Product Overview
The Glass5032 2PIN 24.000000MHz 9ASC240G0012L is a high-reliability SMD glass-sealed quartz crystal resonator designed for automatic mounting and reflow soldering. It offers tight tolerance and stability, making it an ideal choice for portable PCs, PDAs, DSCs, and USB interface cards. The product contains Pb in sealing glass, exempted by RoHS directive.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Series: 9A Series
- Product Type: Quartz Crystal Resonator
- Sealing Type: Glass Sealing
- Mounting Type: SMD
- RoHS Exemption: Contains Pb in sealing glass exempted by RoHS directive.
Technical Specifications
| Parameter | Specification | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 24.000000 | MHz | |
| Oscillation Mode | Fund | - | |
| Load Capacitance | 12 | - | |
| Frequency Tolerance (at 25 ) | 10 | ppm | |
| Frequency Tolerance Over Operating Temp. Range | 30 | ppm | |
| Operating Temperature | -40+85 | ||
| Aging (1st Year) | 3 | ppm | |
| Drive Level | 100 | uW | Max. |
| Effective Resistance (Rr) | 40 | Max. | |
| Shunt Capacitance (C0) | 5 | pF | Max. |
| Insulation Resistance | 500 | M | Min. at DC 100V |
| Pulling Sensitivity (TS) | - | ppm/pF | |
| Spurious Response | - | dB | |
| Storage Temperature Range | -55+125 | ||
| Dimensions (L x W x H) | 5.0 x 3.2 x 1.2 | mm | |
| Reel Quantity | 1,000 | pcs per reel | (WHITE) |
Dimensions:
| Symbol | Dimension | Unit |
|---|---|---|
| A | 1.450.1 | mm |
| B | 5.400.1 | mm |
| C | 3.600.1 | mm |
| D | 8.000.1 | mm |
| E | 12.00.2 | mm |
| F | 4.000.1 | mm |
| G | 1.550.05 | mm |
| H | 1.750.1 | mm |
| L | 1801.0 | mm |
| L1 | 130.5 | mm |
| W | 16.50.2 | mm |
| W1 | 12.0+1.0 | mm |
Marking:
- LOGO
- Nominal Frequency (MHz)
- Line Code
- Last three digits of Production Batch Number
- Year-Month Code (4-year cycle)
Reflow Condition: CX24.0 ****
Reliability Specifications:
- Mechanical Endurance: Drop Test (75cm height, 3 times on concrete floor), Mechanical Shock (1000 G, 0.5m sec.), Vibration (10-2000 Hz, 1.52 mm/20G)
- Environmental Endurance: Resistance To Soldering Heat (260 5 for 10 1 sec.), Thermal Shock (100 cycles), High Temp. Storage (+125 3 for 1000 12 hours), Low Temp. Storage (-40 3 for 1000 12 hours), High TempHumidity (85 3, RH 85% for 1000Hrs), Gross Leak (Test Pressure: 2Kg / cm2), Fine Leak (Helium Bombing 4.5 Kgf / cm2 for 2 hr), Solderability (Temperature 260 5, Immersion time 5 1 seconds)
Material Composition Declaration:
- Base: Ceramics (Al2O3, SiO2, Cr2O3, MgO, CaO)
- Cover: Glass (PbO, PbF2, Bi2O3, Nb2O5, B2O3, ZnO, CuO, CaO, TiO2, Fe2O3)
- Adhesive: Polymer (Ag, Quartz, Petroleum solvent, Silicone resin)
- Electrode: Metal (W, Au, Ni)
- Plating: Metal (Cr, Ag)
- Wafer: Quartz (SiO2)
2504101957_CHANGXING-ELECTRONICS-9ASC240G0012L_C46613807.pdf
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