Product Overview
The Seam3225 is a high-precision Quartz Crystal Resonator designed for applications requiring high frequency stability and effective EMI reduction. It is an ideal choice for Bluetooth, wireless communication sets, DSC, PDA, and mobile phones. This product is RoHS Compliant and Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Model: Seam3225 4PIN 32.768000MHz 8DSC327G0010L
- Series: 8D Series
- Certifications: RoHS Compliant / Pb Free
- Origin: Fujian, China
Technical Specifications
| Parameter | Units | Value | Notes |
|---|---|---|---|
| Nominal Frequency | MHz | 32.768000 | |
| Load Capacitance | pF | 10 | |
| Frequency Tolerance | ppm | 10 | at 25 3 |
| Frequency Stability | ppm | 30 | |
| Operating Temperature Range | -40+85 | ||
| Storage Temperature Range | -55+125 | ||
| Aging (1st Year) | ppm | 3 | |
| Drive Level | uW | 100 Max. | |
| Shunt Capacitance (C0) | pF | 5 Max. | |
| Motional Capacitance (C1) | fF | ||
| Effective Resistance (Rr) | 40 Max. | ||
| Insulation Resistance | M | 500 Min. | at DC 100V |
| Pulling Sensitivity (TS) | ppm/pF | ||
| Spurious Response | dB | -3.0 Max. | |
| Over Operating Temp. Range | ppm | -1000+5000 | |
| Oscillation Mode | - | Fund | |
| Crystal cutting type | - | AT CUT (thickness shear mode) | |
| Measure equipment | - | HP E5100A or equivalent | |
| Dimensions (L x W x H) | mm | 3.2 x 2.5 x 0.7 | SMD Seam Sealing Crystals / 8D Series |
| Reel Quantity | pcs per reel | 3,000 (WHITE) | |
| Base Material | Ceramics | ||
| Cover Material | 4J29 (Base Material) | ||
| Adhesive Material | Polymer | ||
| Electrode Material | Metal (Ag, Cr) | ||
| Metallizing Material | Tungsten, Gold, Nickel | ||
| Solder Material | Metal (Fe, Ni, Co, Ag) | ||
| Plating Material | Nickel | ||
| Chip Material | Quartz (SiO2) |
Marking
LOGO, Nominal Frequency (MHz), Line Code, Last three digits of Batch Number, Year/Month Code.
Reflow Condition
Standard Reel Quantity: 3,000 pcs per reel (WHITE)
Packing
EIA-481-2 Standard
Reliability Specifications
Mechanical Endurance: Vibration, Mechanical Shock, Drop Test, Resistance to Soldering Heat.
Environmental Endurance: High Temp & Humidity, Low Temp. Storage, Thermal Shock, Pressure Cooker Storage, High Temp. Storage, Helium Bombing, Fine Leak, Gross Leak Test.
Material Composition Declaration
Base (Ceramics): Al2O3, SiO2, Cr2O3, MgO, CaO
Cover (4J29 Base Material)
Adhesive (Polymer)
Electrode (Metal): Cr, Ag
Metallizing: W, Au, Ni
Solder: Fe, Ni, Co, Ag
Plating (Nickel)
Chip (Quartz): SiO2
2509161435_CHANGXING-ELECTRONICS-8DSC327G0010L_C51902148.pdf
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