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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
20pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
10MHz
Mfr. Part #:
9ASC100G0020L
Package:
SMD5032-2P
Key Attributes
Model Number:
9ASC100G0020L
Product Description
Product Overview
The Glass5032 2PIN 10.000000MHz 9ASC100G0020L is a quartz crystal resonator designed for automatic mounting and reflow soldering. It features a 2-pad SMD glass-sealed unit with high reliable environmental performance and tight tolerance. This product is ideal for portable PCs, PDAs, DSCs, and USB interface cards, offering a reasonable cost and good delivery performance. It contains Pb in sealing glass, exempted by RoHS directive.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Series: 9A Series
- Product Type: Quartz Crystal Resonator
- Sealing Type: Glass Sealing
- Mounting Type: SMD
- RoHS Exemption: Contains Pb in sealing glass exempted by RoHS directive.
Technical Specifications
| Product Model | Nominal Frequency | Load Capacitance | Frequency Tolerance (at 25) | Frequency Tolerance (Over Operating Temp. Range) | Operating Temperature | Storage Temperature Range | Aging (1st Year) | Drive Level | Effective Resistance (Rr) | Shunt Capacitance (C0) | Insulation Resistance | Dimensions (L x W x H) | Reel Quantity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Glass5032 2PIN 10.000000MHz 9ASC100G0020L | 10.000000 MHz | 20 pF | 10 ppm | 30 ppm | -40+85 | -55+125 | 3 ppm | 100 uW | 60 Max. | 5 pF Max. | 500 M Min. at DC 100V | 5.0 x 3.2 x 1.2 mm | 1,000 pcs per reel |
Dimensions
| L | L1 | W | W1 | A | B | C | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 1801.0 mm | 130.5 mm | 16.50.2 mm | 12.0+1.0 mm | 1.450.1 mm | 5.400.1 mm | 3.600.1 mm | 8.000.1 mm | 12.00.2 mm | 4.000.1 mm | 1.550.05 mm | 1.750.1 mm |
Marking
LOGO, Nominal Frequency (MHz), Line Code, Last three digits of Batch Number, Year-Month Code (4-year cycle).
Reflow Condition
CX10.0 ****
Packing
EIA-481-2 Standard Reel Quantity: 1,000 pcs per reel (WHITE)
Reliability Specifications
| Test Item | Test Methods | Reference Document |
|---|---|---|
| Resistance To Soldering Heat | Pre-heat: 125, 60-120 sec. Test Temp: 2605, 101 sec. | MIL-STD-202F |
| Mechanical Shock | Half sine wave (1000 G), 0.5 msec. duration, 3 axes, 3 times each. | MIL-STD-202F |
| Vibration | 10-2000 Hz, 1.52 mm/20G, 20 min sweep, 4 hours per axis (12 hours total). | MIL-STD-883E |
| Gross Leak | Test Pressure: 2 Kg/cm | MIL-STD-883E |
| Fine Leak | Helium Bombing: 4.5 Kgf/cm for 2 hr | MIL-STD-883E |
| Solderability | Temp: 2605, Immersion depth: 0.5 mm minimum, Immersion time: 51 sec. Flux: Rosin resin methyl alcohol solvent (1:4). | MIL-STD-883E |
| Drop Test | 75 cm height, 3 times on concrete floor. | JIS C6701 |
| High Temp & Humidity | 85 3, RH 85%, 1000 Hrs | JIS C5023 |
| Thermal Shock | 100 cycles of temperature cycle | MIL-STD-883E |
| High Temp. Storage | +125 3 for 1000 12 hours | MIL-STD-883E |
| Low Temp. Storage | -40 3 for 1000 12 hours | MIL-STD-883E |
Material Composition Declaration
| Part Name | Material Name | Material Mass (mg) | Material Mass (%) | Constituent Name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|---|
| Base (Ceramics) | Ceramics | 25.446 | 48.15% | Al2O3 (Aluminum oxide) | 1344-28-1 | 92.41% |
| SiO2 (Silicon oxide) | 14808-60-7 | 4.30% | ||||
| Cr2O3 (Chromium Oxide) | 1308-38-9 | 1.51% | ||||
| MgO (Magnesium Oxide) | 1309-48-4 | 0.69% | ||||
| CaO (Calcium oxide) | 1305-78-8 | 1.09% | ||||
| Metalized | 4.05% | |||||
| Cover (Glass) | Glass | 15.248 | 28.85% | W (Tungsten) | 7440-33-7 | 100.00% |
| Au (Gold) | 7440-57-5 | 17.69% | ||||
| Ni (Nickel) | 7440-02-0 | 82.31% | ||||
| Al2O3 (Aluminum oxide) | 1344-28-1 | 84.12% | ||||
| MnO2 (Manganese oxide) | 1313-13-9 | 2.87% | ||||
| SiO2 (Silicon oxide) | 14808-60-7 | 2.87% | ||||
| TiO2 (Titanium oxide) | 13463-67-7 | 5.22% | ||||
| Cr2O3 (Chromium oxide) | 1308-38-9 | 1.91% | ||||
| Fe2O3 (Iron oxide) | 1309-37-1 | 2.06% | ||||
| MgO (Magnesium oxide) | 1309-48-4 | 0.48% | ||||
| Adhesive (Polymer) | Polymer | 0.340 | 0.64% | Co3O4 (Cobalt oxide) | 1308-06-1 | 0.48% |
| PbO (Lead oxide) | 1317-36-8 | 57.29% | ||||
| PbF2 (Lead fluoride) | 7783-46-2 | 19.29% | ||||
| Bi2O3 (Bismuth oxide) | 1304-76-3 | 5.30% | ||||
| Nb2O5 (Niobium oxide) | 1313-96-8 | 4.30% | ||||
| B2O3 (Boron oxide) | 1303-86-2 | 2.30% | ||||
| ZnO (Zinc oxide) | 1314-13-2 | 2.30% | ||||
| CuO (Copper oxide) | 1317-38-0 | 1.30% | ||||
| CaO (Calcium oxide) | 1305-78-8 | 0.30% | ||||
| TiO2 (Titanium oxide) | 13463-67-7 | 5.30% | ||||
| Fe2O3 (Iron oxide) | 1309-37-1 | 2.30% | ||||
| Electrode (Plating) | Plating | 0.06 | 0.11% | Ag (Silver) | 7440-22-4 | 75.00% |
| Crystalline Silicon Dioxide | - | 5.00% | ||||
| Petroleum solvent | - | 5.00% | ||||
| Silicone resin | - | 15.00% | ||||
| Blank (Quartz) | Quartz | 1.500 | 2.84% | SiO2 (Silicon oxide) | 14808-60-7 | 100.00% |
| Cr (Chromium) | 7440-47-3 | 5.56% | ||||
| Ag (Silver) | 7440-22-4 | 94.44% |
2504101957_CHANGXING-ELECTRONICS-9ASC100G0020L_C46613798.pdf
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