Product Overview
The 7ESC080C0033L is a 7.0x5.0mm SMD Crystal Oscillator from CHANGXING ELECTRONICS CO., LTD. This CMOS output oscillator offers high precision across a wide frequency range, designed for automatic mounting and reflow soldering. It features a Tri-State function, a supply voltage range of 1.8V to 5.0V, high stability, low jitter, and low power consumption. Key applications include wireless communication, PCs, and LCDM. The product is RoHS Compliant and Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Origin: Fujian, China
- Product Type: Quartz Crystal Oscillator
- Series: 7E Series
- Output Type: CMOS
- Mounting Type: SMD
- Compliance: RoHS Compliant / Pb Free
- MSL Level: 1
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 8.000000 | MHz | |
| Tolerance @ 25 Degree | 10 | ppm | |
| Stability over Operation Temp. | 20 | ppm | |
| Operating Temperature Range | -40 to 85 | ||
| Storage Temperature Range | -55 to 125 | ||
| Supply Voltage (Vdd) | 1.8 to 5.0 | Vdc | |
| Supply Current (Icc) | 5 | mA max | |
| Standby current | 10 | A max | for 1.8V~3.3V |
| Phase Jitter (12KHz ~ 20MHz) | 5 | ps max | |
| Aging | 3 | ppm/year | min |
| Start-up Time | 15 | ms max | |
| Rise/Fall Time | 5 | ns max | |
| Output Voltage VOL | 30%Vdd max | ||
| Output Voltage VOH | 70%Vdd min | ||
| Output Load | 10 | pF | |
| Output Symmetry | 5010% | ||
| Output State Control | Enable/disable | ||
| Enable Voltage High | |||
| Disable Voltage Low | |||
| Output Waveform | CMOS | ||
| Dimensions | 7.0 x 5.0 x 1.3 | mm | SMD |
| Product No. | 7ESC080C0033L | ||
| Model | 7.0x5.0 OSC 8.000000MHz | ||
| Reflow Peak Temperature | 250+5 | ||
| Reflow Soldering Zone | 230 | 3010s | |
| Reflow Pre-heating Zone 1 | 150180 | 9030s | |
| Soldering Iron Bit Temperature | 35010 | ||
| Soldering Iron Application Time | 3 | s | +1 s |
| Production Weight | 123.031 | mg |
Reliability Specifications
Standard test condition (TEMP.: 2015. Relative humidity: 6520%). For any discrepancy in GO/NG, test will be done at TEMP.252. R.H. 655%.
| ITEM | TEST METHOD | SPECIFICATION | Notes |
|---|---|---|---|
| Temperature Cycle | GB/T2423.22-2002, Method Nb | Frequency change after test5ppm. No visible damages. | 10 cycles from -25C to 85C. Measurement taken after DUT being left at room temperature for 242 hours. |
| Low Temperature Storage | GB/T2423.1-2001, MethodAa | Frequency change after test5ppm. | Spending 72 hrs at -55C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours. |
| Humidity | GB/T2423.3- 2006, Method Cab | Frequency change after test5ppm. No visible damages. | Spending 96 hrs at 40 C 3 C, with 90 3% R.H. Measurement taken after DUT being left at room temperature for 242 hours. |
| High Temperature Storage | GB/T2423.2-2001, MethodBa | Frequency change after test5ppm. | Spending 72 hrs at 125C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours. |
| Drop | GB/T 2423.8- 1995, Method Ed | Frequency change after test5ppm. No visible damages. | Free drop to the wooden plate from 1.0 m heights for 3 times. Measurement taken after 1 hour. |
| Vibration | GB/T 2423.10- 1995, Method Fc | Frequency change after test5ppm. | Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h. 10 cycles in each direction of 3 axis. Measurement taken after 1 hour. |
| Resistance to Soldering Heat | GB/T 2423.28-2005, Test Tb Method 1B | Frequency change after test5ppm. No visible damages. | Passed through the re-flow oven under the following condition. Preheat to 150 C5C for 60 to 120sec, and peak 265 C5C for 10s3sec. Measurement taken after DUT being left at room temperature for at 242 hours. |
| Shock | GB/T 2423.5- 1995, Method Ea | Frequency change after test5ppm. | Peak 1000m/s2, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axis of samples, 3 cycles /direction, total 18 cycles. Measurement taken after 1 hour. |
| Solderability | GB/T 2423.28-2005, Method Tc | Terminals shall be covered more than 95% with solder. No visible damage. | In 255 5 solder bath for 2 0.5 seconds. There is noneed to do functioned test. 8-12X magnifier. |
| Terminal Strength | JIS-C- 6429 Method 1 & 2 | Frequency change after test5ppm. No visible damages. | Mount on a glass-epoxy board (100x50x1.6mm), then bend to 2mm displacement (velocity 1mm/sec) and keep for 5 seconds. or pulling force 0.5 kg for at least 60 seconds. |
Material Composition Declaration
| No. | Name of Part | Material Name | Constituent name | CAS No. | Material Analysis(%) |
|---|---|---|---|---|---|
| 1 | Base | Ceramics | Al2O3 | 1344-28-1 | 63.88% |
| SiO2 | 14464-46-1 | 3.79% | |||
| Cr2o3 | 1308-38-9 | 1.29% | |||
| Mo | 7439-98-7 | 1.00% | |||
| Fe | 7439-89-6 | 8.85% | |||
| Ni | 7440-02-0 | 4.75% | |||
| Co | 7440-48-4 | 2.98% | |||
| Ag | 7440-22-4 | 2.80% | |||
| Cu | 7440-50-8 | 1.04% | |||
| Pin | Solder | Fe | 7439-89-6 | 54.00% | |
| Co | 7440-48-4 | 17.02% | |||
| Ni | 7440-02-0 | 28.32% | |||
| Plate | Ni | 7440-02-0 | 0.66% | ||
| W | 7440-33-7 | 9.25% | |||
| Au | 7440-57-5 | 0.13% | |||
| Ni | 7440-02-0 | 0.24% | |||
| 2 | Lid | Kovar | |||
| 3 | Adhesive Resin | 100.00% | |||
| 4 | Blank | Quartz | SiO2 | 14808-60-7 | 100% |
| 5 | Wire | Gold | Au | 7440-57-5 | 100% |
| 6 | IC Ssilicon | Silicon | Silicon | 7440-21-3 | 100% |
| 7 | Electrode | Electrode | Ag | 7440-22-4 | 100% |
| Silver | Silver | 7440-22-4 | 74.00% | ||
| Ethyl alcohol | Ethyl alcohol | 64-17-5 | 0.60% | ||
| Bisphenol A-epichlorohydrin polymer | Bisphenol A-epichlorohydrin polymer | 25068-38-6 | 0.60% | ||
| Xylenes (o-, m-, p-isomers) | Xylenes (o-, m-, p-isomers) | 1330-20-7 | 0.60% | ||
| Ethylbenzene | Ethylbenzene | 100-41-4 | 0.06% | ||
| Silicone resin | Silicone resin | - | 8.62% | ||
| Silica | Silica | - | 8.52% | ||
| Petroleum solvents | Petroleum solvents | - | 7.00% |
2512081627_CHANGXING-ELECTRONICS-7ESC080C0033L_C48927864.pdf
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