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quality Seam Sealed 24MHz Quartz Crystal Resonator CHANGXING ELECTRONICS 8DSC240G0016L RoHS Compliant Pb Free factory
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quality Seam Sealed 24MHz Quartz Crystal Resonator CHANGXING ELECTRONICS 8DSC240G0016L RoHS Compliant Pb Free factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
16pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
24MHz
Mfr. Part #:
8DSC240G0016L
Package:
SMD3225-4P
Key Attributes
Model Number: 8DSC240G0016L
Product Description

Product Overview

The Seam3225 4PIN 24.000000MHz 8DSC240G0016L is a high-precision Quartz Crystal Resonator designed for demanding applications. It offers high frequency stability and is highly effective in reducing EMI effects, making it an ideal choice for Bluetooth devices, wireless communication sets, DSCs, PDAs, and mobile phones. This product is RoHS Compliant and Pb Free.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Product Model: Seam3225 4PIN 24.000000MHz
  • Product Number: 8DSC240G0016L
  • Certifications: RoHS Compliant / Pb Free
  • Sealing Type: Seam Sealing
  • Series: 8D Series

Technical Specifications

Parameter Units Min. Max. Notes
Nominal Frequency MHz 24.000000
Frequency Tolerance at 25 3 ppm 10
Load Capacitance pF 16
Oscillation Mode - Fund
Drive Level uW 100
Shunt Capacitance C0 pF 5 Max.
Effective Resistance Rr 40 Max.
Motional Capacitance C1 fF
Operating Temperature Range -40 +85
Storage Temperature Range -55 +125
Aging (1st Year) ppm 3
Frequency Tolerance Over Operating Temp. Range ppm 30
Pulling Sensitivity TS ppm/pF
Spurious Response dB -3.0 Max.
Insulation Resistance M 500 Min. at DC 100V
Dimensions (L x W x H) mm 3.2x2.5x0.7
Reel Quantity pcs per reel 3,000 (WHITE)

Dimensions

Dimension Unit Value
L mm 1.400.1
L1 mm 4.000.1
W mm 2.700.1
W1 mm 1.750.1
A mm 3.400.1
B mm 8.00.2
C mm 4.000.11
D mm 1.550.05
E mm 1781.0
F mm 130.5
G mm 11.50.2
H mm 8.0+1.0

Marking

LOGO, MHz, , ,

Reflow Condition

Standard

Packing

EIA-481-2

Material Composition Declaration

Part Name of Part Material Name Material Mass (mg) Material Mass (%) Constituent Name CAS No. Material Analysis (%)
1 Base Ceramics 23.09 23.09% Al2O3 1344-28-1 92.40%
SiO2 7631-86-9 4.31%
Cr2o3 1308-38-9 1.50%
MgO 1309-48-4 0.69%
CaO 1305-78-8 1.10%
2 Cover Metallizing 20.91 20.91% Fe 7439-89-6 40.70%
Ni 7440-02-0 21.80%
Co 7440-48-4 12.80%
Ag 7440-22-4 21.00%
3 Adhesive Polymer 15.01 15.01% Cu 7440-50-8 3.70%
W 7440-33-7 62.50%
Au 7440-57-5 4.61%
Ni 7440-02-0 32.89%
4 Quartz 2.60 2.60% Fe 7439-89-6 47.71%
Ni 7440-02-0 26.11%
Co 7440-48-4 15.44%
Ni 7440-02-0 10.74%
5 Electrode Metal 3.62 3.62% Ag 7440-22-4 75.00%
SiO2 14808-60-7 5.00%
5.00%
Silicone resin 15.00%
6 Metal 6.40 6.40% Cr 7440-47-3 5.56%
Ag 7440-22-4 94.44%

2504101957_CHANGXING-ELECTRONICS-8DSC240G0016L_C46613754.pdf

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