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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
20pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
60Ω
Frequency:
12.288MHz
Mfr. Part #:
9ASC122G0020L
Package:
SMD5032-2P
Key Attributes
Model Number:
9ASC122G0020L
Product Description
Product Overview
The CHANGXING ELECTRONICS CO.,LTD. Glass 5032 2PIN 12.288000MHz 9ASC122G0020L is a high-reliability SMD glass-sealed quartz crystal resonator designed for automatic mounting and reflow soldering. It offers tight tolerance and stability, making it an ideal choice for portable PCs, PDAs, DSCs, and USB interface cards. The product features a Pb content in sealing glass exempted by RoHS directive.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Series: 9A Series
- Product Type: Quartz Crystal Resonator
- Sealing Type: Glass Sealing
- Mounting Type: SMD
- Origin: Fujian, China
- RoHS Exemption: Contains Pb in sealing glass exempted by RoHS directive.
Technical Specifications
| Parameter | Specification | Notes |
|---|---|---|
| Nominal Frequency | 12.288000 MHz | |
| Model | 9ASC122G0020L | |
| Product No. | Glass5032 | |
| Dimensions (L x W x H) | 5.0 x 3.2 x 1.2 mm | |
| Oscillation Mode | Fund | |
| Load Capacitance | 20 pF | |
| Frequency Tolerance (at 25 ) | 10 ppm | |
| Frequency Tolerance (Over Operating Temp. Range) | 30 ppm | |
| Operating Temperature | -40 ~ +85 | |
| Storage Temperature Range | -55 ~ +125 | |
| Aging (1st Year) | 3 ppm | |
| Drive Level | 100 uW | |
| Effective Resistance (Rr) | 60 Max. | |
| Shunt Capacitance (C0) | 5 pF Max. | |
| Insulation Resistance | 500 M Min. at DC 100V | |
| Pulling Sensitivity (TS) | 20 ppm/pF | |
| Spurious Response | -3.0 dB Max. | |
| Crystal Cutting Type | AT CUT (thickness shear mode) | |
| Reel Quantity | 1,000 pcs per reel | (WHITE) |
| Base Material (Ceramics) | Al2O3 | 92.41% |
| Base Material (Ceramics) | SiO2 | 4.30% |
| Base Material (Ceramics) | Cr2O3 | 1.51% |
| Base Material (Ceramics) | MgO | 0.69% |
| Base Material (Ceramics) | CaO | 1.09% |
| Metalization (Tungsten) | W | 100.00% |
| Metalization (Gold) | Au | 17.69% |
| Metalization (Nickel) | Ni | 82.31% |
| Adhesive (Polymer) | Al2O3 | 84.12% |
| Adhesive (Polymer) | MnO2 | 2.87% |
| Adhesive (Polymer) | SiO2 | 2.87% |
| Adhesive (Polymer) | TiO2 | 5.22% |
| Adhesive (Polymer) | Cr2O3 | 1.91% |
| Adhesive (Polymer) | Fe2O3 | 2.06% |
| Adhesive (Polymer) | MgO | 0.48% |
| Adhesive (Polymer) | Co3O4 | 0.48% |
| Glass Cover (Glass) | PbO | 57.29% |
| Glass Cover (Glass) | PbF2 | 19.29% |
| Glass Cover (Glass) | Bi2O3 | 5.30% |
| Glass Cover (Glass) | Nb2O5 | 4.30% |
| Glass Cover (Glass) | B2O3 | 2.30% |
| Glass Cover (Glass) | ZnO | 2.30% |
| Glass Cover (Glass) | CuO | 1.30% |
| Glass Cover (Glass) | CaO | 0.30% |
| Plating (Ceramic) | TiO2 | 5.30% |
| Plating (Ceramic) | Fe2O3 | 2.30% |
| Electrode (Metal) | Ag | 75.00% |
| Electrode (Metal) | Cr | 5.56% |
| Electrode (Metal) | Ag | 94.44% |
| Quartz Wafer | SiO2 | 100.00% |
| Product Weight | 52.850 mg |
2510091049_CHANGXING-ELECTRONICS-9ASC122G0020L_C46613801.pdf
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