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quality SMD Crystal Oscillators CHANGXING ELECTRONICS 3ESC240C0033L 24MHz CMOS Output RoHS Compliant for wireless communication factory
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quality SMD Crystal Oscillators CHANGXING ELECTRONICS 3ESC240C0033L 24MHz CMOS Output RoHS Compliant for wireless communication factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
24MHz
Mfr. Part #:
3ESC240C0033L
Package:
SMD2016-4P
Key Attributes
Model Number: 3ESC240C0033L
Product Description

Product Overview

The CHANGXING ELECTRONICS CO.,LTD. 3E Series 2.0x1.6mm SMD Crystal Oscillators with CMOS Output are ultra-small, seam-sealed clock crystal oscillator units designed for applications in WLAN, Bluetooth, DSC, DSL, and other IT products. These oscillators offer a tri-state function and are RoHS Compliant / Pb Free.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Series: 3E Series
  • Product Type: SMD Crystal Oscillators
  • Output Type: CMOS Output
  • Certifications: RoHS Compliant / Pb Free
  • Origin: Fujian, China

Technical Specifications

Specification Value Unit Notes
Nominal Frequency 24.000000 MHz
Model 3ESC240C0033L
Dimensions 2.0 x 1.6 x 0.75 mm SMD
Input Voltage (VDD) 1.83.3 Vdc
Input Current (IDD) 5 A max Standby current
Output Load 15 pF max
Rise/Fall Time 10 ns max 90%VDD
Output Voltage VOL 10%VDD
Output Voltage VOH 90%VDD
Start-up Time 1.8 ms max
Jitter (rms) 5 ps max
Aging 3 ppm/year
Tolerance @ 25 Degree 10 ppm
Stability over Operation Temp. 20 ppm
Operating Temperature Range -4085
Storage Temperature Range -55125
Fundamental Oscillation mode MSL Level 1 IPC/JEDEC J-STD-033C
Output State Control Enable/disable
Output Waveform CMOS
Output Symmetry 5010%
Product Weight 8.144 mg For OSC 2016


Marking

LOGO / MHz / / /

Example: CX24.0 .****


Reflow Condition

Temperature profile for reflow soldering:

  • Pre-heating zone 1: 150180, 9030s
  • Soldering zone: 230 or more, 3010s
  • Peak: 250+50

Soldering iron method:

  • Bit temperature: 35010
  • Application time of soldering iron: 31 s

For other procedures, refer to IEC 60068-2-20.


Packing

EIA-481-2 TAPE (CARRIER) DIMENSIONS


Reliability Specifications

Standard test condition (TEMP.: 2015. Relative humidity: 6520%). For any discrepancy in GO/NG, test will be done at TEMP. 252. R.H. 655%.

  • High Temperature Storage: 72 hrs at 125C3C. Frequency change 5ppm.
  • Low Temperature Storage: 72 hrs at -55C3C. Frequency change 5ppm.
  • Humidity: 96 hrs at 40 C 3 C, with 90 3% R.H. Frequency change 5ppm.
  • Temperature Cycle: 10 cycles from -25C to 85C. Frequency change 5ppm.
  • Shock: Peak 1000m/s, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axis of samples, 3 cycles /direction, total 18 cycles. Frequency change 5ppm.
  • Drop: Free drop from 1.0 m height to wooden plate for 3 times. Frequency change 5ppm.
  • Vibration: Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h. 10 cycles in each direction of 3 axis. Frequency change 5ppm.
  • Resistance to Soldering Heat: In 255 5 solder bath for 2 0.5 seconds. Frequency change 5ppm. No visible damage. Terminals shall be covered more than 95% with solder.
  • Solderability: Terminals shall be covered more than 95% with solder. No visible damage.
  • Terminal Strength: 0.5 kg pulling force for at least 60 seconds. No visible damages.


Material Composition Declaration

Base: Ceramics (Al2O3, SiO2, Cr2o3, Mo, Fe, Ni, Co, Ag, Cu)

Lid: Kovar (Fe, Co, Ni)

Pin: Solder (Ag, Ethyl alcohol, Bisphenol A-epichlorohydrin polymer, Xylenes, Ethylbenzene, Silicone resin, Silica, Petroleumsolvents)

Plate: Epoxy Conductive Resin

Wafer: Quartz (SiO2)

Wire: Gold (Au)

IC: Silicon (Si)

Electrode: Silver (Ag)

Metallization: Tungsten (W), Gold (Au), Nickel (Ni)

Adhesive Resin


2508051459_CHANGXING-ELECTRONICS-3ESC240C0033L_C48927826.pdf

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