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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
24MHz
Mfr. Part #:
8ESC240C0033L
Package:
SMD3225-4P
Key Attributes
Model Number:
8ESC240C0033L
Product Description
Product Overview
The CHANGXING ELECTRONICS CO.,LTD. 8ESC240C0033L is a 3.2x2.5mm SMD Quartz Crystal Oscillator with CMOS Output, designed for applications in WLAN, Bluetooth, DSC, DSL, and other IT products. It features an ultra-small seam-sealed design and an available tri-state function. This product is RoHS Compliant and Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Type: Quartz Crystal Oscillator
- Series: 8E Series
- Output Type: CMOS Output
- Certifications: RoHS Compliant / Pb Free
- Origin: Fujian, China
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Product Model | 8ESC240C0033L | ||
| Nominal Frequency | 24.000000 | MHz | |
| Tolerance @ 25 Degree | 10 | ppm | |
| Stability over Operation Temp. | 20 | ppm/year | |
| Operating Temperature Range | -4085 | ||
| Storage Temperature Range | -55125 | ||
| Supply Voltage (Vdd) | 1.8V3.3 | Vdc | |
| Supply Current (Icc) | 5 | mA max | |
| Standby current | 8 | A max | |
| Output State Control | Enable/disable | ||
| Rise/Fall Time | 5 | ns max | |
| Output Load | 15 | pF max | |
| Output Symmetry | 10%VDD | 90%VDD | |
| Start-up Time | 5 | ms max | |
| Phase Jitter(12KHz20MHz) | 5010% | ps max | |
| Fundamental Oscillation mode | Level 1 | ||
| Aging | 3 | ppm | |
| Enable Voltage High | 70%Vdd | min | |
| Disable Voltage Low | 30%Vdd | max | |
| Dimensions | 3.2 x 2.5 x 1.0mm | SMD | |
| Product Weight | 29.568 | mg |
Packing Information
Packing follows EIA-481-2 standards using TAPE (CARRIER) DIMENSIONS.
Reliability Specifications
Standard test conditions: TEMP.: 2015. Relative humidity: 6520%. For any discrepancy in GO/NG, tests are performed at TEMP. 252, R.H. 655%.
| Item | Test Method | Specification |
|---|---|---|
| Solderability | GB/T 2423.28-2005, Method Tc | Terminals shall be covered more than 95% with solder. No visible damage. |
| Resistance to Soldering Heat | GB/T 2423.28-2005, Test Tb Method 1B | Frequency change after test 5ppm. No visible damages. |
| Terminal Strength | JIS-C-6429 Method 1 & 2 | Frequency change after test 5ppm. No visible damages. |
| Temperature Cycle | GB/T2423.22-2002, Method Nb | 10 cycles from -25C to 85C. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test 5ppm. |
| High Temperature Storage | GB/T 2423.2-2001, Method Ba | Spending 72 hrs at 125C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test 5ppm. |
| Low Temperature Storage | GB/T 2423.1-2001, Method Aa | Spending 72 hrs at -55C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test 5ppm. |
| Humidity | GB/T 2423.3-2006, Method Cab | Spending 96 hrs at 40 C 3 C, with 90 3% R.H. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test 5ppm. |
| Drop | GB/T 2423.8-1995, Method Ed | Free drop to the wooden plate from 1.0 m heights for 3 times. Frequency change after test 5ppm. |
| Vibration | GB/T 2423.10-1995, Method Fc | Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h. 10 cycles in each direction of 3 axis. Measurement taken after 1 hour. Frequency change after test 5ppm. |
| Shock | GB/T 2423.5-1995, Method Ea | Peak 1000m/s2, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axis of samples, 3 cycles /direction, total 18 cycles. Measurement taken after 1 hour. Frequency change after test 5ppm. |
Material Composition Declaration
| No. | Name of Part | Material Name | Constituent name | CAS No. | Material Analysis (%) | |
|---|---|---|---|---|---|---|
| 1 | Base | Ceramics | Al2O3 | 1344-28-1 | 63.88% | |
| SiO2 | 14464-46-1 | 3.79% | ||||
| Cr2o3 | 1308-38-9 | 1.29% | ||||
| Mo | 7439-98-7 | 1.00% | ||||
| Fe | 7440-33-7 | 9.25% | ||||
| Ni | 7439-89-6 | 8.85% | ||||
| Co | 7440-02-0 | 4.75% | ||||
| Ag | 7440-48-4 | 2.98% | ||||
| Cu | 7440-22-4 | 2.80% | ||||
| Metallization | W | 7440-50-8 | 1.04% | |||
| Au | 7440-02-0 | 0.24% | ||||
| Ni | 7440-57-5 | 0.13% | ||||
| Pin | Solder | Fe | 7439-89-6 | 54.00% | ||
| Co | 7440-48-4 | 17.02% | ||||
| Ni | 7440-02-0 | 28.32% | ||||
| Plating | Ni (plating) | Ni | 7440-02-0 | 0.66% | ||
| 2 | Lid | Kovar | Adhesive Resin | - | 100.00% | |
| 3 | Epoxy | Conductive Resin | Quartz | SiO2 | 14808-60-7 | 100.00% |
| 4 | Blank | Silicon oxide | 14808-60-7 | 100.00% | ||
| 5 | Wire | Gold | Au | 7440-57-5 | 100.00% | |
| 6 | IC | Silicon | Silicon | 7440-21-3 | 100.00% | |
| 7 | Electrode | Electrode | Ag | 7440-22-4 | 100.00% | |
| Silver | Silver | 7440-22-4 | 74.00% | |||
| Ethyl alcohol | 64-17-5 | 0.60% | ||||
| Bisphenol A-epichlorohydrin polymer | 25068-38-6 | 0.60% | ||||
| Xylenes (o-, m-, p-isomers) | 1330-20-7 | 0.60% | ||||
| Ethylbenzene | 100-41-4 | 0.06% | ||||
| Silicone resin | - | 8.62% | ||||
| Silica | - | 8.52% | ||||
| Petroleum solvents | - | 7.00% |
2512081627_CHANGXING-ELECTRONICS-8ESC240C0033L_C48927811.pdf
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