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quality 5.0x3.2 SEAM 4PIN Quartz Crystal Resonator CHANGXING ELECTRONICS 9DSC081G0020L for Wireless Communication Devices factory
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quality 5.0x3.2 SEAM 4PIN Quartz Crystal Resonator CHANGXING ELECTRONICS 9DSC081G0020L for Wireless Communication Devices factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
20pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
8.192MHz
Mfr. Part #:
9DSC081G0020L
Package:
SMD5032-4P
Key Attributes
Model Number: 9DSC081G0020L
Product Description

Product Overview

The 5.0x3.2 SEAM 4PIN Quartz Crystal Resonator, model 9DSC081G0020L, is a high-precision and high-frequency stability component designed for demanding electronic applications. It offers excellent EMI reduction and is an ideal choice for Bluetooth devices, wireless communication sets, DSCs, PDAs, and mobile phone USB interface cards. This RoHS Compliant and Pb Free product ensures reliability and performance in various communication systems.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Product Type: Quartz Crystal Resonator
  • Series: 9D Series
  • Sealing Type: SEAM Sealing
  • Compliance: RoHS Compliant / Pb Free
  • Crystal Cutting Type: AT CUT (thickness shear mode)

Technical Specifications

Parameter Nominal Frequency Load Capacitance Frequency Tolerance (at 25 3) Over Operating Temp. Range Tolerance Aging (1st Year) Operating Temperature Storage Temperature Range Drive Level Shunt Capacitance (C0) Motional Capacitance (C1) Effective Resistance (Rr) Pulling Sensitivity (TS RLD2) Insulation Resistance Spurious Response Dimensions (L x W x H) Reel Quantity
Value 8.192000 MHz 20 pF 30 ppm 3 ppm 3 ppm -40+85 -55+125 100 uW Max. 5 pF Max. 125 fF 100 Max. 1000+5000 ppm/pF 500 M Min. (at DC 100V) -3.0 dB Max. 5.03.20.9 mm 1,000 pcs per reel
Oscillation Mode Fund
DLDH2 5 Max.
FDLDH 5 Max.
DLD2 0.0130W/15 steps
DLDF 30100W/10 steps
FDLD 10030W/10 steps
DLD2 300.01W/15 steps
Others -

Dimensions (mm):
A: 5.400.1, B: 3.600.1, C: 1.450.1, D: 8.000.1, E: 12.00.2, F: 4.000.1, G: 1.550.05, H: 1.750.1, L: 1801.0, L1: 130.5, W: 16.50.2, W1: 12.0+1.0

Marking: LOGO, MHz, , ,

Reflow Condition: CX8.19

Material Composition:

  • Base (1): Ceramics (Al2O3) - 41.84%
  • Cover (2): 4J29 () - 18.68%
  • Electrode (3): Metal (Cr, Ag) - 0.49%
  • Adhesive (4): Polymer (Ag, SiO2, Petroleum Solvent, Silicone resin) - 1.22%
  • Wafer (Blank): Quartz (SiO2) - 3.65%
  • KV: Metal (Fe-Co-Ni, W, Ni, Au, Fe) - 15.69%
  • (Metal): Metal (Ni, Co) - 18.44%

2509221035_CHANGXING-ELECTRONICS-9DSC081G0020L_C46613790.pdf

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