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quality SMD Molding Power Inductor Cenker CKST04015-3.3uH/M Designed for Power Modules and Industrial Control factory
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quality SMD Molding Power Inductor Cenker CKST04015-3.3uH/M Designed for Power Modules and Industrial Control factory
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Specifications
Current Rating:
2.5A
Inductance:
3.3uH
Tolerance:
±20%
Current - Saturation (Isat):
3A
DC Resistance(DCR):
100mΩ
Mfr. Part #:
CKST04015-3.3uH/M
Package:
SMD,4.4x4.2mm
Key Attributes
Model Number: CKST04015-3.3uH/M
Product Description

Product Overview

The Cenker CKST04015-3.3uH/M is a SMD Molding Power Inductor designed for general electronic equipment. It is suitable for applications including audio-visual entertainment, home appliances, computers, office automation, communications, power modules, LED lighting, measuring equipment, machine tools, and industrial control boards. This inductor operates within a temperature range of -40 to +125 (including self-temperature rise). It is manufactured by Shenzhen Cenker Technology Group Co., Ltd.

Product Attributes

  • Brand: Cenker
  • Product Type: SMD Molding Power Inductor
  • Origin: Shenzhen, China
  • Material: Powder Metal Alloy Powder, Copper Wire, Copper Clip (Sn plated), Marking Ink (Black)

Technical Specifications

Specification Details
Cenker P/N CKST04015-3.3uH/M
Drawing No. SP-CK112-00059077
Series Name CKST
External Dimensions 0415
Nominal Inductance 3.3 uH
Inductance Tolerance M (20%)
Dimensions (mm) A: 4.40.35, B: 4.20.3, C: 1.5 Max, D: 0.80.3, E: 1.50.3
Operating Temperature -40 ~ +125 (Including self-temperature rise)
Storage Temperature -40 ~ +125
Inductance (Test Condition) 3.3H 20% at 100kHz/1V
DCR (Max.) 100m at 25
Isat (Min. Inductance Drop) 3A (L0A70% Ref. 100kHz/1V)
Irms (Max. Temp Rise) 2.5A (T40)
Absolute Maximum Voltage DC 75V
Packaging Quantity (Reel) 3000 Pcs
Packaging Quantity (Box) 9000 Pcs (3 Reel/Box)
Packaging Quantity (Carton) 18000 Pcs (2 Box/Carton)
Reflow Soldering Peak Temperature 260 (20~40 Sec)
Iron Soldering Power Max. 30W
Iron Soldering Tip Temperature 350 Max.
Iron Soldering Time 3sec Max.
Terminal Strength Test Static pulling force of 10N for 5 Seconds. No terminal breakage or loosening.
Solderability Test Solder temperature: 2455, 5s immersion. 90% min. solder coverage on terminal area.
Humidity Test 602, 90%95% RH, 96 hours. Inductance change within 10%.
High Temperature Storage Test 1252, 96 hours. Inductance change within 10%.
Low Temperature Storage Test -402, 96 hours. Inductance change within 10%.
Thermal Shock Test -40 to 125, 100 cycles. Inductance change within 10%.
Vibration Test 10~55Hz, 1.5mm amplitude, 6 hours total. Inductance change within 10%.
Recommended Storage Conditions Temperature -10 ~ 40C, Humidity 70%RH Max. (Within 12 months)

Usage Precautions

  • Consider non-magnetic shielded component placement to avoid magnetic interference.
  • Do not place near magnets or magnetic objects.
  • Avoid storage in high temperature, high humidity, dusty, or corrosive environments.
  • Account for self-heating during operation in thermal design.
  • Use anti-static wrist straps.
  • Avoid direct contact with terminals to prevent decreased solderability due to hand grease.
  • Do not excessively bend terminals.
  • The product is sensitive to direct impact, which can damage the magnetic core.
  • When potting or gluing, be aware of material shrinkage, potential stress on components, and compatibility with insulation layers, skeletons, and adhesives. Potting materials can affect high-frequency characteristics.
  • For alloy or non-coated products, surface rust may occur in humid environments but does not affect characteristics.
  • This product is intended for general electronic equipment. For specialized applications (automotive, medical, military, aerospace, submarine, etc.), contact the sales department for consultation.
  • Solderability of terminal electrodes may deteriorate if storage time exceeds 12 months.

2410121450_CENKER-CKST04015-3-3uH-M_C7463272.pdf

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