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Specifications
Current - Saturation (Isat):
10A
Mfr. Part #:
CKST1004-6.8uH/M
Package:
SMD,11.6x10.1mm
Key Attributes
Model Number:
CKST1004-6.8uH/M
Product Description
Product Overview
The Cenker CKST1004-6.8uH/M is a surface-mount (SMD) molding power inductor designed for general electronic equipment. It features a metal alloy powder core and copper wire construction, offering reliable performance in various applications including audio-visual entertainment, home appliances, computers, office automation, communications, power modules, LED lighting, measuring equipment, machine tools, and industrial control boards. This inductor is suitable for use in standard operating conditions and is engineered to withstand operating temperatures from -40 to +125.
Product Attributes
- Brand: Cenker
- Product Type: SMD Molding Power Inductor
- Origin: Shenzhen Cenker Technology Group Co., Ltd.
- Core Material: Powder Metal Alloy Powder
- Wire Material: Copper Wire
- Clip Material: Copper plated with Sn
- Marking Ink: Standard Marking Ink
Technical Specifications
| Specification | Details | Test Condition | Test Equipment |
|---|---|---|---|
| Cenker P/N | CKST1004-6.8uH/M | - | - |
| Drawing No. | SP-CK112-00058944 | - | - |
| Product Identification | CKST 1004 6.8 uH M | - | - |
| Dimensions (mm) | A: 11.6 Max., B: 10.10.3, C: 4.0 Max., D: 2.50.5, E: 3.00.5 | - | - |
| Operating Temperature | -40 ~ +125 (Including self-temperature rise) | - | - |
| Storage Temperature | -40 ~ +125 | - | - |
| Inductance | 6.8H 20% | 100kHz/1V | ZX1378+ZX1378S |
| DCR (DC Resistance) | 25m Max. | at 25 | Keysight 34420A |
| Isat (Saturation Current) | 10A (L0A70% Ref.) | 100kHz/1V | ZX1378+ZX1378S |
| Irms (Current for Temp. Rise) | 8A Typical (T40) | - | ZX1378+ZX1378S+ TES1316 |
| Absolute Maximum Voltage | DC 75V | - | - |
| Packaging Quantity (Pcs) | 1000 (1 Reel), 2000 (2 Reel/Box), 4000 (2 Box/Carton) | - | - |
| Reflow Soldering Peak Temp. | 260 | 20~40 Sec. | - |
| Reflow Soldering Pre-heating Temp. | 150~200 | 60~180 Sec. | - |
| Reflow Soldering Reflow Temp. | 217 | 60~150 Sec. | - |
| Iron Soldering Power | Max. 30W | - | - |
| Iron Soldering Tip Temp. | 350 Max. | - | - |
| Iron Soldering Time | 3 sec Max. | - | - |
| Recommended Storage Time | Within 12 months | Temp: -10 ~ 40C, Humidity: 70%RH | - |
Matters Needing Attention
- Consider non-magnetic shielded component placement on PCB to avoid magnetic interference.
- Do not place near magnets or magnetic objects.
- Avoid storage in high temperature, high humidity, dusty, or corrosive environments.
- Account for self-heating during operation in thermal design.
- Use anti-static wrist straps during handling.
- Avoid direct contact with terminals to prevent solderability issues due to grease.
- Do not excessively bend terminals to prevent disconnection.
- The product is sensitive to direct impact, which can cause core damage.
- When potting or gluing, be aware of potential stress on the core and skeleton, and check for material compatibility to avoid degradation of insulation, skeleton, or glue, and potential changes in high-frequency characteristics.
- Surface rust may occur on alloy or non-coated products in humid environments but does not affect characteristics.
- This product is intended for general electronic equipment; use in specialized applications (e.g., automotive, medical, military, aerospace, submarine) requires consultation with the sales department.
2411041754_CENKER-CKST1004-6-8uH-M_C5292037.pdf
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