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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
50MHz
Mfr. Part #:
3ESC500C0033L
Package:
SMD2016-4P
Key Attributes
Model Number:
3ESC500C0033L
Product Description
Product Overview
The 2.0x1.6mm SMD Crystal Oscillator, 3E Series, offers an ultra-small, seam-sealed clock crystal oscillator unit designed for IT product applications including WLAN, Bluetooth, DSC, and DSL. It features a CMOS output and an optional tri-state function, adhering to RoHS compliance and Pb-Free standards.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD. ()
- Origin: Fujian, China
- Certifications: RoHS Compliant / Pb Free
- Series: 3E Series
- Output Type: CMOS Output
- Sealing: Seam sealed
- MSL Level: 1
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 50.000000 | MHz | |
| Tolerance @ 25 Degree | 10 | % | |
| Stability over Operation Temp. | 20 | ppm | |
| Operating Temperature Range | -40 to 85 | ||
| Storage Temperature Range | -55 to 125 | ||
| Input Voltage (VDD) | 1.8 to 3.3 | Vdc | |
| Input Current (IDD) | 5 | A max | Standby current |
| Output State Control | Enable/disable | Tri-state function available | |
| Rise/Fall Time | 10 | ns max | @ 10%VDD |
| Output Voltage VOL | 90%VDD | ||
| Output Voltage VOH | 10%VDD | ||
| Output Load | 15 | pF max | |
| Output Waveform | CMOS | ||
| Output Symmetry | 50 10% | ||
| Start-up Time | 5 | ms max | |
| Jitter (rms) | 5 | ps max | |
| Aging | 3 | ppm/year | |
| Dimensions | 2.0 x 1.6 x 0.75 | mm | |
| Product Model | 3ESC500C0033L | ||
| Customer Part No. | 2.01.6 OSC 50.000000MHz | ||
| Product Weight | 8.144 | mg |
Packing Information
Packing according to EIA-481-2 standard (Tape Carrier Dimensions).
Reliability Specifications
Standard test conditions: TEMP.: 2015. Relative humidity: 6520%. For any discrepancy in GO/NG, test will be done at TEMP. 252. R.H. 655%.
| Item | Test Method | Specification |
|---|---|---|
| High Temperature Storage | GB/T 2423.2-2001, Method Ba | Frequency change after test 5ppm. (72 hrs at 125C3C) |
| Low Temperature Storage | GB/T 2423.1-2001, Method Aa | Frequency change after test 5ppm. (72 hrs at -55C3C) |
| Humidity | GB/T 2423.3-2006, Method Cab | Frequency change after test 5ppm. (96 hrs at 40 C 3 C, with 90 3% R.H.) |
| Temperature Cycle | GB/T2423.22-2002, Method Nb | Frequency change after test 5ppm. (10 cycles from -25C to 85C) |
| Shock | GB/T 2423.5-1995, Method Ea | Frequency change after test 5ppm. (Peak 1000m/s, 6ms half sine wave, 3 perpendicular axes, 3 cycles/direction, total 18 cycles) |
| Drop | GB/T 2423.8-1995, Method Ed | Frequency change after test 5ppm. (Free drop from 1.0 m height for 3 times) |
| Vibration | GB/T 2423.10-1995, Method Fc | Frequency change after test 5ppm. (Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h, 10 cycles in each direction of 3 axes) |
| Resistance to Soldering Heat | GB/T 2423.28-2005, Test Tb Method 1B | Frequency change after test 5ppm. (In 255 5 solder bath for 2 0.5 seconds) |
| Solderability | GB/T 2423.28-2005, Method Tc | Terminals shall be covered more than 95% with solder. No visible damage. (35010 soldering iron bit, 31 s) |
| Terminal Strength | JIS-C-6429 Method 1 & 2 | Frequency change after test 5ppm. No visible damages. (Mount on glass-epoxy board, bend to 2mm displacement, or 0.5 kg pulling force) |
Material Composition Declaration
| No. | Name of Part | Material Name | Constituent name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|
| 1 | Base | Ceramics | Al2O3 | 1344-28-1 | 63.88% |
| SiO2 | 14464-46-1 | 3.79% | |||
| Cr2O3 | 1308-38-9 | 1.29% | |||
| Mo | 7439-98-7 | 1.00% | |||
| Fe | 7440-33-7 | 9.25% | |||
| Ni | 7439-89-6 | 8.85% | |||
| Co | 7440-02-0 | 4.75% | |||
| 2 | Lid | Kovar | Fe | 7440-33-7 | 54.00% |
| Co | 7440-48-4 | 17.02% | |||
| Ni | 7440-02-0 | 28.32% | |||
| Plate | Ni () | 7440-02-0 | 0.66% | ||
| 3 | Epoxy | Conductive Resin | Adhesive Resin | - | 100.00% |
| 4 | Blank | Quartz | SiO2 | 14808-60-7 | 100.00% |
| 5 | Wire | Gold | Au | 7440-57-5 | 100.00% |
| 6 | IC | Silicon | Silicon | 7440-21-3 | 100.00% |
| 7 | Electrode | Electrode | Ag | 7440-22-4 | 100.00% |
| Solder | Solder | Ag | 7440-22-4 | 74.00% | |
| Ethyl alcohol | 64-17-5 | 0.60% | |||
| Bisphenol A-epichlorohydrin polymer | 25068-38-6 | 0.60% | |||
| Xylenes (o-, m-, p-isomers) | 1330-20-7 | 0.60% | |||
| Ethylbenzene | 100-41-4 | 0.06% | |||
| Silicone resin | - | 8.62% | |||
| Silica | - | 8.52% | |||
| Petroleum solvents | - | 7.00% |
2508051500_CHANGXING-ELECTRONICS-3ESC500C0033L_C48927833.pdf
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