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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
9pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
24MHz
Mfr. Part #:
8DSC240G0009L
Package:
SMD3225-4P
Key Attributes
Model Number:
8DSC240G0009L
Product Description
Product Overview
The Seam3225 4PIN 24.000000MHz is a high-precision Quartz Crystal Resonator from CHANGXING ELECTRONICS CO.,LTD. Designed for high frequency stability and excellent EMI reduction, this SMD Seam Sealing Crystal is an ideal choice for Bluetooth, wireless communication sets, DSC, PDA, and mobile phone applications. It is RoHS Compliant and Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Model: Seam3225 4PIN 24.000000MHz
- Customer Part Number: Seam3225
- Product Number: 8DSC240G0009L
- Series: 8D Series
- Sealing Type: Seam Sealing
- Compliance: RoHS Compliant / Pb Free
- Crystal Cutting Type: AT CUT (thickness shear mode)
- Origin: Fujian, China
Technical Specifications
| Parameter | Value | Units | Notes |
|---|---|---|---|
| Nominal Frequency | 24.000000 | MHz | Fund |
| Frequency Tolerance at 25 3 | 10 | ppm | - |
| Load Capacitance | 9 | pF | 0.01100W/Step |
| Frequency Tolerance | 30 | ppm | at DC 100V |
| Pulling Sensitivity (TS) | - | ppm/pF | DLD2 |
| Operating Temperature Range | -40+85 | - | |
| Storage Temperature Range | -55+125 | - | |
| Aging (1st Year) | 3 | ppm | - |
| Drive Level | 100 | uW | Max. |
| Motional Capacitance (C1) | - | fF | DLD2 RLD2 |
| Effective Resistance (Rr) | 40 | Max. | |
| Shunt Capacitance (C0) | 5 | pF | Max. |
| Insulation Resistance | 500 | M | Min. |
| Spurious Response | -3.0 | dB | Max. |
| Dimensions (L x W x H) | 3.2 x 2.5 x 0.7 | mm | SMD |
| Reel Quantity | 3,000 | pcs per reel | (WHITE) |
| Product Weight | 17.322 | mg | - |
Packing
EIA-481-2 Standard Reel Quantity: 3,000 pcs per reel (WHITE)
Material Composition Declaration
| Part | Material Name | Material Mass (mg) | Material Mass (%) | Constituent Name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|---|
| Base | Ceramics | 23.09 | 23.09% | Al2O3 | 1344-28-1 | 92.40% |
| SiO2 | 7631-86-9 | 4.31% | ||||
| Cr2o3 | 1308-38-9 | 1.50% | ||||
| MgO | 1309-48-4 | 0.69% | ||||
| CaO | 1305-78-8 | 1.10% | ||||
| Electrode | Metal | 20.91 | 20.91% | Fe | 7439-89-6 | 47.71% |
| Ni | 7440-02-0 | 26.11% | ||||
| Co | 7440-48-4 | 15.44% | ||||
| Ni (plating) | 7440-02-0 | 10.74% | ||||
| Metalized (Metal) | 6.40 | 6.40% | W | 7440-33-7 | 62.50% | |
| Au | 7440-57-5 | 4.61% | ||||
| Ni | 7440-02-0 | 32.89% | ||||
| Metal | Metal | 3.62 | 3.62% | Ag | 7440-22-4 | 75.00% |
| Ni | 7440-02-0 | 25.00% | ||||
| Polymer | Adhesive | 15.01 | 15.01% | Silicone resin | - | 15.00% |
| Crystalline silicon dioxide | - | 5.00% | ||||
| Petroleum solvent | - | 5.00% | ||||
| Quartz | - | 75.00% | ||||
| Wafer | Quartz | 0.45 | 0.45% | SiO2 | 14808-60-7 | 100.00% |
| Solder | 0.20 | 0.20% | Cr | 7440-47-3 | 5.56% | |
| Ag | 7440-22-4 | 94.44% | ||||
| Base Material (4J29) | 2.60 | 2.60% | - | - | - | |
| Cover | Metallizing | 4.00 | 4.00% | - | - | - |
2504101957_CHANGXING-ELECTRONICS-8DSC240G0009L_C46613751.pdf
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