Product Overview
The Glass5032 2PIN 25.000000MHz 9ASC250G0012L is a 5.0x3.2x1.2mm SMD Glass Sealing Crystal from the 9A Series, manufactured by CHANGXING ELECTRONICS CO.,LTD. This quartz crystal resonator features 2 pads, SMD glass sealing, and offers high reliability, tight tolerance, and stability. It is designed for automatic mounting and reflow soldering, making it a cost-effective and well-delivered choice for portable PCs, PDAs, DSCs, and USB interface cards. The sealing glass contains Pb, exempted by the RoHS directive.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Model: Glass5032 2PIN 25.000000MHz 9ASC250G0012L
- Series: 9A Series
- Type: Quartz Crystal Resonator
- Sealing: SMD Glass Sealing
- Origin: Fujian, China
- RoHS Exemption: Contains Pb in sealing glass exempted by RoHS directive.
Technical Specifications
| Parameter | Specification | Notes |
|---|---|---|
| Nominal Frequency | 25.000000 MHz | |
| Dimensions | 5.0 x 3.2 x 1.2 mm | |
| Oscillation Mode | Fund | |
| Load Capacitance | 12 pF | |
| Frequency Tolerance (at 25) | 10 ppm | |
| Frequency Tolerance (Over Operating Temp. Range) | 30 ppm | |
| Operating Temperature | -40 to +85 | |
| Storage Temperature Range | -55 to +125 | |
| Aging (1st Year) | 3 ppm | |
| Drive Level | 100 uW | Max. |
| Effective Resistance (Rr) | 40 | Max. |
| Shunt Capacitance (C0) | 5 pF | Max. |
| Insulation Resistance | 500 M | Min. at DC 100V |
| Pulling Sensitivity (TS) | - | |
| Spurious Response | -3.0 dB | Max. |
| Crystal Cutting Type | AT CUT (thickness shear mode) | |
| Standard Reel Quantity | 1,000 pcs per reel | (WHITE) |
| Product Weight | 52.850 mg |
Marking: LOGO, Nominal Frequency (MHz), Line Code, Last three digits of Batch Number, Year-Month Code (4-year cycle).
Reflow Condition: Refer to standard reflow soldering profiles.
Packing: EIA-481-2 standard reel.
Reliability Specifications: Includes Mechanical Endurance (Drop Test, Mechanical Shock, Vibration) and Environmental Endurance (Resistance To Soldering Heat, Thermal Shock, High Temp. Storage, Low Temp. Storage, High Temp & Humidity, Gross Leak, Fine Leak, Solderability).
Material Composition Declaration: Base (Ceramics), Adhesive (Polymer), Electrode (Metal), Cover (Glass), Plating (Metal), Wafer (Quartz).
2504101957_CHANGXING-ELECTRONICS-9ASC250G0012L_C46613810.pdf
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