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quality Durable Coated CENKER ACML4532B-510-2P-T Wire Wound Chip Common Mode Choke Coil for Noise Filtering factory
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quality Durable Coated CENKER ACML4532B-510-2P-T Wire Wound Chip Common Mode Choke Coil for Noise Filtering factory
>
Specifications
Inductance @ Frequency:
51uH@100kHz
Insulation Resistance(IR):
10MΩ
Operating Temperature:
-55℃~+150℃
Voltage Rating (AC):
50V
DC Resistance(DCR):
Voltage Rating - DC:
50V
Number of Lines:
2
Voltage Withstand:
-
Mfr. Part #:
ACML4532B-510-2P-T
Package:
SMD-4P,4.5x3.2mm
Key Attributes
Model Number: ACML4532B-510-2P-T
Product Description

Product Overview

The ACML-B Series Wire Wound Chip Common Mode Choke Coil is designed for high-frequency common mode noise prevention, offering a small size and low profile. It features excellent solderability and is AEC-Q200 verified. This series is particularly suited for common mode noise filtering in automotive CAN-BUS and signal lines.

Product Attributes

  • Type: Wire Wound Chip Common Mode Choke Coil
  • Series: ACML-B Series
  • Operating Temperature: -55 to +150 (Including self-temperature rise)
  • Certifications: AEC-Q200 Verified
  • Core Material: Ferrite
  • Wire Material: Polyurethane enameled copper wire
  • Coating Material: Epoxy resin
  • Storage Temperature (packaging conditions): -10 to +40 and RH 70% (Max.)

Technical Specifications

ACML3225B Series

Part No. Inductance (uH) Test Frequency (KHz)/0.1V DCR () Max Max. Rated Current (mA) Rated Voltage (Vdc) Insulation Resistance (M) Min.
ACML3225B-110-2P-T 11+50%/-30% 100 0.40 300 80 10
ACML3225B-220-2P-T 22+50%/-30% 100 0.50 250 80 10
ACML3225B-510-2P-T 51+50%/-30% 100 0.70 200 80 10
ACML3225B-101-2P-T 100+50%/-30% 100 2.00 150 80 10

ACML4532B Series

Part No. Inductance (uH) Test Frequency (KHz)/0.1V DCR () Max Max. Rated Current (mA) Rated Voltage (Vdc) Insulation Resistance (M) Min.
ACML4532B-110-2P-T 11+50%/-30% 100 0.5 360 50 10
ACML4532B-220-2P-T 22+50%/-30% 100 0.8 310 50 10
ACML4532B-510-2P-T 51+50%/-30% 100 1.0 230 50 10
ACML4532B-101-2P-T 100+50%/-30% 100 2.0 200 50 10

Shapes and Dimensions (Unit: mm)

TYPE () A B C D1 D2 E F G H K
ACML3225B 3.20.2 2.5Max 2.50.2 0.8 Ref 0.8Ref 0.25Max 3.5Ref 0.6Ref 1.6 Ref 4.1Ref
ACML4532B 4.50.2 2.60.2 3.20.2 1.0 Ref 1.0Ref 0.5 Max 3.4Ref 1.6 Ref 2.9 Ref 5.5 Ref

Packaging Specification

Tape & Reel

Type Tape Dimension (mm) W A0 B0 K0 D Reel Dimension (mm) P A B C Quantity (Pcs/Reel)
ACML3225B 12 2.9 3.5 2.7 1.5 4 178 60 13 1000 pcs
ACML4532B 12 3.7 4.95 2.95 1.5 8 178 60 13 500 pcs

Cover Tape

  • Force for tearing off cover tape: 20 to 100 grams in the arrow direction.
  • Peel-off speed: 300mm/min.

Recommended Soldering Technologies (Re-flowing Profile)

  • Preheat condition: 150~200 / 60~120sec.
  • Allowed time above 217: 60~90sec.
  • Max temp: 260
  • Max time at max temp: 10sec.
  • Solder paste: Sn/3.0Ag/0.5Cu
  • Allowed Reflow time: 2 times max.

Test and Measurement Procedures

  • Inductance: Test equipment: Keysight E4991B / Agilent 4787A or equivalent
  • DC Resistance (DCR): Test equipment: Agilent 34420A / Agilent 4338B or equivalent
  • Rated Current (Irms): Irms is direct electric current as chip surface temperature rose just 20 or 40 against chip initial surface temperature (Ta). Temperature rise: Rated Current < 1A T 20 Max; Rated Current 1A T 40 Max.
  • Insulation Resistance: Test equipment: Chroma TH2683A / ZX6583 or equivalent

2410121623_CENKER-ACML4532B-510-2P-T_C19268472.pdf

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