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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
12pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
20MHz
Mfr. Part #:
8DSC200G0012L
Package:
SMD3225-4P
Key Attributes
Model Number:
8DSC200G0012L
Product Description
Product Overview
The Seam3225 is a high-precision Quartz Crystal Resonator from CHANGXING ELECTRONICS CO.,LTD., designed for applications requiring high frequency stability and excellent EMI reduction. This SMD Seam Sealing Crystal, part of the 8D Series, is an ideal choice for Bluetooth devices, wireless communication sets, DSCs, PDAs, and mobile phones. It is RoHS Compliant and Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Model: Seam3225 4PIN
- Series: 8D Series
- Crystal Type: AT CUT (thickness shear mode)
- Sealing Type: Seam Sealing
- Compliance: RoHS Compliant / Pb Free
Technical Specifications
| Parameter | Value | Units | Notes |
|---|---|---|---|
| Nominal Frequency | 20.000000 | MHz | |
| Load Capacitance | 12 | pF | |
| Frequency Tolerance (at 25 3) | 10 | ppm | |
| Frequency Tolerance (Standard) | 30 | ppm | |
| Operating Temperature Range | -40+85 | ||
| Storage Temperature Range | -55+125 | ||
| Aging (1st Year) | 3 | ppm | |
| Drive Level | 100 | uW | Max. |
| Shunt Capacitance (C0) | 5 | pF | Max. |
| Effective Resistance (Rr) | 40 | Max. | |
| Insulation Resistance | 500 | M | Min. at DC 100V |
| Pulling Sensitivity (TS) | 125 | ppm/pF | |
| Spurious Response | -3.0 | dB | |
| Over Operating Temp. Range | -1000+5000 | ppm | |
| Dimensions (L x W x H) | 3.2 x 2.5 x 0.7 | mm | |
| Reel Quantity | 3,000 | pcs per reel | (WHITE) |
| Product Weight | 17.322 | mg |
Dimensions
| Dimension | Value | Unit |
|---|---|---|
| A | 1.40 | 0.1 mm |
| B | 3.40 | 0.1 mm |
| C | 2.70 | 0.1 mm |
| D | 4.00 | 0.1 mm |
| E | 8.0 | 0.2 mm |
| F | 4.00 | 0.11 mm |
| G | 1.55 | 0.05 mm |
| H | 1.75 | 0.1 mm |
| L | 178 | 1.0 mm |
| L1 | 13 | 0.5 mm |
| W | 11.5 | 0.2 mm |
| W1 | 8.0 | +1.0 mm |
Marking
LOGO, MHz, , ,
Reflow Condition
Refer to document CX20.0 ****
Packing
(EIA-481-2)
Reliability Specifications
1. Mechanical Endurance
- Vibration: 10 2000 Hz, Amplitude 1.52 mm/20G, Sweep time 20 minute (JIS C6701)
- Drop Test: 150 cm height, 3 times on concrete floor (IEC-68-02-27)
- Mechanical Shock: Half sine wave (1000 G), 0.5 m sec. duration time, three mutually perpendicular axes each 3 times (MIL-STD-202F)
- Resistance To Soldering Heat: Pre-heat time 60 120 sec., Pre-heat temperature 125 , Test temperature 260 5 , Test time 10 1 sec. (MIL-STD-883E)
- Solderability: Flux Rosin resin methyl alcohol solvent (1:4), Immersion time 5 1 seconds (JIS C6701)
2. Environmental Endurance
- High Temp & Humidity: 85 3, RH 85%, 500Hrs (JIS C5023)
- Low Temp. Storage: -40 3 for 500 12 hours (MIL-STD-883E)
- Thermal Shock: Total 100 cycles of temperature cycle +125 3 for 500 12 hours (MIL-STD-883E)
- Pressure Cooker Storage: 125 3, RH 100%, 2 bar, 240Hrs (MIL-STD-883E)
- High Temp. Storage: 125 (Total test time 12 hours)
- Helium Bombing: 4.5 Kgf / cm2 for 2 hr (MIL-STD-883E)
- Fine Leak: Test Pressure: 2Kg / cm2 (Standard Sample For Automatic Gross Leak Detector)
- Gross Leak Test: Test temperature 260 5, Immersing depth 0.5 mm minimum (MIL-STD-883E)
- Shock Test: 150g/150cm Height, 3 times in the direction of X, Y, Z on concrete floor (MIL-STD-202F)
Material Composition Declaration
| Part Name | Material Name | Material Mass (mg) | Material Mass (%) | Constituent Name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|---|
| (Wafer) | (Ceramics) | Al2O3 (Aluminum oxide) | 1344-28-1 | 92.40% | ||
| SiO2 (Silicon oxide) | 7631-86-9 | 4.31% | ||||
| Cr2o3 (Chromium oxide) | 1308-38-9 | 1.50% | ||||
| MgO (Magnesium oxide) | 1309-48-4 | 0.69% | ||||
| CaO (Calcium oxide) | 1305-78-8 | 1.10% | ||||
| (Metalizing) | (Metal) | Fe (Iron) | 7439-89-6 | 40.70% | ||
| Ni (Nickel) | 7440-02-0 | 21.80% | ||||
| Co (Cobalt) | 7440-48-4 | 12.80% | ||||
| Ag (silver) | 7440-22-4 | 21.00% | ||||
| Cu | 7440-50-8 | 3.70% | ||||
| (Electrode) | (Metal) | W (Tungsten) | 7440-33-7 | 62.50% | ||
| Au (Gold) | 7440-57-5 | 4.61% | ||||
| Ni (Nickel) | 7440-02-0 | 32.89% | ||||
| Fe (Iron) | 7439-89-6 | 47.71% | ||||
| (Plating) | Ni (Nickel) | Ni (Nickel) | 7440-02-0 | 26.11% | ||
| Co (Cobalt) | 7440-48-4 | 15.44% | ||||
| (Plating) | Ni (Plating) | Ni (Nickel) | 7440-02-0 | 10.74% | ||
| (Solder) | (Metal) | Ag (Silver) | 7440-22-4 | 75.00% | ||
| (Base) | (Ceramics) | SiO2 (Silicon oxide) | 14808-60-7 | 100.00% | ||
| (Adhesive) | (Polymer) | (Petroleum solvent) | 5.00% | |||
| (Silicone resin) | 15.00% | |||||
| (Crystalline silica) | 5.00% | |||||
| (Cover) | 4J29 (Base Material) | Cr (Chromium) | 7440-47-3 | 5.56% | ||
| Ag (Silver) | 7440-22-4 | 94.44% |
2504101957_CHANGXING-ELECTRONICS-8DSC200G0012L_C46613749.pdf
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