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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
12pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
27.12MHz
Mfr. Part #:
8DSC271G0012L
Package:
SMD3225-4P
Key Attributes
Model Number:
8DSC271G0012L
Product Description
Product Overview
The Seam3225 is a high-precision Quartz Crystal Resonator designed for demanding applications. It offers excellent frequency stability and is optimized for reducing EMI effects, making it an ideal choice for Bluetooth devices, wireless communication sets, DSCs, PDAs, and mobile phones. This product is RoHS Compliant and Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Series: 8D Series
- Product Type: Quartz Crystal Resonator
- Sealing Type: Seam Sealing
- Compliance: RoHS Compliant / Pb Free
- Crystal Cutting Type: AT CUT (thickness shear mode)
Technical Specifications
| Parameter | Model: DLD2 (Low) | Model: DLDH2 - DLDH2 | Model: DLDF - DLDF | Model: Others | Units | Notes |
|---|---|---|---|---|---|---|
| Nominal Frequency | 27.120000 | MHz | ||||
| Frequency Tolerance (at 25 3 ) | 10 | ppm | ||||
| Load Capacitance | 12 | pF | ||||
| Frequency Tolerance | 30 | ppm | at DC 100V | |||
| Operating Temperature Range | -40+85 | |||||
| Storage Temperature Range | -55+125 | |||||
| Aging (1st Year) | 3 | ppm | ||||
| Drive Level | 100 | uW | ||||
| Shunt Capacitance (C0) | 5 | pF | Max. | |||
| Motional Capacitance (C1) | 0.01100W/Step | fF | ||||
| Effective Resistance (Rr) | 40 | Max. | 10 | Max. | ||
| Pulling Sensitivity (TS) | 40 | Max. | ppm/pF | |||
| Spurious Response | -3.0 | dB | ||||
| Insulation Resistance | 500 | Min. | M | |||
| Over Operating Temp. Range | -1000+5000 | ppm | ||||
| Dimensions (L x W x H) | 3.400.1 x 2.700.1 x 1.400.1 | mm | ||||
| Reel Quantity | 3,000 pcs per reel (WHITE) | pcs |
| Dimension | Value | Unit |
|---|---|---|
| L | 3.40 | 0.1 mm |
| W | 2.70 | 0.1 mm |
| H | 1.40 | 0.1 mm |
| L1 | 4.00 | 0.1 mm |
| W1 | 4.00 | 0.11 mm |
| A | 1.55 | 0.05 mm |
| B | 1.75 | 0.1 mm |
| C | 8.0 | 0.2 mm |
| D | 4.00 | 0.1 mm |
| E | 178 | 1.0 mm |
| F | 13 | 0.5 mm |
| G | 11.5 | 0.2 mm |
| H | 8.0 | +1.0 mm |
Marking
LOGO, MHz, , ,
Reflow Condition
Pre-heat temperature: 125 (Total test time 12 hours)
Pre-heat time: 60 120 sec.
Test temperature: 260 5
Test time: 10 1 sec.
Packing
(EIA-481-2) Standard Reel Quantity: 3,000 pcs per reel (WHITE)
Reliability Specifications
Mechanical Endurance
- Vibration: Perpendicular axes, 10 2000 Hz, Amplitude 1.52 mm/20G, Sweep time 20 minute (4 hours each axis)
- Mechanical Shock: Half sine wave (1000 G), 0.5m sec. duration time (3 times each of three mutually perpendicular axes)
- Drop Test: 150 cm height, 3 times on concrete floor
- Solderability: Flux Rosin resin methyl alcohol solvent (1:4), Immersion time 5 1 seconds
Environmental Endurance
- High Temp & Humidity: 85 3, RH 85%, 500Hrs
- Low Temp. Storage: -40 3 for 500 12 hours
- Thermal Shock: Total 100 cycles of temperature cycle (+125 3 for 500 12 hours)
- Pressure Cooker Storage: 125 3, RH100%, 2 bar, 240Hrs
- Resistance To Soldering Heat: 260 5
- High Temp. Storage: 260 5, Immersing depth 0.5 mm minimum
- Helium Bombing: 4.5 Kgf / cm2 for 2 hr
- Gross Leak Test: Test Pressure: 2Kg / cm2
- Fine Leak Test: (Standard Sample For Automatic Gross Leak Detector)
Material Composition Declaration
| No. | Name of Part | Material Name | Material Mass(mg) | Material mass (%) | Constituent name | CAS No. | Material Analysis(%) |
|---|---|---|---|---|---|---|---|
| 1 | Base | Ceramics | 23.09% | Al2O3 | 1344-28-1 | 92.40% | |
| SiO2 | 7631-86-9 | 4.31% | |||||
| Cr2o3 | 1308-38-9 | 1.50% | |||||
| MgO | 1309-48-4 | 0.69% | |||||
| CaO | 1305-78-8 | 1.10% | |||||
| 2 | Cover | Metallizing | 36.95% | Fe | 7439-89-6 | 47.71% | |
| Ni | 7440-02-0 | 26.11% | |||||
| Co | 7440-48-4 | 15.44% | |||||
| 3 | Adhesive | Polymer | 15.01% | Ni | 7440-02-0 | 10.74% | |
| Ag | 7440-22-4 | 75.00% | |||||
| SiO2 | 14808-60-7 | 5.00% | |||||
| Silicone resin | 5.00% | ||||||
| Petroleum solvent | 5.00% | ||||||
| 4 | Wafer | Quartz | 0.45 | 2.60% | SiO2 | 100.00% | |
| 5 | Electrode | Metal | 0.20 | 1.15% | Cr | 7440-47-3 | 5.56% |
| Ag | 7440-22-4 | 94.44% | |||||
| 6 | Solder | Metal | 20.91% | W | 7440-33-7 | 62.50% | |
| Au | 7440-57-5 | 4.61% | |||||
| Ni | 7440-02-0 | 32.89% | |||||
| Fe | 7439-89-6 | 40.70% | |||||
| Ni | 7440-02-0 | 21.80% | |||||
| Co | 7440-48-4 | 12.80% | |||||
| Ag | 7440-22-4 | 21.00% | |||||
| Cu | 7440-50-8 | 3.70% |
2504101957_CHANGXING-ELECTRONICS-8DSC271G0012L_C46613766.pdf
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