldering, it offers high reliability, tight tolerance, and stability. This crystal resonator is an ideal choice for portable PCs, PDAs, DSCs, and USB interface cards, providing a reasonable cost and good delivery performance. It features a Pb content in sealing glass exempted by RoHS directive.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Model: Glass5032 2PIN 8.000000MHz / 9ASC080G0012L
- Series: 9A Series
- Origin: Fujian, China
- Type: Quartz Crystal Resonator
- Sealing: SMD Glass Sealing
- RoHS Exemption: Contains Pb in sealing glass exempted by RoHS directive.
- Marking: LOGO, Nominal Frequency (MHz), Line Code, Last three digits of batch number, Year-Month Code (4-year cycle)
Technical Specifications
| Parameter | Specification | Notes |
|---|---|---|
| Nominal Frequency | 8.000000 MHz | |
| Oscillation Mode | Fund | |
| Load Capacitance | 12 pF | |
| Frequency Tolerance (at 25) | 10 ppm | |
| Frequency Tolerance Over Operating Temp. Range | 30 ppm | |
| Aging (1st Year) | 3 | |
| Drive Level | 100 uW | Max. |
| Operating Temperature | -40 to +85 | |
| Storage Temperature Range | -55 to +125 | |
| Effective Resistance (Rr) | 100 | Max. |
| Shunt Capacitance (C0) | 5 pF | Max. |
| Insulation Resistance | 500 M | Min. at DC 100V |
| Crystal Cutting Type | AT CUT (thickness shear mode) | |
| Dimensions (L x W x H) | 5.0 x 3.2 x 1.2 mm | SMD |
| Reel Quantity | 1,000 pcs per reel | (WHITE) |
Packing
EIA-481-2 Standard Reel Quantity: 1,000 pcs per reel (WHITE)
Reliability Specifications
1. Mechanical Endurance
- Mechanical Shock: MIL-STD-202F, 1000 G, 0.5m sec.
- Vibration: MIL-STD-883E, 10-2000 Hz, 1.52 mm/20G
- Drop Test: JIS C6701, 75 cm height on concrete floor
2. Environmental Endurance
- Resistance To Soldering Heat: MIL-STD-202F, 260 5 for 10 1 sec.
- High Temp & Humidity: JIS C5023, 85, RH 85%, 1000Hrs
- Thermal Shock: MIL-STD-883E, 100 cycles
- High Temp. Storage: MIL-STD-883E, +125 for 1000 12 hours
- Low Temp. Storage: MIL-STD-883E, -40 for 1000 12 hours
- Solderability: MIL-STD-883E, 260 5, 5 1 seconds
- Gross Leak: MIL-STD-883E, Test Pressure: 2Kg / cm
- Fine Leak: MIL-STD-883E, Helium Bombing 4.5 Kgf / cm for 2 hr
Material Composition Declaration
| Part | Material Name | Material Mass (mg) | Material Mass (%) | Constituent Name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|---|
| Base (Ceramics) | Al2O3 | 92.41% | Aluminum oxide | 1344-28-1 | ||
| SiO2 | 4.30% | Silicon oxide | 14808-60-7 | |||
| Cr2O3 | 1.51% | Chromium Oxide | 1308-38-9 | |||
| MgO | 0.69% | Magnesium Oxide | 1309-48-4 | |||
| CaO | 1.09% | Cclcium oxide | 1305-78-8 | |||
| Total Base Mass | 25.446 | 48.15% | ||||
| Adhesive (Polymer) | 0.340 | 0.64% | ||||
| Petroleum solvent | 5.00% | |||||
| Silicone resin | 15.00% | |||||
| Electrode (Metal) | W (Tungsten) | 100.00% | Tungsten | 7440-33-7 | ||
| Au (Gold) | 17.69% | Gold | 7440-57-5 | |||
| Ni (Nickel) | 82.31% | Nickel | 7440-02-0 | |||
| Total Electrode Mass | 0.06 | 0.11% | ||||
| Ag (Silver) | 75.00% | Silver | 7440-22-4 | |||
| Cr (Chromium) | 5.56% | Chromium | 7440-47-3 | |||
| Ag (Silver) | 94.44% | Silver | 7440-22-4 | |||
| Plating (Metal) | PbO (Lead oxide) | 57.29% | Lead oxide | 1317-36-8 | ||
| PbF2 (Lead fluorid) | 19.29% | Lead fluorid | 7783-46-2 | |||
| Bi2O3 (Bismuth oxide) | 5.30% | Bismuth oxide | 1304-76-3 | |||
| Nb2O5 (Niobium oxide) | 4.30% | Niobium oxide | 1313-96-8 | |||
| B2O3 (Boron oxide) | 2.30% | Boron oxide | 1303-86-2 | |||
| ZnO (Zinc oxide) | 2.30% | Zinc oxide | 1314-13-2 | |||
| CuO (Copper oxide) | 1.30% | Copper oxide | 1317-38-0 | |||
| CaO (Cclcium oxide) | 0.30% | Cclcium oxide | 1305-78-8 | |||
| TiO2 (Titanium oxide) | 5.30% | Titanium oxide | 13463-67-7 | |||
| Fe2O3 (Iron oxide) | 2.30% | Iron oxide | 1309-37-1 | |||
| Total Plating Mass | 0.412 | 0.78% | ||||
| Glass Cover (Glass) | Al2O3 | 84.12% | Aluminum oxide | 1344-28-1 | ||
| MnO2 | 2.87% | Manganese oxide | 1313-13-9 | |||
| SiO2 | 2.87% | Silicon oxide | 14808-60-7 | |||
| TiO2 | 5.22% | Titanium oxide | 13463-67-7 | |||
| Cr2O3 | 1.91% | Chromium oxide | 1308-38-9 | |||
| Fe2O3 | 2.06% | Iron oxide | 1309-37-1 | |||
| MgO | 0.48% | Magnesium oxide | 1309-48-4 | |||
| Co3O4 | 0.48% | Cobalt oxide | 1308-06-1 | |||
| Total Glass Cover Mass | 15.248 | 28.85% | ||||
| Quartz Chip | SiO2 | 100.00% | Silicon oxide | 14808-60-7 | ||
| Total Quartz Chip Mass | 1.500 | 2.84% |
2504101957_CHANGXING-ELECTRONICS-9ASC080G0012L_C46613795.pdf
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