Product Overview
The CKST1206-15uH/M is a SMD Molding Power Inductor manufactured by Shenzhen Cenker Technology Group Co., Ltd. Designed for general electronic equipment, it offers reliable performance with a nominal inductance of 15H and a tolerance of 20%. This component is suitable for applications including audio-visual entertainment, home appliances, computers, office automation, communications, power modules, LED lighting, measuring equipment, machine tools, and industrial control boards. It operates within a temperature range of -40 to +125 and has a DC current rating of 9.2A for saturation and 9A for RMS current with a maximum temperature rise of 40.
Product Attributes
- Brand: Cenker
- Product Type: SMD Molding Power Inductor
- Origin: Shenzhen, China
- Materials: Powder Metal Alloy Powder, Copper Wire, Copper Clip (Sn plated), Marking Ink
- MSL Rating: MSL, Level 1
Technical Specifications
| Specification | Value | Test Condition | Notes |
|---|---|---|---|
| Model Number | CKST1206-15uH/M | - | Series: CKST, Dimensions: 1206, Inductance: 15uH, Tolerance: M (20%) |
| Nominal Inductance | 15H | 100kHz / 1V | 20% Tolerance |
| DC Resistance (DCR) | 29m Max. | at 25 | - |
| Saturation Current (Isat) | 9.2A | L0A 70% Ref. (100kHz / 1V) | DC current at which inductance drops ~30% |
| RMS Current (Irms) | 9A Typical | T 40 (from 25 ambient) | DC current causing temperature rise |
| Operating Temperature | -40 ~ +125 | Including self-temperature rise | - |
| Storage Temperature | -40 ~ +125 | - | - |
| Absolute Maximum Voltage | DC 75V | - | - |
| Dimensions (mm) | 13.8 (Max) x 12.60.3 x 6.0 (Max) x 2.70.7 x 3.50.5 | A x B x C x D x E | Refer to drawing SP-CK112-00048963 |
| Recommended PCB Pattern Size (mm) | 15.0 (Length) x 10.5 (Width) x 4.5 (Height) | - | - |
| Packaging Quantity | 400 Pcs/Reel, 800 Pcs/Box, 1600 Pcs/Carton | - | 1 Reel, 2 Reel/Box, 2 Box/Carton |
| Reflow Soldering Profile | Peak: 260 (20~40 Sec), Pre-heating: 150~200 (60~180 Sec), Cooling Ramp-down: 6/sec max, Ramp-up: 3/sec max | - | Refer to profile diagram |
| Iron Soldering | Power: Max.30W, Pre-heating: 150 (1 Min), Tip Temp: 350 Max., Time: 3sec Max. | - | - |
| Storage Conditions | -10 ~ 40C, Humidity 70% RH | Within 12 months | Solderability may deteriorate if exceeded |
Matters Needing Attention
- Consider non-magnetic shielded component placement to avoid magnetic interference.
- Avoid placing near magnets or magnetic objects.
- Do not store in high temperature, high humidity, dusty, or corrosive environments.
- Allow for thermal design margin due to self-heating during operation.
- Use anti-static wrist straps.
- Avoid direct contact with terminals due to potential grease contamination affecting solderability.
- Do not excessively bend terminals to prevent breakage.
- The product is sensitive to direct impact, which can cause core damage.
- When potting or gluing, be aware of potential stress and degradation of materials; check compatibility.
- Surface rust may occur on alloy or non-coated products in humid environments but does not affect characteristics.
- This product is intended for general electronic equipment. For specialized applications (automotive, medical, military, aerospace, submarine), contact the sales department for consultation.
2411041754_CENKER-CKST1206-15uH-M_C5292047.pdf
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