Product Overview
The CKST10045-68uH/M is a SMD molding power inductor from Cenker Technology Group. Designed for general electronic equipment, it offers a nominal inductance of 68H with a tolerance of 20%. Key applications include audio-visual entertainment, home appliances, computers, office automation, communications, power modules, LED lighting, measuring equipment, machine tools, and industrial control boards. This product is suitable for use in standard operating conditions and methods.
Product Attributes
- Brand: Cenker
- Product Type: SMD Molding Power Inductor
- Series Name: CKST
- Material: Powder Metal Alloy Powder, Copper Wire, Copper Clip (Sn plated), Marking Ink
- Origin: Shenzhen, China
- MSL Rating: MSL, level 1
Technical Specifications
| Specification | Value | Test Condition | Notes |
|---|---|---|---|
| Product Model | CKST10045-68uH/M | - | Nominal Inductance: 68H, Inductance Tolerance: 20% |
| Drawing Number | SP-CK112-00061094 | - | - |
| Dimensions (mm) | A: 11.6 Max., B: 10.10.3, C: 4.5 Max., D: 2.50.5, E: 3.00.5 | - | Refer to diagram |
| Operating Temperature | -40 ~ +125 | Including self-temperature rise | - |
| Storage Temperature | -40 ~ +125 | - | - |
| Inductance | 68H 20% | 100kHz/1V | - |
| DCR (DC Resistance) | 205m Max. | at 25 | - |
| Isat (Saturation Current) | 3A | L0A70% Ref. 100kHz/1V | DC current at which inductance drops approx. 30% |
| Irms (RMS Current) | 2.3A Typical | T 40 (from 25 ambient) | DC current causing temperature rise |
| Absolute Maximum Voltage | DC 75V | - | - |
| Reflow Soldering Profile | Peak: 260 (20~40 Sec), Preheat: 150~200 (60~180 Sec), Cooling: 3/sec max, Ramp-up: 3/sec max | - | Refer to profile diagram |
| Iron Soldering | Power: Max. 30W, Pre-heating: 150 (1 Min), Tip Temp: 350 Max., Time: 3sec Max. | - | - |
| Packaging Quantity | 800 Pcs/Reel, 1600 Pcs/Box, 3200 Pcs/Carton | - | - |
| Storage Conditions | -10 ~ 40C, 70% RH | Within 12 months | Solderability may deteriorate if exceeded |
Important Usage Notes
- Consider non-magnetic shielded component placement to avoid magnetic interference.
- Do not place near magnets or magnetic objects.
- Avoid storage in high temperature, high humidity, dusty, or corrosive environments.
- Allow for thermal design margin due to self-heating during operation.
- Use anti-static wrist straps during handling.
- Avoid direct contact with terminals to prevent reduced solderability from hand grease.
- Do not excessively bend terminals to prevent disconnection.
- The product is sensitive to direct impact, which can damage the magnetic core.
- When potting or gluing, be aware of potential stress on the core/skeleton, degradation of insulation/materials, and changes in high-frequency characteristics.
- Surface rust may occur on alloy or non-coated products in humid environments but does not affect characteristics.
- For applications beyond general electronic equipment (e.g., automotive, medical, military, aerospace, submarine), contact the sales department for consultation.
2411041754_CENKER-CKST10045-68uH-M_C5292040.pdf
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