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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
16MHz
Mfr. Part #:
3ESC160C0033L
Package:
SMD2016-4P
Key Attributes
Model Number:
3ESC160C0033L
Product Description
Product Overview
The CHANGXING ELECTRONICS CO.,LTD. 2.0x1.6mm SMD Crystal Oscillator, model 3ESC160C0033L, is an ultra-small, seam-sealed clock crystal oscillator unit designed for IT products such as WLAN, Bluetooth, DSC, and DSL. It features a CMOS output and a Tri-state function, and is RoHS Compliant / Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Series: 3E Series
- Output Type: CMOS Output
- Certifications: RoHS Compliant / Pb Free
- Packaging: EIA-481-2
- Origin: Fujian, China
Technical Specifications
| Specification | Value | Unit |
|---|---|---|
| Nominal Frequency | 16.000000 | MHz |
| Tolerance @ 25 Degree | 10 | ppm |
| Stability over Operation Temp. | 20 | ppm |
| Operating Temperature Range | -4085 | |
| Storage Temperature Range | -55125 | |
| Input Voltage (VDD) | 1.83.3 | Vdc |
| Input Current (IDD) | 5 | mA max |
| Standby current | 10 | A max |
| Output Load | 15 | pF max |
| Rise/Fall Time | 5010% | ns max |
| Start-up Time | 10 | min ms |
| Jitter (rms) | 5 | ps max |
| Output Voltage VOL | 10%VDD | |
| Output Voltage VOH | 90%VDD | |
| Output Symmetry | 10% | |
| Aging | 3 | ppm/year |
| Dimensions | 2.0 x 1.6 x 0.75 | mm |
| MSL Level | 1 | |
| Fundamental Oscillation mode | 3 |
Marking Scheme
LOGO | Nominal Frequency (MHz) | Line Code | Last Three Digits of Production Batch Code | Year/Month Code
Example: CX16.0 .****
Year/Month Code (Four-year cycle):
| Year | Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 2023, 2027 | a | b | c | d | e | f | g | h | j | k | l | m |
| 2024, 2028 | n | p | q | r | s | t | u | v | w | x | y | z |
| 2025, 2029 | A | B | C | D | E | F | G | H | J | K | L | M |
| 2026, 2030 | N | P | Q | R | S | T | U | V | W | X | Y | Z |
Reflow Condition
Soldering profile:
- Peak: 250+50
- Soldering zone: 230, 3010s
- Pre-heating zone 1: 150180, 9030s
Soldering iron method:
- Bit temperature: 35010
- Application time of soldering iron: 31 s
For other procedures, refer to IEC 60068-2-20.
Reliability Specifications
Standard test condition (TEMP.: 2015. Relative humidity: 6520%). For any discrepancy in GO/NG, test will be done at TEMP. 252. R.H. 655%.
| ITEM | TEST METHOD | SPECIFICATION |
|---|---|---|
| High Temperature Storage | GB/T 2423.2-2001, Method Ba | Spending 72 hrs at 125C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test5ppm. |
| Low Temperature Storage | GB/T 2423.1-2001, Method Aa | Spending 72 hrs at -55C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test5ppm. |
| Humidity | GB/T 2423.3-2006, Method Cab | Spending 96 hrs at 40C 3C, with 903% R.H. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test5ppm. |
| Temperature Cycle | GB/T2423.22-2002, Method Nb | 10 cycles from -25C to 85C. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test5ppm. |
| Resistance to Soldering Heat | GB/T 2423.28-2005, Test Tb Method 1B | Passed through the re-flow oven under the following condition. Preheat to 150 C5C for 60 to 120sec, and peak 265 C5C for 10s3sec. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test5ppm. No visible damages. Terminals shall be covered more than 95% with solder. |
| Solderability | GB/T 2423.28-2005, Method Tc | In 255 5 solder bath for 2 0.5 seconds. No visible damage. |
| Shock | GB/T 2423.5-1995, Method Ea | Peak 1000m/s, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axis of samples, 3 cycles /direction, total 18 cycles. Measurement taken after 1hour. Frequency change after test5ppm. |
| Drop | GB/T 2423.8-1995, Method Ed | Free drop to the wooden plate from 1.0 m heights for 3 times. Frequency change after test5ppm. No visible damages. |
| Vibration | GB/T 2423.10-1995, Method Fc | Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h. 10 cycles in each direction of 3 axis. Measurement taken after 1 hour. Frequency change after test5ppm. |
| Terminal Strength | JIS-C- 6429 Method 1 & 2 | Mount on a glass-epoxy board (100x50x1.6mm), then bend to 2mm displacement (velocity 1mm/sec) and keep for 5 seconds. or pulling force 0.5 kg for at least 60 seconds. Frequency change after test5ppm. No visible damages. |
Material Composition Declaration
| No. | Name of Part | Material Name | Constituent name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|
| 1 | Base | Ceramics | Al2O3 | 1344-28-1 | 63.88% |
| SiO2 | 14464-46-1 | 3.79% | |||
| Cr2o3 | 1308-38-9 | 1.29% | |||
| Mo | 7439-98-7 | 1.00% | |||
| Fe | 7440-33-7 | 9.25% | |||
| Ni | 7439-89-6 | 8.85% | |||
| Co | 7440-02-0 | 4.75% | |||
| 2 | Lid | Kovar | Ag | 7440-48-4 | 2.98% |
| Cu | 7440-22-4 | 2.80% | |||
| Ni | 7440-02-0 | 0.66% | |||
| Fe | 7439-89-6 | 54.00% | |||
| Co | 7440-48-4 | 17.02% | |||
| Ni | 7440-02-0 | 28.32% | |||
| 3 | Adhesive Resin | Epoxy | - | - | 100.00% |
| 4 | Blank | Quartz | SiO2 | 14808-60-7 | 100.00% |
| 5 | Wire | Gold | Au | 7440-57-5 | 100.00% |
| 6 | IC | Silicon | Silicon | 7440-21-3 | 100.00% |
| 7 | Electrode | Electrode | Ag | 7440-22-4 | 100.00% |
| Solder | Solder | Ag | 7440-22-4 | 74.00% | |
| Ethyl alcohol | 64-17-5 | 0.60% | |||
| Bisphenol A-epichlorohydrin polymer | 25068-38-6 | 0.60% | |||
| Xylenes (o-, m-, p-isomers) | 1330-20-7 | 0.60% | |||
| Ethylbenzene | 100-41-4 | 0.06% | |||
| Silicone resin | - | 8.62% | |||
| Silica | - | 8.52% | |||
| Petroleum solvents | - | 7.00% | |||
| Conductive Resin | Epoxy | - | - | 100.00% |
2508051459_CHANGXING-ELECTRONICS-3ESC160C0033L_C48927824.pdf
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