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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
48MHz
Mfr. Part #:
3ESC480C0033L
Package:
SMD2016-4P
Key Attributes
Model Number:
3ESC480C0033L
Product Description
Product Overview
The CHANGXING ELECTRONICS CO.,LTD. 2.0x1.6mm SMD Crystal Oscillator (Model: 3ESC480C0033L) is an ultra-small, seam-sealed clock crystal oscillator unit designed for IT product applications including WLAN, Bluetooth, DSC, and DSL. It features CMOS output, a tri-state function, and is RoHS Compliant/Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Origin: Fujian Province, China
- Series: 3E Series
- Output Type: CMOS Output
- Compliance: RoHS Compliant / Pb Free
- Sealing: Seam sealed
- Package Type: SMD
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 48.000000 | MHz | |
| Tolerance @ 25 Degree | 10 | ppm | |
| Stability over Operation Temp. | 20 | ppm | |
| Input Voltage (VDD) | 1.83.3 | Vdc | |
| Input Current (IDD) | 5 | A max | @ 10%VDD |
| Standby current | 5 | A max | |
| Output Load | 15 | pF max | |
| Rise/Fall Time | 5 | ns max | |
| Output Voltage VOL | < 10%VDD | V | |
| Output Voltage VOH | > 90%VDD | V | |
| Start-up Time | 10 | ms max | |
| Aging | 3 | ppm/year | |
| Operating Temperature Range | -4085 | ||
| Storage Temperature Range | -55125 | ||
| Jitter (rms) | 5010% | ps | |
| Output State Control | Enable/disable | ||
| Output Waveform | COMS | ||
| Output Symmetry | % | ||
| Fundamental Oscillation mode | |||
| MSL Level | 1 | IPC/JEDEC J-STD-033C | |
| Dimensions | 2.0x1.6x0.75 | mm | |
| Product No. | 3ESC480C0033L | ||
| Model | 2.01.6 OSC 48.000000MHz | ||
| Product Weight | 8.144 | mg | For OSC 2016 |
Reflow Condition
Temperature profile for reflow soldering:
Peak: 250+50
Soldering zone: 230 or more, 3010s.
Pre-heating zone 1: 150180, 9030s
Soldering iron method:
Bit temperature: 35010
Application time of soldering iron: 3+1 s
Packing
EIA-481-2
Reliability Specifications
Standard test condition (TEMP.: 2015. Relative humidity: 6520%). For any discrepancy in GO/NG, test will be done at TEMP. 252. R.H. 655%.
| ITEM | TEST METHOD | SPECIFICATION |
|---|---|---|
| High Temperature Storage | GB/T 2423.2-2001, Method Ba | Spending 72 hrs at 125C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test5ppm. |
| Low Temperature Storage | GB/T 2423.1-2001, Method Aa | Spending 72 hrs at -55C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test5ppm. |
| Humidity | GB/T 2423.3-2006, Method Cab | Spending 96 hrs at 40 C 3 C, with 90 3% R.H. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test5ppm. |
| Temperature Cycle | GB/T2423.22-2002, Method Nb | 10 cycles from -25C to 85C. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test5ppm. |
| Shock | GB/T 2423.5-1995, Method Ea | Peak 1000m/s, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axis of samples, 3 cycles /direction, total 18 cycles. Measurement taken after 1 hour. Frequency change after test5ppm. |
| Drop | GB/T 2423.8-1995, Method Ed | Free drop to the wooden plate from 1.0 m heights for 3 times. Frequency change after test5ppm. No visible damages. |
| Vibration | GB/T 2423.10-1995, Method Fc | Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h. 10 cycles in each direction of 3 axis. Measurement taken after 1 hour. Frequency change after test5ppm. |
| Resistance to Soldering Heat | GB/T 2423.28-2005, Test Tb Method 1B | In 255 5 solder bath for 2 0.5 seconds. There is noneed to do functioned test. Frequency change after test5ppm. No visible damages. Terminals shall be covered more than 95% with solder. |
| Solderability | GB/T 2423.28-2005, Method Tc | Passed through the re-flow oven under the following condition. Preheat to 150 C5C for 60 to 120sec, and peak 265 C5C for 10s3sec. Measurement taken after DUT being left at room temperature for at 242 hours. Frequency change after test5ppm. No visible damages. |
| Terminal Strength | JIS-C- 6429 Method 1 & 2 | Mount on a glass-epoxy board (100x50x1.6mm), then bend to 2mm displacement (velocity 1mm/sec) and keep for 5 seconds. or pulling force 0.5 kg for at least 60 seconds. Frequency change after test5ppm. No visible damage. |
Material Composition Declaration
| No. | Name of Part | Material Name | Constituent name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|
| 1 | Base | Ceramics | Al2O3 | 1344-28-1 | 63.88% |
| SiO2 | 14464-46-1 | 3.79% | |||
| Cr2o3 | 1308-38-9 | 1.29% | |||
| Mo | 7439-33-7 | 1.00% | |||
| Fe | 7440-33-7 | 9.25% | |||
| Ni | 7439-89-6 | 8.85% | |||
| Co | 7440-02-0 | 4.75% | |||
| Ag | 7440-48-4 | 2.98% | |||
| Cu | 7440-22-4 | 2.80% | |||
| 2 | Lid | Kovar | Fe | 7440-33-7 | 54.00% |
| Co | 7440-48-4 | 17.02% | |||
| Ni | 7440-02-0 | 28.32% | |||
| 3 | Epoxy | Conductive Resin | Adhesive Resin | - | 100.00% |
| 4 | Blank | Quartz | SiO2 | 14808-60-7 | 100.00% |
| 5 | Wire | Gold | Au | 7440-57-5 | 100.00% |
| 6 | IC | Silicon | Silicon | 7440-21-3 | 100.00% |
| 7 | Electrode | Electrode | Ag | 7440-22-4 | 100.00% |
| Silver | 7440-22-4 | 74.00% | |||
| Ethyl alcohol | 64-17-5 | 0.60% | |||
| Bisphenol A-epichlorohydrin polymer | 25068-38-6 | 0.60% | |||
| Xylenes (o-, m-, p-isomers) | 1330-20-7 | 0.60% | |||
| Ethylbenzene | 100-41-4 | 0.06% | |||
| Silicone resin | - | 8.62% | |||
| Silica | - | 8.52% | |||
| Petroleum solvents | - | 7.00% | |||
| 8 | Plate | Kovar | W | 7440-50-8 | 1.04% |
| Au | 7440-02-0 | 0.24% | |||
| Ni | 7440-57-5 | 0.13% | |||
| Ni | 7440-02-0 | 0.66% |
2508051500_CHANGXING-ELECTRONICS-3ESC480C0033L_C48927832.pdf
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