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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
32.768kHz
Mfr. Part #:
3ESC327CK033L
Package:
SMD2016-4P
Key Attributes
Model Number:
3ESC327CK033L
Product Description
Product Overview
The CHANGXING ELECTRONICS CO.,LTD. 2.0x1.6 SMD Crystal Oscillators, 3E Series, are ultra-small, seam-sealed clock crystal oscillator units designed for applications in WLAN, Bluetooth, DSC, DSL, and other IT products. They feature CMOS output and an optional tri-state function, adhering to RoHS compliance and Pb-Free standards. These oscillators are suitable for a wide operating temperature range and offer a nominal frequency of 32.768000KHz.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Series: 3E Series
- Product Type: SMD Crystal Oscillators
- Output Type: CMOS Output
- Compliance: RoHS Compliant / Pb Free
- Origin: Fujian Province, China
- Certifications: EIA-481-2 (Packing)
Technical Specifications
| Specification | Value | Unit |
|---|---|---|
| Model Number | 3ESC327CK033L | |
| Nominal Frequency | 32.768000 | KHz |
| Dimensions | 2.0 x 1.6 x 0.75 | mm |
| Input Voltage (VDD) | 1.83.3 | Vdc |
| Standby current | 10 | A max |
| Input Current (IDD) | 5 | mA max |
| Tolerance @ 25 Degree | 10 | KHz |
| Stability over Operation Temp. | 20 | ppm |
| Aging | 3 | ppm/year |
| Operating Temperature Range | -4085 | |
| Storage Temperature Range | -55125 | |
| Start-up Time | 10 | ms max |
| Rise/Fall Time | 5 | ns max |
| Output Load | 15 | pF max |
| Jitter (rms) | 50 | ps max |
| Output Voltage VOL | 10%VDD | |
| Output Voltage VOH | 90%VDD | |
| Output State Control | Enable/disable | |
| Fundamental Oscillation mode | 3 | |
| MSL Level | 1 | |
| Production Weight | 8.144 | mg |
Marking Information
LOGO
- Nominal Frequency (KHz)
- Line Code
- Last three digits of Production Batch Code
- Year-Month Code (4-year cycle)
Reflow Condition
- Solder profile: Peak: 250+50, Soldering zone: 230 for 3010s, Pre-heating zone 1: 150180 for 9030s.
- Soldering iron method: Bit temperature: 35010, Application time: 31 s.
Packing
EIA-481-2 standard for tape (carrier) dimensions.
Reliability Specifications
Standard test condition (TEMP.: 2015. Relative humidity: 6520%). For any discrepancy in GO/NG, test will be done at TEMP.252. R.H. 655%.
| Item | Test Method | Specification | Frequency Change After Test |
|---|---|---|---|
| High Temperature Storage | GB/T 2423.2-2001, Method Ba (72 hrs at 125C3C) | No visible damages. | 5ppm |
| Low Temperature Storage | GB/T 2423.1-2001, Method Aa (72 hrs at -55C3C) | No visible damages. | 5ppm |
| Humidity | GB/T 2423.3-2006, Method Cab (96 hrs at 40 C 3 C, 90 3% R.H.) | No visible damages. | 5ppm |
| Temperature Cycle | GB/T2423.22-2002, Method Nb (10 cycles from -25C to 85C) | No visible damages. | 5ppm |
| Shock | GB/T 2423.5-1995, Method Ea (Peak 1000m/s, 6ms half sine wave, 3.7m/s, 3 perpendicular axes, 3 cycles/direction, total 18 cycles) | No visible damages. | 5ppm |
| Drop | GB/T 2423.8-1995, Method Ed (Free drop from 1.0 m heights for 3 times) | No visible damages. | 5ppm |
| Vibration | GB/T 2423.10-1995, Method Fc (0.75mm vibration at sweep frequency 10500 Hz, for 2h, 10 cycles in each direction of 3 axes) | No visible damages. | 5ppm |
| Resistance to Soldering Heat | GB/T 2423.28-2005, Test Tb Method 1B (In 255 5 solder bath for 2 0.5 seconds) | Terminals shall be covered more than 95% with solder. No visible damage. | 5ppm |
| Solderability | GB/T 2423.28-2005, Method Tc (In 255 5 solder bath for 2 0.5 seconds) | Terminals shall be covered more than 95% with solder. No visible damage. | N/A |
| Terminal Strength | JIS-C-6429 Method 1 & 2 (Mount on glass-epoxy board, bend to 2mm displacement or pulling force 0.5 kg for 60 seconds) | No visible damages. | 5ppm |
Material Composition Declaration
| No. | Name of Part | Material Name | Constituent name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|
| 1 | Base | Ceramics | Al2O3 | 1344-28-1 | 63.88% |
| SiO2 | 14464-46-1 | 3.79% | |||
| Cr2o3 | 1308-38-9 | 1.29% | |||
| Mo | 7439-98-7 | 1.00% | |||
| Fe | 7440-33-7 | 9.25% | |||
| Ni | 7439-89-6 | 8.85% | |||
| Co | 7440-02-0 | 4.75% | |||
| 2 | Lid | Kovar | Ag | 7440-50-8 | 2.98% |
| Cu | 7440-22-4 | 2.80% | |||
| W | 7440-50-8 | 1.04% | |||
| Au | 7440-02-0 | 0.24% | |||
| 3 | Adhesive Resin | Epoxy | Ni | 7440-57-5 | 0.13% |
| Fe | 3ESC160C0033L | 54.00% | |||
| Co | 7440-48-4 | 17.02% | |||
| Ni | 7440-02-0 | 28.32% | |||
| Ni (plating) | 7440-02-0 | 0.66% | |||
| 4 | Blank Chip | Quartz | SiO2 | 14808-60-7 | 100.00% |
| 5 | Wire | Gold | Au | 7440-57-5 | 100.00% |
| 6 | IC | Silicon | Silicon | 7440-21-3 | 100.00% |
| 7 | Electrode | Electrode | Ag | 7440-22-4 | 74.00% |
| Ethyl alcohol | 64-17-5 | 0.60% | |||
| Bisphenol A-epichlorohydrin polymer | 25068-38-6 | 0.60% | |||
| Xylenes (o-, m-, p-isomers) | 1330-20-7 | 0.60% | |||
| Ethylbenzene | 100-41-4 | 0.06% | |||
| Silicone resin | - | 8.62% | |||
| Silica | - | 8.52% | |||
| Petroleum solvents | - | 7.00% | |||
| Ni | 7440-02-0 | 0.13% | |||
| Ag | 7440-22-4 | 100.00% |
2508051500_CHANGXING-ELECTRONICS-3ESC327CK033L_C48927834.pdf
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