Product Overview
The ACML-B Series Wire Wound Chip Common Mode Choke Coil is designed for high-frequency common mode noise prevention, offering a small size and low profile. It features excellent solderability and is AEC-Q200 verified. This series is particularly suited for common mode noise filtering in automotive CAN-BUS and signal lines.
Product Attributes
- Type: Wire Wound Chip Common Mode Choke Coil
- Series: ACML-B Series
- Operating Temperature: -55 to +150 (Including self-temperature rise)
- Certifications: AEC-Q200 Verified
- Core Material: Ferrite
- Wire Material: Polyurethane enameled copper wire
- Coating Material: Epoxy resin
- Storage Temperature (packaging conditions): -10 to +40 and RH 70% (Max.)
Technical Specifications
ACML3225B Series
| Part No. | Inductance (uH) | Test Frequency (KHz)/0.1V | DCR () Max | Max. Rated Current (mA) | Rated Voltage (Vdc) | Insulation Resistance (M) Min. |
|---|---|---|---|---|---|---|
| ACML3225B-110-2P-T | 11+50%/-30% | 100 | 0.40 | 300 | 80 | 10 |
| ACML3225B-220-2P-T | 22+50%/-30% | 100 | 0.50 | 250 | 80 | 10 |
| ACML3225B-510-2P-T | 51+50%/-30% | 100 | 0.70 | 200 | 80 | 10 |
| ACML3225B-101-2P-T | 100+50%/-30% | 100 | 2.00 | 150 | 80 | 10 |
ACML4532B Series
| Part No. | Inductance (uH) | Test Frequency (KHz)/0.1V | DCR () Max | Max. Rated Current (mA) | Rated Voltage (Vdc) | Insulation Resistance (M) Min. |
|---|---|---|---|---|---|---|
| ACML4532B-110-2P-T | 11+50%/-30% | 100 | 0.5 | 360 | 50 | 10 |
| ACML4532B-220-2P-T | 22+50%/-30% | 100 | 0.8 | 310 | 50 | 10 |
| ACML4532B-510-2P-T | 51+50%/-30% | 100 | 1.0 | 230 | 50 | 10 |
| ACML4532B-101-2P-T | 100+50%/-30% | 100 | 2.0 | 200 | 50 | 10 |
Shapes and Dimensions (Unit: mm)
| TYPE () | A | B | C | D1 | D2 | E | F | G | H | K |
|---|---|---|---|---|---|---|---|---|---|---|
| ACML3225B | 3.20.2 | 2.5Max | 2.50.2 | 0.8 Ref | 0.8Ref | 0.25Max | 3.5Ref | 0.6Ref | 1.6 Ref | 4.1Ref |
| ACML4532B | 4.50.2 | 2.60.2 | 3.20.2 | 1.0 Ref | 1.0Ref | 0.5 Max | 3.4Ref | 1.6 Ref | 2.9 Ref | 5.5 Ref |
Packaging Specification
Tape & Reel
| Type | Tape Dimension (mm) W | A0 | B0 | K0 | D | Reel Dimension (mm) P | A | B | C | Quantity (Pcs/Reel) |
|---|---|---|---|---|---|---|---|---|---|---|
| ACML3225B | 12 | 2.9 | 3.5 | 2.7 | 1.5 | 4 | 178 | 60 | 13 | 1000 pcs |
| ACML4532B | 12 | 3.7 | 4.95 | 2.95 | 1.5 | 8 | 178 | 60 | 13 | 500 pcs |
Cover Tape
- Force for tearing off cover tape: 20 to 100 grams in the arrow direction.
- Peel-off speed: 300mm/min.
Recommended Soldering Technologies (Re-flowing Profile)
- Preheat condition: 150~200 / 60~120sec.
- Allowed time above 217: 60~90sec.
- Max temp: 260
- Max time at max temp: 10sec.
- Solder paste: Sn/3.0Ag/0.5Cu
- Allowed Reflow time: 2 times max.
Test and Measurement Procedures
- Inductance: Test equipment: Keysight E4991B / Agilent 4787A or equivalent
- DC Resistance (DCR): Test equipment: Agilent 34420A / Agilent 4338B or equivalent
- Rated Current (Irms): Irms is direct electric current as chip surface temperature rose just 20 or 40 against chip initial surface temperature (Ta). Temperature rise: Rated Current < 1A T 20 Max; Rated Current 1A T 40 Max.
- Insulation Resistance: Test equipment: Chroma TH2683A / ZX6583 or equivalent
2410121623_CENKER-ACML4532B-510-2P-T_C19268472.pdf
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