Product Overview
The Seam2016 is a miniature SMD Quartz Crystal Resonator from Changxing Electronics, designed for high precision and frequency stability. Its excellent heat resistance and environmental characteristics make it suitable for applications in PDAs, DSCs, DVCs, and PCs. This product is RoHS Compliant and Pb Free.
Product Attributes
- Brand: Changxing Electronics
- Model: Seam2016
- Series: 3D Series
- Type: Quartz Crystal Resonator
- Sealing: Seam Sealing
- Compliance: RoHS Compliant / Pb Free
- Crystal Cutting Type: AT CUT (thickness shear mode)
Technical Specifications
| Parameter | Value | Units | Notes |
|---|---|---|---|
| Nominal Frequency | 16.000000 | MHz | |
| Frequency Tolerance (@25 3) | 10 | ppm | |
| Load Capacitance | 12 | pF | |
| Operating Temperature | -40+85 | ||
| Aging (1st Year) | 3 | ppm | |
| Over Operating Temp. Range | 30 | ppm | |
| Effective Resistance (Rr) | 150 | Max. | |
| Motional Capacitance (C1) | 10 | Max. fF | |
| Shunt Capacitance (C0) | 5 | Max. pF | |
| Insulation Resistance | 500 | Min. M | at DC 100V |
| Drive Level | 100 | uW | |
| Pulling Sensitivity (TS) | 0.0130W/15 steps | ppm/pF | |
| Spurious Response | -3.0 | dB | |
| Storage Temperature Range | -55+125 | ||
| Dimensions (L x W x H) | 2.0 x 1.6 x 0.50 | mm | SMD Type |
| Reel Quantity | 3,000 | pcs per reel | (WHITE) |
| Production Weight | 6.144 | mg |
Marking
Changxing Electronics LOGO, Nominal Frequency (MHz), Line Code, Last three digits of Batch Number, Year-Month Code (4-year cycle).
Reflow Condition
Pre-heat temperature: 125 5, Pre-heat time: 60 120 sec. Test temperature: 260 5, Test time: 10 1 sec.
Packing
Standard Reel Quantity: 3,000 pcs per reel (WHITE). Dimensions: A: 0.650.1, B: 2.300.1, C: 1.900.1, D: 4.000.1, E: 8.00.2, F: 4.000.1, G: 1.550.05, H: 1.750.1, L: 1781.0, L1: 130.5, W: 11.50.2, W1: 8.0+1.0.
Reliability Specifications
Includes Mechanical Endurance (Shock Test, Vibration, Drop Test) and Environmental Endurance (Resistance To Soldering Heat, Thermal Shock, High TempHumidity, Low Temp. Storage, High Temp. Storage, Pressure Cooker Storage, Fine Leak, Gross Leak, Helium Bombing).
Material Composition Declaration
Base (Ceramics): Al2O3 (92.40%), SiO2 (4.30%), Cr2o3 (1.51%), MgO (0.69%), CaO (1.09%)
Electrode (Metal): Fe (47.70%), Ni (26.10%), Co (15.44%), Ni () (10.76%)
Cover (4J29): Fe (40.70%), Ni (21.79%), Co (12.78%), Ag (21.02%), Cu (3.71%)
Wafer (Quartz): SiO2 (100.00%)
Adhesive: Cr (5.56%), Ag (94.44%)
Metallizing: W (86.04%), Au (2.88%), Ni (11.07%)
Solder: Ag (75.00%), Crystalline Silica (5.00%), Petroleum Solvent (5.00%), Silicone Resin (15.00%)
2504101957_CHANGXING-ELECTRONICS-3DSC160G0012L_C46613779.pdf
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