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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
12pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
16MHz
Mfr. Part #:
8DSC160G0012L
Package:
SMD3225-4P
Key Attributes
Model Number:
8DSC160G0012L
Product Description
Product Overview
The Seam3225 4PIN 16.000000MHz 8DSC160G0012L is a high-precision Quartz Crystal Resonator from CHANGXING ELECTRONICS CO.,LTD. Designed for high frequency stability and excellent EMI reduction, this SMD component is ideal for demanding applications in Bluetooth, wireless communication sets, DSC, PDA, and mobile phones. It is RoHS Compliant and Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Model: Seam3225 4PIN 16.000000MHz 8DSC160G0012L
- Product Type: Quartz Crystal Resonator
- Sealing Type: Seam Sealing
- Series: 8D Series
- Certifications: RoHS Compliant / Pb Free
- Origin: Fujian, China
Technical Specifications
| Parameter | Units | Min. | Max. | Notes |
|---|---|---|---|---|
| Nominal Frequency | MHz | 16.000000 | Fund | |
| Frequency Tolerance at 25 3 | ppm | 10 | ||
| Load Capacitance | pF | 12 | ||
| Operating Temperature Range | -40 | +85 | ||
| Storage Temperature Range | -55 | +125 | ||
| Aging (1st Year) | ppm | 3 | at DC 100V | |
| Frequency Tolerance | ppm | 30 | Over Operating Temp. Range | |
| Pulling Sensitivity | ppm/pF | 12 | TS | |
| Motional Capacitance C1 | fF | 5 | ||
| Shunt Capacitance C0 | pF | 5 | Max. | |
| Effective Resistance Rr | 40 | Max. | ||
| Drive Level | uW | 100 | Max. | |
| Insulation Resistance | M | 500 | Min. | |
| Spurious Response | dB | -3.0 | ||
| Dimensions (L x W x H) | mm | 3.2 x 2.5 x 0.7 | SMD | |
| Reel Quantity | pcs | 3,000 | per reel (WHITE) | |
| Product Weight | mg | 17.322 |
| Dimension | Value (mm) | Tolerance (mm) |
|---|---|---|
| A | 1.40 | 0.1 |
| B | 3.40 | 0.1 |
| C | 2.70 | 0.1 |
| D | 4.00 | 0.1 |
| E | 8.0 | 0.2 |
| F | 4.00 | 0.11 |
| G | 1.55 | 0.05 |
| H | 1.75 | 0.1 |
| L | 178 | 1.0 |
| L1 | 13 | 0.5 |
| W | 11.5 | 0.2 |
| W1 | 8.0 | +1.0 |
| Test Item | Test Methods | REF.DOC |
|---|---|---|
| 1.Mechanical Endurance | ||
| Vibration | Perpendicular axes each test time 4 hours Amplitude 1.52 mm/20G | JIS C6701 |
| Mechanical Shock | Device are shocked to half sine wave ( 1000 G ) three mutually perpendicular axes each 3 times. 0.5m sec. duration time | MIL-STD-202F |
| Drop Test | 150 cm height,3 times on concrete floor | JIS C6701 |
| Resistance To Soldering Heat | Pre-heat time 60 120 sec. Pre-heat temperature 260 5 Test time 10 1 sec. | MIL-STD-883E |
| Solderability | Flux Rosin resin methyl alcohol solvent ( 1 : 4 ) Immersion time 5 1 seconds | IEC-68-02-27 |
| 2.Environmental Endurance | ||
| High Temp & Humidity | 85 3 , RH 85% , 500Hrs | JIS C5023 |
| Low Temp. Storage | - 40 3 for 500 12 hours | MIL-STD-883E |
| High Temp. Storage | + 125 3 for 500 12 hours | MIL-STD-883E |
| Thermal Shock | Total 100 cycles of the following temperature cycle ( -40 to +125 ) Sweep time 20 minute | MIL-STD-883E |
| Pressure Cooker Storage | 125 3 , RH100% , 2 bar , 240Hrs | MIL-STD-883E |
| Helium Bombing | 4.5 Kgf / cm2 for 2 hr | MIL-STD-883E |
| Fine Leak | Standard Sample For Automatic Gross Leak Detector, Test Pressure: 2Kg / cm2 | |
| Gross Leak Test | Test temperature 260 5 Immersing depth 0.5 mm minimum | |
| Part | Material Name | Material Mass (mg) | Material Mass (%) | Constituent Name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|---|
| 1 Base | Ceramics | 15.01 | 86.65% | Al2O3 | 1344-28-1 | 92.40% |
| SiO2 | 7631-86-9 | 4.31% | ||||
| Cr2o3 | 1308-38-9 | 1.50% | ||||
| MgO | 1309-48-4 | 0.69% | ||||
| CaO | 1305-78-8 | 1.10% | ||||
| 2 Cover | Metallizing | Fe | 7439-89-6 | 40.70% | ||
| Ni | 7440-02-0 | 21.80% | ||||
| Co | 7440-48-4 | 12.80% | ||||
| Ag | 7440-22-4 | 21.00% | ||||
| Cu | 7440-50-8 | 3.70% | ||||
| 3 Adhesive | Polymer | 0.45 | 2.60% | |||
| 4 Blank | ||||||
| 5 Electrode | Metal | 3.62 | 20.91% | W | 7440-33-7 | 62.50% |
| Au | 7440-57-5 | 4.61% | ||||
| Ni | 7440-02-0 | 32.89% | ||||
| 6 Solder | Metal | 6.40 | 36.95% | Fe | 7439-89-6 | 47.71% |
| Ni | 7440-02-0 | 26.11% | ||||
| Co | 7440-48-4 | 15.44% | ||||
| Ni (Plating) | 7440-02-0 | 10.74% | ||||
| Ag | 7440-22-4 | 75.00% | ||||
| Cr | 7440-47-3 | 5.56% | ||||
| SiO2 | 14808-60-7 | 100.00% | ||||
| Crystalline Silicon Dioxide | 5.00% | |||||
| Petroleum Solvent | 5.00% | |||||
| Silicone Resin | 15.00% | |||||
| 4J29 (Base Material) | 0.20 | |||||
| SiO2 | 14808-60-7 | 100.00% | ||||
| Cr | 7440-47-3 | 5.56% | ||||
| Ag | 7440-22-4 | 94.44% | ||||
| 4J29 (Base Material) | 0.05 | |||||
| SiO2 | 14808-60-7 | 100.00% |
2504101957_CHANGXING-ELECTRONICS-8DSC160G0012L_C46613748.pdf
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