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quality frequency CHANGXING ELECTRONICS 8DSC160G0009L quartz crystal resonator for PDA mobile and communication devices factory
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quality frequency CHANGXING ELECTRONICS 8DSC160G0009L quartz crystal resonator for PDA mobile and communication devices factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
9pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
16MHz
Mfr. Part #:
8DSC160G0009L
Package:
SMD3225-4P
Key Attributes
Model Number: 8DSC160G0009L
Product Description

Product Overview

The Seam3225 Quartz Crystal Resonator is a high-precision, high-frequency stability component designed for demanding applications. It excels at reducing EMI effects, making it an ideal choice for Bluetooth devices, wireless communication sets, DSCs, PDAs, and mobile phones. This RoHS Compliant and Pb Free product offers reliable performance with a nominal frequency of 16.000000MHz.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Product Model: Seam3225 4PIN 16.000000MHz 8DSC160G0009L
  • Product Series: 8D Series
  • Origin: Fujian Province, China
  • Certifications: RoHS Compliant / Pb Free
  • Material Composition: Detailed breakdown available in Material Composition Declaration.

Technical Specifications

Parameter Units Specification Notes
Nominal Frequency MHz 16.000000 Fund
Frequency Tolerance ppm 10 at 25 3
Load Capacitance pF 9
Frequency Tolerance ppm 30
Operating Temperature Range -40+85
Storage Temperature Range -55+125
Aging ppm/Year 3 1st Year
Pulling Sensitivity ppm/pF TS
Shunt Capacitance pF 5 Max. C0
Motional Capacitance fF C1
Effective Resistance 40 Max. Rr
Drive Level uW 100 0.01100W/Step
Insulation Resistance M 500 Min. at DC 100V
Spurious Response dB -3.0
Dimensions (LxWxH) mm 3.2 x 2.5 x 0.7 SMD
Reel Quantity pcs per reel 3,000 (WHITE)

Packing

EIA-481-2 Standard Reel Quantity: 3,000 pcs per reel (WHITE).

Material Composition Declaration

Product Name: Seam 3225

Product Weight: 17.322 mg

Part Material Name Material Mass (mg) Material Mass (%) Constituent Name CAS No. Material Analysis (%)
1 Base Ceramics 23.09% Al2O3 1344-28-1 92.40%
SiO2 7631-86-9 4.31%
Cr2o3 1308-38-9 1.50%
MgO 1309-48-4 0.69%
CaO 1305-78-8 1.10%
2 Housing Metallizing
Fe 7439-89-6 40.70%
Ni 7440-02-0 21.80%
Co 7440-48-4 12.80%
Ag 7440-22-4 21.00%
Cu 7440-50-8 3.70%
3 Electrode Metal W 7440-33-7 62.50%
Au 7440-57-5 4.61%
Ni 7440-02-0 32.89%
Fe 7439-89-6 47.71%
4 Electrode (Plating) Ni Ni 7440-02-0 26.11%
Co 7440-48-4 15.44%
Ni 7440-02-0 10.74%
5 Adhesive Polymer Ag 7440-22-4 75.00%
Crystalline Silicon Dioxide 5.00%
Petroleum Solvent 5.00%
Silicone Resin 15.00%
6 Solder Metal Sn 6.40%
Ag 7440-22-4 3.60%
Cu 7440-50-8 0.50%
Sb 0.10%
Bi 0.00%
Zn 0.00%
Fe 0.00%
Ni 0.00%
Al 0.00%
Cd 0.00%
Pb 0.00%
In 0.00%
Ag 7440-22-4 94.44%
SiO2 14808-60-7 100.00%
Cr 7440-47-3 5.56%
Ag 7440-22-4 94.44%

2504101957_CHANGXING-ELECTRONICS-8DSC160G0009L_C46613747.pdf

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