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quality SMD Glass Sealing Crystal Resonator CHANGXING ELECTRONICS 9ASC080G0020L 8 MHz for USB Interface Cards factory
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quality SMD Glass Sealing Crystal Resonator CHANGXING ELECTRONICS 9ASC080G0020L 8 MHz for USB Interface Cards factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
20pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
8MHz
Mfr. Part #:
9ASC080G0020L
Package:
SMD5032-2P
Key Attributes
Model Number: 9ASC080G0020L
Product Description

Product Overview

The CHANGXING 9ASC080G0020L is a 5.0x3.2x1.2mm SMD Glass Sealing Crystal Resonator from the 9A Series. Designed for automatic mounting and reflow soldering, these units offer high reliability, environmental performance, and tight tolerance with stability. They are an ideal choice for portable PCs, PDAs, DSCs, and USB interface cards, featuring a Pb content in sealing glass exempted by RoHS directive.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Product Series: 9A Series
  • Product Type: Quartz Crystal Resonator
  • Sealing Type: Glass Sealing
  • Mounting Type: SMD
  • RoHS Exemption: Contains Pb in sealing glass exempted by RoHS directive.
  • Origin: Fujian, China

Technical Specifications

Parameter Model/Value Notes
Nominal Frequency 8.000000 MHz Fund
Product Model 9ASC080G0020L Glass5032 2PIN
Dimensions 5.0 x 3.2 x 1.2 mm SMD
Operating Temperature Range -40 to +85
Storage Temperature Range -55 to +125
Frequency Tolerance (at 25 ) 10 ppm Load Capacitance 20 pF
Frequency Tolerance (Over Operating Temp. Range) 30 ppm
Aging (1st Year) 3 ppm Max.
Drive Level 100 uW Max.
Effective Resistance (Rr) 100 Max.
Shunt Capacitance (C0) 5 pF Max.
Insulation Resistance 500 M Min. at DC 100V
Pulling Sensitivity (TS) 5 ppm/pF Max.
Spurious Response -3.0 dB Max.
Crystal cutting type AT CUT (thickness shear mode)
Standard Reel Quantity 1,000 pcs per reel (WHITE)
Product Weight 52.850 mg
Base Material Ceramics 48.15%
Cover Material Glass 28.85%
Electrode Material Metal (Ag, Cr) 0.11%
Adhesive Material Polymer 0.64%
Plating Material Metal (Au, Ni) 0.78%
Chip Material Quartz 2.84%

2504101957_CHANGXING-ELECTRONICS-9ASC080G0020L_C46613796.pdf

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