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Specifications
Voltage Rating:
50V
Capacitance:
100nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
TCC0402X7R104K500AT
Package:
0402
Key Attributes
Model Number:
TCC0402X7R104K500AT
Product Description
Product Overview
This document specifies the Multilayer Chip Ceramic Capacitor (MLCC) model TCC0402X7R104K500AT. It is a Class II capacitor utilizing X7R dielectric material, offering a high dielectric constant and stable temperature characteristics suitable for various circuit applications including DC-blocking, decoupling, bypassing, and frequency discriminating. The capacitor is designed for general-purpose use where a wide capacitance range and moderate stability are required.
Product Attributes
- Product Name: Multilayer Chip Ceramic Capacitor
- Part Number: TCC0402X7R104K500AT
- Approval Sheet No.: DRAAW108M/1-2023
- Issued Date: 2024/1/22
- Dielectric Material: X7R (Class II)
Technical Specifications
| Specification | Type | Technical Requirement | Testing Condition |
| Appearance | X7R | Visual inspection | - |
| Dimensions | 0402 | Within the specified dimensions | Using calipers on micrometer (l1/8L, w1/8W, t1/8T) |
| Capacitance | X7R (90~110nF) | Within the specified tolerance | 1.00.2Vrms, 1KHz10% (Test Temp: 253, Humidity: <70%RH. Aging treatment required: 150 for 1hr, then 48hrs measurement) |
| Dissipation Factor | X7R | DF7.0% | 1.00.2Vrms, 1KHz10% (Test Temp: 253, Humidity: <70%RH. Aging treatment required: 150 for 1hr, then 48hrs measurement) |
| Insulation Resistance | X7R | 1G | Test Voltage: 50V; Charge Time: 605sec; Temperature: 25 |
| Dielectric Strength | X7R (UR=50V) | - | Apply 125VDC for 5 seconds, max. current 50mA |
| Temperature Coefficient of Capacitance | X7R | Capacitance change within 15% | Measure capacitance at sequential temperatures (-55, 25, 125) relative to 25 (Test Temp: 253, Humidity: <70%RH) |
| Adhesion | X7R | No removal of the terminations or other defect | Pressurizing force: 6N, duration: 101sec |
| Solderability of Termination | X7R | 95% min-coverage of both terminal electrodes, <5% pin holes or rough spots | Solder Temp: 2455, Dipping time: 21 seconds |
| Resistance to leaching | X7R | 95% min-coverage of both terminal electrodes, <5% pin holes or rough spots, no cracking | Preheat: 120~150/60sec, Solder Temp: 2705, Dipping time: 101 seconds |
| Bending | X7R | No remarkable visual damage; Cp change 10% | Apply pressure at 1.0mm/s rate, 1mm deflection |
| Resistance to Soldering Heat | X7R | No remarkable visual damage, Cp change within 7.5%, DF and IR meet initial standard value | Preheating: 120~150/60sec, Soldering Temp: 2705, Dipping time: 101 seconds (Measurement after 140~150/1hr heat treatment and 484hrs at room temp) |
| Temperature Cycle | X7R | No remarkable visual damage, Cp change within 7.5% | 5 cycles of -55 to 125 (Measurement after 140~150/1hr heat treatment and 484hrs at room temp) |
| Moisture Resistance, steady state | X7R | Appearance no remarkable visual damage, Cp change within 12.5%, DF 2x initial, IR 100M | Test Temp: 402, Humidity: 90~95% RH, Testing time: 500 12hrs (Measurement after 140~150/1hr heat treatment and 484hrs at room temp) |
| Damp heat with load | X7R | Appearance no remarkable visual damage, Cp change 12.5%, DF 2x initial, IR 50M | Test Temp: 402, Humidity: 90~95% RH, Voltage: 100% of rated, Testing time: 500 12hrs (Measurement after 150/1h and 48h at room temp) |
| Durability Life Test | X7R | No remarkable visual damage, Cp change 12.5%, DF 2x initial, IR 50M | Test Temp: Max. Operating Temp. 3, Voltage: 100% of rated, Testing time: 1000 hrs (Measurement after 150/1h and 48h at room temp) |
2410121439_CCTC-TCC0402X7R104K500AT_C5448791.pdf
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