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Specifications
Voltage Rating:
500V
Capacitance:
100nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
TCC1206X7R104K501HT
Package:
1206
Key Attributes
Model Number:
TCC1206X7R104K501HT
Product Description
Product Overview
The TCC1206X7R104K501HT is a Multilayer Chip Ceramic Capacitor (MLCC) with X7R dielectric material. X7R is a Class II dielectric, offering a higher capacitance compared to Class I dielectrics and stable temperature characteristics. This capacitor is suitable for applications requiring a wide capacitance range and less stringent stability requirements, such as DC-blocking, decoupling, bypassing, and frequency discriminating circuits.
Product Attributes
- Brand: Not specified
- Origin: Not specified
- Material: Ceramic Dielectric, Nickel Layer, Tin Layer
- Color: Not specified
- Certifications: RoHS, REACH, Halogen-free (implied by revision history)
Technical Specifications
| Specification | Details | Testing Condition |
| Product Name | Multilayer Chip Ceramic Capacitor | |
| Part Number | TCC1206X7R104K501HT | |
| Approval Sheet No. | DRAAW108M/1-2023 | |
| Dielectric Material | X7R (Class II) | |
| Capacitance | 104 (0.10F) | Within specified tolerance |
| Capacitance Tolerance | 10% | |
| Rated Voltage | 500VDC | |
| Temperature Characteristic | 15% (-55 to +125) | Capacitance change within 15% from -55 to +125, compared to 25 value. |
| Dimensions (L x W x T) | 3.20mm x 1.60mm x 1.60mm | |
| Appearance | Visual inspection | |
| Dissipation Factor (DF) | 7.0% | 1.00.2Vrms, 1KHz10% @ 253, <70%RH. (Requires aging treatment for Class II) |
| Insulation Resistance (IR) | 1G | Test voltage: 400V; Charge time: 605 sec; Temperature: 25 |
| Dielectric Strength | 750VDC for 5 seconds (Max. current 50mA) | |
| Adhesion | No removal of terminations or other defects. | Pressurizing force: 6N, Duration: 101 sec. |
| Solderability of Termination | 95% min. coverage of both terminal electrodes, <5% pin holes or rough spots. No remarkable visual damage. | Solder temperature: 2455, Dipping time: 21 sec. (Preheated: 120~150/60sec) |
| Resistance to Leaching | 95% min. coverage of both terminal electrodes, <5% pin holes or rough spots. No remarkable visual damage. | Solder temperature: 2705, Dipping time: 101 sec. |
| Bending | No remarkable visual damage; Capacitance change 10%. | Capacitor mounted on test jig, bent 1mm at 1.0mm/s. |
| Resistance to Soldering Heat | No remarkable visual damage, Cp change within 7.5%, DF and IR meet initial standard value. | Soldering temperature: 2705, Preheating: 120~150/60sec, Dipping time: 101 sec. (Measurement after 484 hrs recovery, with aging treatment for high dielectric constant type) |
| Temperature Cycle | No remarkable visual damage, Cp change within 7.5%. | 5 cycles: -55 (30min) -> 25 (2-3min) -> +125 (30min) -> 25 (2-3min). (Measurement after 484 hrs recovery, with aging treatment for high dielectric constant type) |
| Moisture Resistance (Steady State) | No remarkable visual damage, Cp change within 12.5%, DF 2x initial value, IR 100M. | 402, 90~95% RH, 500 12hrs. (Measurement after 484 hrs recovery, with aging treatment for high dielectric constant type) |
| Damp Heat with Load | No remarkable visual damage, Cp change 12.5%, DF 2x initial value, IR 50M. | 402, 90~95% RH, 100% rated voltage, 50mA max current, 500 12hrs. (Measurement after 48h recovery at room temp after 1h at 150, with initial measurement after soldering and 48h recovery) |
| Life Test | No remarkable visual damage, Cp change 12.5%, DF 2x initial value, IR 50M. | Max. Operating Temp. 3, 100% rated voltage, 50mA max current, 1000 hrs. (Measurement after 48h recovery at room temp after 1h at 150, with initial measurement after soldering and 48h recovery) |
| Packing (Tape Packing) | Dimensions of Packing Paper Type A, B, C, D, T | Specific dimensions vary by chip size (e.g., 1206: 2.000.04 L, 1.600.15 W, 1.1max T) |
2410121439_CCTC-TCC1206X7R104K501HT_C5448934.pdf
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