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quality Seam Sealed 26 MHz Quartz Crystal Resonator CHANGXING ELECTRONICS 8DSC260G0012L for Bluetooth and PDA Applications factory
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quality Seam Sealed 26 MHz Quartz Crystal Resonator CHANGXING ELECTRONICS 8DSC260G0012L for Bluetooth and PDA Applications factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
12pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
26MHz
Mfr. Part #:
8DSC260G0012L
Package:
SMD3225-4P
Key Attributes
Model Number: 8DSC260G0012L
Product Description

Product Overview

The Seam3225 4PIN 26.000000MHz Quartz Crystal Resonator, model 8DSC260G0012L, is a high-precision, high-frequency stability component designed for reducing EMI effects. It is an optimal choice for applications in Bluetooth, wireless communication sets, DSC, PDA, and mobile phones. This product is RoHS Compliant and Pb Free.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Product Series: 8D Series
  • Sealing Type: Seam Sealing
  • Compliance: RoHS Compliant / Pb Free
  • Crystal Cutting Type: AT CUT (thickness shear mode)

Technical Specifications

Parameter Units Min. Max. Notes
Nominal Frequency MHz - 26.000000 Fund
Frequency Tolerance at 25 3 ppm - 10 Load Capacitance 12 pF
Load Capacitance pF 12 - -
Operating Temperature Range -40 +85 -
Storage Temperature Range -55 +125 -
Aging (1st Year) ppm - 3 -
Frequency Tolerance (Over Operating Temp. Range) ppm - 30 -
Pulling Sensitivity (TS) ppm/pF - 5000 (Max.) -
Shunt Capacitance (C0) pF - 5 (Max.) -
Effective Resistance (Rr) - 40 (Max.) -
Drive Level uW - 100 (Max.) -
Insulation Resistance M 500 (Min.) - at DC 100V
Spurious Response dB - -3.0 (Max.) -
Dimensions (L x W x H) mm - 3.2 x 2.5 x 0.7 SMD
Reel Quantity pcs per reel - 3,000 (WHITE)
Product Weight mg - 17.322 -

Packing

EIA-481-2 standard reel packaging.

Reliability Specifications

Includes Mechanical Endurance (Vibration, Mechanical Shock, Drop Test, Solderability) and Environmental Endurance (High Temp & Humidity, Low Temp Storage, Temperature Cycling, Thermal Shock, Pressure Cooker Storage, High Temp Storage, Helium Bombing, Gross Leak Test, Fine Leak Test).

Material Composition Declaration

Part Name Material Name Material Mass (mg) Material Mass (%) Constituent Name CAS No. Material Analysis (%)
Base Ceramics 23.09 23.09% Al2O3 1344-28-1 92.40%
SiO2 7631-86-9 4.31%
Cr2o3 1308-38-9 1.50%
MgO 1309-48-4 0.69%
CaO 1305-78-8 1.10%
Electrode Metal 20.91 20.91% Fe 7439-89-6 40.70%
Ni 7440-02-0 21.80%
Co 7440-48-4 12.80%
Ag 7440-22-4 21.00%
Cu 7440-50-8 3.70%
Metalizing Metal 3.62 3.62% W 7440-33-7 62.50%
Au 7440-57-5 4.61%
Ni 7440-02-0 32.89%
Plating (Ni) Ni 47.71 47.71% Fe 7439-89-6 -
Ni 7440-02-0 26.11%
Plating (Ni) Ni 10.74 10.74% Ni 7440-02-0 -
Adhesive Polymer 15.01 15.01% Ag 7440-22-4 75.00%
14808-60-7 5.00%
- 5.00%
- 15.00%
Wafer Quartz 0.45 0.45% SiO2 - 100.00%
Cover Ceramics 0.20 0.20% Cr 7440-47-3 5.56%
Ag 7440-22-4 94.44%

2504101957_CHANGXING-ELECTRONICS-8DSC260G0012L_C46613776.pdf

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