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quality CMOS output crystal oscillator CHANGXING ELECTRONICS 3ESC320C0033L 32 MHz frequency RoHS compliant Pb free factory
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quality CMOS output crystal oscillator CHANGXING ELECTRONICS 3ESC320C0033L 32 MHz frequency RoHS compliant Pb free factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
32MHz
Mfr. Part #:
3ESC320C0033L
Package:
SMD2016-4P
Key Attributes
Model Number: 3ESC320C0033L
Product Description

Product Overview

The CHANGXING ELECTRONICS CO.,LTD. 2.0x1.6mm SMD Crystal Oscillators, 3E Series, are ultra-small, seam-sealed clock crystal oscillator units designed for IT product applications including WLAN, Bluetooth, DSC, and DSL. These oscillators feature CMOS output and offer a tri-state function. They are RoHS Compliant and Pb Free.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Origin: Fujian Province, China
  • Series: 3E Series
  • Output Type: CMOS
  • Compliance: RoHS Compliant / Pb Free
  • Sealing: Seam sealed
  • MSL Level: 1

Technical Specifications

Specification Value Unit Notes
Nominal Frequency 32.000000 MHz
Tolerance @ 25 Degree 10 ppm
Stability over Operation Temp. 20 ppm
Operating Temperature Range -40 to 85
Storage Temperature Range -55 to 125
Input Voltage (VDD) 1.8 to 3.3 Vdc
Input Current (IDD) 5 A max
Standby current 10 A max
Output State Control Enable/disable
Rise/Fall Time 5 ns max at 10%VDD
Output Voltage VOL 90%VDD
Output Voltage VOH 10%VDD
Output Load 15 pF max
Output Waveform COMS
Output Symmetry 5010%
Start-up Time 10 ms max
Jitter (rms) ps
Aging 3 ppm/year
Dimensions 2.0 x 1.6 x 0.75 mm
Model 3ESC320C0033L
Product No. 2.0x1.6 OSC 32.000000MHz
Production Weight 8.144 mg

Reflow Condition: Peak: 250+50, Soldering zone: 230 or more, 3010s. Pre-heating zone 1: 150180, 9030s.

Soldering iron method: Bit temperature: 35010, Application time of soldering iron: 3+1 s. For other procedures, refer to IEC 60068-2-20.

Reliability Specifications: Includes tests for Solderability, Terminal Strength, High Temperature Storage, Low Temperature Storage, Humidity, Temperature Cycle, Shock, Drop, Vibration, and Resistance to Soldering Heat. Frequency change after tests typically 5ppm.

Material Composition Declaration: Details base material (Ceramics), metallization (Tungsten, Gold, Nickel, Iron, Cobalt, Silver, Copper), blank (Quartz), wire (Gold), IC (Silicon), and electrodes (Silver).


2508051500_CHANGXING-ELECTRONICS-3ESC320C0033L_C48927830.pdf

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