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quality CHANGXING ELECTRONICS 7ESC080C0033L SMD Quartz Crystal Oscillator with Low Jitter and High Stability factory
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quality CHANGXING ELECTRONICS 7ESC080C0033L SMD Quartz Crystal Oscillator with Low Jitter and High Stability factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
8MHz
Mfr. Part #:
7ESC080C0033L
Package:
SMD7050-4P
Key Attributes
Model Number: 7ESC080C0033L
Product Description

Product Overview

The 7ESC080C0033L is a 7.0x5.0mm SMD Crystal Oscillator from CHANGXING ELECTRONICS CO., LTD. This CMOS output oscillator offers high precision across a wide frequency range, designed for automatic mounting and reflow soldering. It features a Tri-State function, a supply voltage range of 1.8V to 5.0V, high stability, low jitter, and low power consumption. Key applications include wireless communication, PCs, and LCDM. The product is RoHS Compliant and Pb Free.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Origin: Fujian, China
  • Product Type: Quartz Crystal Oscillator
  • Series: 7E Series
  • Output Type: CMOS
  • Mounting Type: SMD
  • Compliance: RoHS Compliant / Pb Free
  • MSL Level: 1

Technical Specifications

Specification Value Unit Notes
Nominal Frequency 8.000000 MHz
Tolerance @ 25 Degree 10 ppm
Stability over Operation Temp. 20 ppm
Operating Temperature Range -40 to 85
Storage Temperature Range -55 to 125
Supply Voltage (Vdd) 1.8 to 5.0 Vdc
Supply Current (Icc) 5 mA max
Standby current 10 A max for 1.8V~3.3V
Phase Jitter (12KHz ~ 20MHz) 5 ps max
Aging 3 ppm/year min
Start-up Time 15 ms max
Rise/Fall Time 5 ns max
Output Voltage VOL 30%Vdd max
Output Voltage VOH 70%Vdd min
Output Load 10 pF
Output Symmetry 5010%
Output State Control Enable/disable
Enable Voltage High
Disable Voltage Low
Output Waveform CMOS
Dimensions 7.0 x 5.0 x 1.3 mm SMD
Product No. 7ESC080C0033L
Model 7.0x5.0 OSC 8.000000MHz
Reflow Peak Temperature 250+5
Reflow Soldering Zone 230 3010s
Reflow Pre-heating Zone 1 150180 9030s
Soldering Iron Bit Temperature 35010
Soldering Iron Application Time 3 s +1 s
Production Weight 123.031 mg

Reliability Specifications

Standard test condition (TEMP.: 2015. Relative humidity: 6520%). For any discrepancy in GO/NG, test will be done at TEMP.252. R.H. 655%.

ITEM TEST METHOD SPECIFICATION Notes
Temperature Cycle GB/T2423.22-2002, Method Nb Frequency change after test5ppm. No visible damages. 10 cycles from -25C to 85C. Measurement taken after DUT being left at room temperature for 242 hours.
Low Temperature Storage GB/T2423.1-2001, MethodAa Frequency change after test5ppm. Spending 72 hrs at -55C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours.
Humidity GB/T2423.3- 2006, Method Cab Frequency change after test5ppm. No visible damages. Spending 96 hrs at 40 C 3 C, with 90 3% R.H. Measurement taken after DUT being left at room temperature for 242 hours.
High Temperature Storage GB/T2423.2-2001, MethodBa Frequency change after test5ppm. Spending 72 hrs at 125C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours.
Drop GB/T 2423.8- 1995, Method Ed Frequency change after test5ppm. No visible damages. Free drop to the wooden plate from 1.0 m heights for 3 times. Measurement taken after 1 hour.
Vibration GB/T 2423.10- 1995, Method Fc Frequency change after test5ppm. Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h. 10 cycles in each direction of 3 axis. Measurement taken after 1 hour.
Resistance to Soldering Heat GB/T 2423.28-2005, Test Tb Method 1B Frequency change after test5ppm. No visible damages. Passed through the re-flow oven under the following condition. Preheat to 150 C5C for 60 to 120sec, and peak 265 C5C for 10s3sec. Measurement taken after DUT being left at room temperature for at 242 hours.
Shock GB/T 2423.5- 1995, Method Ea Frequency change after test5ppm. Peak 1000m/s2, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axis of samples, 3 cycles /direction, total 18 cycles. Measurement taken after 1 hour.
Solderability GB/T 2423.28-2005, Method Tc Terminals shall be covered more than 95% with solder. No visible damage. In 255 5 solder bath for 2 0.5 seconds. There is noneed to do functioned test. 8-12X magnifier.
Terminal Strength JIS-C- 6429 Method 1 & 2 Frequency change after test5ppm. No visible damages. Mount on a glass-epoxy board (100x50x1.6mm), then bend to 2mm displacement (velocity 1mm/sec) and keep for 5 seconds. or pulling force 0.5 kg for at least 60 seconds.

Material Composition Declaration

No. Name of Part Material Name Constituent name CAS No. Material Analysis(%)
1 Base Ceramics Al2O3 1344-28-1 63.88%
SiO2 14464-46-1 3.79%
Cr2o3 1308-38-9 1.29%
Mo 7439-98-7 1.00%
Fe 7439-89-6 8.85%
Ni 7440-02-0 4.75%
Co 7440-48-4 2.98%
Ag 7440-22-4 2.80%
Cu 7440-50-8 1.04%
Pin Solder Fe 7439-89-6 54.00%
Co 7440-48-4 17.02%
Ni 7440-02-0 28.32%
Plate Ni 7440-02-0 0.66%
W 7440-33-7 9.25%
Au 7440-57-5 0.13%
Ni 7440-02-0 0.24%
2 Lid Kovar
3 Adhesive Resin 100.00%
4 Blank Quartz SiO2 14808-60-7 100%
5 Wire Gold Au 7440-57-5 100%
6 IC Ssilicon Silicon Silicon 7440-21-3 100%
7 Electrode Electrode Ag 7440-22-4 100%
Silver Silver 7440-22-4 74.00%
Ethyl alcohol Ethyl alcohol 64-17-5 0.60%
Bisphenol A-epichlorohydrin polymer Bisphenol A-epichlorohydrin polymer 25068-38-6 0.60%
Xylenes (o-, m-, p-isomers) Xylenes (o-, m-, p-isomers) 1330-20-7 0.60%
Ethylbenzene Ethylbenzene 100-41-4 0.06%
Silicone resin Silicone resin - 8.62%
Silica Silica - 8.52%
Petroleum solvents Petroleum solvents - 7.00%

2512081627_CHANGXING-ELECTRONICS-7ESC080C0033L_C48927864.pdf

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