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quality X7R Multilayer Chip Ceramic Capacitor CCTC TCC1206X7R471K102DTS with Sandwich Structure Technology factory
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quality X7R Multilayer Chip Ceramic Capacitor CCTC TCC1206X7R471K102DTS with Sandwich Structure Technology factory
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Specifications
Voltage Rating:
1kV
Capacitance:
470pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
TCC1206X7R471K102DTS
Package:
1206
Key Attributes
Model Number: TCC1206X7R471K102DTS
Product Description

Product Overview

The S Series MLCC (Multilayer Chip Ceramic Capacitor) from CCTC, also known as the "sandwich-structure" product, offers enhanced strength and reliability compared to traditional designs. This advanced construction, featuring added high-intensity dielectric layers, makes it ideal for applications requiring superior flexural and bending strength. It is specifically designed to replace low capacitance conventional X7R MLCCs in demanding environments.

Product Attributes

  • Brand: CCTC ()
  • Origin: China
  • Product Name: Multilayer Chip Ceramic Capacitor (S Series)
  • Approval Sheet No.: DRAAW108E/0-2015
  • Manufacturer: Chaozhou Three Rings (Group) Co., Ltd.

Technical Specifications

Specification Description Test Condition
Appearance No defects or abnormalities Visual inspection
X7R Visual inspection
Dimensions Chip Size: 0603, 0805, 1206 Using calipers on micrometer
0603: L=1.600.10mm, W=0.800.10mm, T=0.800.10mm Using calipers on micrometer
0805: L=2.000.10mm, W=1.250.10mm, T=0.600.10mm / 0.850.10mm / 1.250.20mm Using calipers on micrometer
Capacitance Within specified tolerance (J: 5%; K: 10%; M: 20%) 1.00.2Vrms, 1KHz10% (253, <70%RH)
Dissipation Factor DF2.5% 1.00.2Vrms, 1KHz10% (253, <70%RH)
Insulation Resistance UR 50V: > 10 G or 500F (whichever is smaller) UR=Test Voltage, Charge Time: 605sec, Temperature: 25
UR > 50V: > 4 G or 100s (whichever is smaller)
Dielectric Strength No breakdown under specified voltage test Varies by Rated Voltage (e.g., 300% of UR for 5s for UR50V)
Temperature Coefficient of Capacitance Capacitance change within 15% (X7R) Measure capacitance under specified temperature sequence (-55 to 125)
Adhesion No removal of terminations or defects 6N pressure for 101 sec
Solderability of Termination 95% coverage, <5% pinholes/rough spots Solder temp: 2455, Dipping time: 21 sec
Resistance to Leaching 95% coverage, <5% pinholes/rough spots, no cracking Preheat: 120-150/60s, Solder temp: 2705, Dipping time: 101 sec
Bending Strength No visible damage; Cp change 10% Bending 1mm at 1.0mm/s rate on test fixture

2410121256_CCTC-TCC1206X7R471K102DTS_C377098.pdf

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