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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
32MHz
Mfr. Part #:
4ESC320C0033L
Package:
SMD2520-4P
Key Attributes
Model Number:
4ESC320C0033L
Product Description
Product Overview
The CHANGXING ELECTRONICS CO.,LTD. 2.5x2.0mm SMD Crystal Oscillators (Model 4ESC320C0033L) are ultra-small, seam-sealed clock crystal oscillator units designed for IT product applications including WLAN, Bluetooth, DSC, and DSL. These CMOS output oscillators offer a tri-state function and are RoHS Compliant and Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Series: 4E Series
- Output Type: CMOS Output
- Certifications: RoHS Compliant / Pb Free
- Origin: Fujian Province, China
- Mounting Type: SMD
Technical Specifications
| Specification | Value | Unit | Condition/Notes |
|---|---|---|---|
| Nominal Frequency | 32.000000 | MHz | |
| Tolerance @ 25 Degree | 10 | ppm | |
| Stability over Operation Temp. | 20 | ppm | -4085 |
| Aging | 3 | ppm/year | |
| Operating Temperature Range | -55125 | ||
| Storage Temperature Range | 5010% | ||
| Supply Voltage (Vdd) | 1.83.3 | Vdc | |
| Supply Current (Icc) | mA | max | |
| Standby current | A | max | |
| Output Load | 10 | pF | max |
| Output Waveform | CMOS | ||
| Output Symmetry | % | 10%VDD to 90%VDD | |
| Rise/Fall Time | ps | max | |
| Output Voltage VOL | |||
| Output Voltage VOH | |||
| Enable Voltage High | 70%Vdd | min | |
| Disable Voltage Low | 30%Vdd | max | |
| Start-up Time | 5 | ms | max |
| Phase Jitter(12KHz 20MHz) | |||
| Fundamental Oscillation mode | |||
| Dimensions (L x W x H) | 2.5 x 2.0 x 0.8 | mm | |
| MSL Level | 1 | IPC/JEDEC J-STD-033C |
| Reflow Condition | Value | Unit | Notes |
|---|---|---|---|
| Peak Temperature | 250+50 | ||
| Soldering Zone (230) | 30 | 10 s | |
| Pre-heating Zone 1 (150180) | 90 | 30 s |
| Soldering Iron Method | Value | Unit | Notes |
|---|---|---|---|
| Bit Temperature | 350 | 10 | |
| Application Time | 3 | 1 s |
| Reliability Test Item | Test Method | Frequency Change After Test | Notes |
|---|---|---|---|
| Resistance to Soldering Heat | GB/T 2423.28-2005, Test Tb Method 1B | 5ppm | Passed through re-flow oven (Preheat 150C5C for 60-120s, Peak 265C5C for 10s3s). Measurement after 242 hours at room temp. |
| Solderability | GB/T 2423.28-2005, Method Tc | 255 5 solder bath for 2 0.5 seconds. Terminals shall be covered >95% with solder. No visible damage. | |
| Terminal Strength | JIS-C-6429 Method 1 & 2 | 5ppm | Mount on glass-epoxy board, bend to 2mm displacement (1mm/sec) and hold 5s; OR pulling force 0.5 kg for 60s. No visible damages. |
| Drop | GB/T 2423.8-1995, Method Ed | 5ppm | Free drop from 1.0 m onto wooden plate, 3 times. Measurement after 242 hours at room temp. |
| Vibration | GB/T 2423.10-1995, Method Fc | 5ppm | Sweep frequency 10500 Hz at 0.75mm vibration, for 2h. 10 cycles each axis. Measurement after 1 hour. |
| Shock | GB/T 2423.5-1995, Method Ea | 5ppm | 1000m/s, 6ms half sine wave, 3.7m/s, 3 perpendicular axes, 3 cycles/direction, total 18 cycles. Measurement after 1 hour. |
| Humidity | GB/T 2423.3-2006, Method Cab | 5ppm | 96 hrs at 40 C 3 C, 90 3% R.H. Measurement after 242 hours at room temp. |
| Temperature Cycle | GB/T2423.22-2002, Method Nb | 5ppm | 10 cycles from -25C to 85C. Measurement after 242 hours at room temp. |
| High Temperature Storage | GB/T 2423.2-2001, Method Ba | 5ppm | 72 hrs at 125C3C. Measurement after 242 hours at room temp. |
| Low Temperature Storage | GB/T 2423.1-2001, Method Aa | 5ppm | 72 hrs at -55C3C. Measurement after 242 hours at room temp. |
| Part | Material Name | Constituent Name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|
| Base (Ceramics) | Aluminum oxide | Al2O3 | 1344-28-1 | 63.88% |
| SiO2 | 14464-46-1 | 3.79% | ||
| Cr2o3 | 1308-38-9 | 1.29% | ||
| Mo | 7439-98-7 | 1.00% | ||
| Fe | 7440-33-7 | 9.25% | ||
| Ni | 7439-89-6 | 8.85% | ||
| Co | 7440-02-0 | 4.75% | ||
| Ag | 7440-48-4 | 2.98% | ||
| Cu | 7440-22-4 | 2.80% | ||
| Metallization | Tungsten | 7440-50-8 | 1.04% | |
| Gold | 7440-02-0 | 0.24% | ||
| Ni | 7440-57-5 | 0.13% | ||
| Fe | 7439-89-6 | 54.00% | ||
| Plate (Kovar) | Co | 7440-48-4 | 17.02% | |
| Ni | 7440-02-0 | 28.32% | ||
| Ni (Plating) | 7440-02-0 | 0.66% | ||
| Adhesive Resin | Epoxy | Bisphenol A-epichlorohydrin polymer | 25068-38-6 | 0.60% |
| Lid | Conductive Resin | Silicone resin | - | 8.62% |
| Silica | - | 8.52% | ||
| Blank (Wafer) | Quartz | Silicon oxide | 14808-60-7 | 100.00% |
| Wire | Gold | Au | 7440-57-5 | 100.00% |
| IC | Silicon | Silicon | 7440-21-3 | 100.00% |
| Electrode | Silver | Ag | 7440-22-4 | 100.00% |
| Silver | 7440-22-4 | 74.00% | ||
| Ethyl alcohol | 64-17-5 | 0.60% | ||
| Bisphenol A-epichlorohydrin polymer | 25068-38-6 | 0.60% | ||
| Xylenes (o-, m-, p-isomers) | 1330-20-7 | 0.60% | ||
| Ethylbenzene | 100-41-4 | 0.06% |
2512081627_CHANGXING-ELECTRONICS-4ESC320C0033L_C48927843.pdf
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