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Specifications
Current Rating:
3A
Inductance:
2.2uH
Tolerance:
±20%
Current - Saturation (Isat):
4A
DC Resistance(DCR):
70mΩ
Mfr. Part #:
CKST04015-2.2uH/M
Package:
SMD,4.4x4.2mm
Key Attributes
Model Number:
CKST04015-2.2uH/M
Product Description
Product Overview
The CKST04015-2.2uH/M is a SMD molding power inductor designed for general electronic equipment in applications such as audio-visual entertainment, home appliances, computers, office automation, communications, power modules, LED lighting, measuring equipment, machine tools, and industrial control boards. It is manufactured by SHENZHEN CENKER TECHNOLOGY GROUP CO., LTD. and is designed to operate reliably in standard operating conditions. Key features include its compact dimensions and specific electrical characteristics for power applications. The product is sensitive to direct impact and requires careful handling to prevent core damage.
Product Attributes
- Brand: Cenker
- Manufacturer: SHENZHEN CENKER TECHNOLOGY GROUP CO., LTD.
- Product Type: SMD Molding Power Inductor
- Series Name: CKST
- Origin: Shenzhen, China
- Material (Core): Powder Metal Alloy Powder
- Material (Wire): Copper Wire
- Material (Clip): Copper plated with Sn
- Marking: Black Ink
Technical Specifications
| Specification | Value | Test Condition / Notes |
|---|---|---|
| Cenker P/N | CKST04015-2.2uH/M | |
| Drawing No. | SP-CK112-00059076 | |
| Nominal Inductance | 2.2 H | |
| Inductance Tolerance | 20% | |
| External Dimensions (L x W x H) | 4.40.35 mm (A) x 4.20.3 mm (B) x 1.5 mm Max (C) | |
| Other Dimensions | 0.80.3 mm (D) x 1.50.3 mm (E) | |
| DCR (DC Resistance) | 70 m Max. | at 25 |
| Isat (Saturation Current) | 4 A | Inductance drops approx 30% from its value without current (L0A x 70% Ref. 100kHz/1V) |
| Irms (Rms Current) | 3 A Typical | Causes temperature rise (T 40) from 25 ambient |
| Operating Temperature | -40 ~ +125 | Including self-temperature rise |
| Storage Temperature | -40 ~ +125 | |
| Absolute Maximum Voltage | DC 75V | |
| Packaging Quantity per Reel | 3000 Pcs | |
| Packaging Quantity per Box | 9000 Pcs | (3 Reel/Box) |
| Packaging Quantity per Carton | 18000 Pcs | (2 Box/Carton) |
| Reflow Soldering Peak Temperature | 260 | 20~40 Sec |
| Reflow Soldering Pre-heating Temperature | 150~200 | 60~180 Sec |
| Reflow Soldering Ramp-up Rate | 3/sec max | |
| Reflow Soldering Ramp-down Rate | 6/sec max | |
| Iron Soldering Temperature | 350 Max. | 3 sec Max. |
| Terminal Strength Test | 10N Static pulling force | Parallel to terminals for 5 Seconds. No breakage or loosening. |
| Solderability Test | 90% min. solder coverage | Solder temp: 2455, 5s immersion. |
| Heat Endurance (Reflow Soldering) | Inductance change Within 10% | Reflow soldering 3 times (Peak temp: 2605). |
| Humidity Test | Inductance change Within 10% | 602, 90%95% RH, 96 hours. |
| High Temperature Storage Test | Inductance change Within 10% | 1252, 96 hours. |
| Low Temperature Storage Test | Inductance change Within 10% | -402, 96 hours. |
| Thermal Shock Test | Inductance change Within 10% | 100 cycles (-40 30 min 125 30 min). |
| Vibration Test | Inductance change Within 10% | 10~55Hz, 1.5mm amplitude, 6 hours (X, Y, Z directions). |
| Recommended Storage Conditions | -10 40C, 70% RH | Within 12 months. |
Usage Precautions
- Consider installation position to avoid magnetic interference from non-magnetic shielded components.
- Do not place near magnets or objects with magnetic force.
- Avoid storage in high temperature, high humidity, dusty, or corrosive environments (salt, acid, alkali, etc.).
- Allow sufficient margin for thermal design as the product self-heats during operation.
- Use anti-static wrist straps to prevent static discharge.
- Avoid direct contact with terminals with greasy hands to maintain solderability.
- Do not excessively bend terminals to prevent disconnection.
- The product is sensitive to direct impact, which can damage the magnetic core.
- When potting or gluing, be aware of material shrinkage, potential stress on the core/skeleton, and compatibility with insulation layers and adhesives. Potting materials can affect high-frequency characteristics.
- For alloy or non-coated products, surface rust may occur in humid environments but does not affect characteristics.
- This product is intended for general electronic equipment. For specialized applications (automotive, medical, military, aerospace, submarine, etc.), contact the sales department for customized solutions.
2410121450_CENKER-CKST04015-2-2uH-M_C7463271.pdf
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