Product Overview
The 5.0x3.2 SEAM 4PIN Quartz Crystal Resonator, model 9DSC080G0012L, is a high-precision and high-frequency stability component designed for demanding applications. It offers excellent performance in reducing EMI effects and is an ideal choice for Bluetooth, wireless communication sets, DSC, PDA, and mobile phone USB interface cards. This product is RoHS Compliant and Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Type: Quartz Crystal Resonator
- Series: 9D Series (SMD SEAM Sealing Crystals)
- Compliance: RoHS Compliant / Pb Free
- Origin: Fujian Province, China
Technical Specifications
| Parameter | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 8.000000 | MHz | |
| Load Capacitance | 12 | pF | |
| Frequency Tolerance (at 25) | 30 | ppm | |
| Frequency Tolerance (Over Operating Temp. Range) | 3 | ppm | |
| Operating Temperature | -40+85 | ||
| Storage Temperature Range | -55+125 | ||
| Aging (1st Year) | 3 | ppm | |
| Drive Level | 100 | uW | Max. |
| Effective Resistance (Rr) | 100 | Max. | |
| Shunt Capacitance (C0) | 5 | fF | Max. |
| Motional Capacitance (C1) | 125 | fF | |
| Pulling Sensitivity (TS) | -1000+5000 | ppm | |
| Insulation Resistance | 500 | M | Min. at DC 100V |
| Spurious Response | -3.0 | dB | Max. |
| Oscillation Mode | Fund | - | at 25 3 |
| Crystal cutting type | AT CUT (thickness shear mode) | - | |
| Dimensions (L x W x H) | 5.0 x 3.2 x 0.9 | mm | |
| Reel Quantity | 1,000 | pcs per reel | (WHITE) |
| Product Weight | 41.070 | mg |
Marking
The marking includes: CHANGXING ELECTRONICS LOGO, Nominal Frequency (MHz), Line Code, Last three digits of Production Batch Number, Year-Month Code (four-year cycle).
Reflow Condition
Pre-heat temperature: 125 ; Pre-heat time: 60 120 sec; Test temperature: 260 5 ; Test time: 10 1 sec.
Packing
EIA-481-2 standard reel packaging.
Reliability Specifications
Includes Mechanical Endurance (Shock Test, Vibration, Mechanical Shock, Drop Test, Solderability) and Environmental Endurance (Low Temp. Storage, Thermal Shock, High Temp. Storage, Pressure Cooker Storage, High Temp & Humidity, Helium Bombing, Resistance To Soldering Heat).
Material Composition Declaration
| Name of Part | Material Name | Material Mass (mg) | Material Mass (%) | Constituent Name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|---|
| Base | Ceramics (4J29) | 7.58 | 18.44% | Aluminum oxide | 1344-28-1 | 100.00% |
| Cover | Metalized (Metal) | 7.67 | 18.68% | Fe-Co-Ni / W | 88.51% W, 9.43% Ni, 2.06% Au | |
| Electrode | Electrode | 0.20 | 0.49% | Ni | 7440-02-0 | 100.00% |
| Adhesive | Polymer | 0.50 | 1.22% | Ag | 7440-22-4 | 75.00% |
| - | Silicone resin | - | - | Silica | 5.00% | |
| - | Petroleum solvent | - | - | - | 5.00% | |
| - | Silicone resin | - | - | - | 15.00% | |
| Quartz wafer | Quartz | 1.50 | 3.65% | Silicon oxide | 14808-60-7 | 100.00% |
| - | - | - | - | Cr | 7440-47-3 | 5.56% |
| - | - | - | - | Ag | 7440-22-4 | 94.44% |
| KV ring | Metal | 6.44 | 15.69% | Fe-Co-Ni | 100.00% | |
| - | - | - | - | Ni | 7440-02-0 | 48.45% |
| - | - | - | - | Co | 7440-48-4 | 26.11% |
| - | - | - | - | Ni | 7440-02-0 | 15.44% |
| - | - | - | - | Ni (plating) | 7440-02-0 | 10.00% |
2509221035_CHANGXING-ELECTRONICS-9DSC080G0012L_C46613788.pdf
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