Product Overview
The S Series MLCC (Multilayer Chip Ceramic Capacitor) from CCTC, also known as the "sandwich-structure" product, offers enhanced strength and reliability compared to traditional designs. This advanced construction, featuring added high-intensity dielectric layers, makes it ideal for applications requiring superior flexural and bending strength. It is specifically designed to replace low capacitance conventional X7R MLCCs in demanding environments.
Product Attributes
- Brand: CCTC ()
- Origin: China
- Product Name: Multilayer Chip Ceramic Capacitor (S Series)
- Approval Sheet No.: DRAAW108E/0-2015
- Manufacturer: Chaozhou Three Rings (Group) Co., Ltd.
Technical Specifications
| Specification | Description | Test Condition |
|---|---|---|
| Appearance | No defects or abnormalities | Visual inspection |
| X7R | Visual inspection | |
| Dimensions | Chip Size: 0603, 0805, 1206 | Using calipers on micrometer |
| 0603: L=1.600.10mm, W=0.800.10mm, T=0.800.10mm | Using calipers on micrometer | |
| 0805: L=2.000.10mm, W=1.250.10mm, T=0.600.10mm / 0.850.10mm / 1.250.20mm | Using calipers on micrometer | |
| Capacitance | Within specified tolerance (J: 5%; K: 10%; M: 20%) | 1.00.2Vrms, 1KHz10% (253, <70%RH) |
| Dissipation Factor | DF2.5% | 1.00.2Vrms, 1KHz10% (253, <70%RH) |
| Insulation Resistance | UR 50V: > 10 G or 500F (whichever is smaller) | UR=Test Voltage, Charge Time: 605sec, Temperature: 25 |
| UR > 50V: > 4 G or 100s (whichever is smaller) | ||
| Dielectric Strength | No breakdown under specified voltage test | Varies by Rated Voltage (e.g., 300% of UR for 5s for UR50V) |
| Temperature Coefficient of Capacitance | Capacitance change within 15% (X7R) | Measure capacitance under specified temperature sequence (-55 to 125) |
| Adhesion | No removal of terminations or defects | 6N pressure for 101 sec |
| Solderability of Termination | 95% coverage, <5% pinholes/rough spots | Solder temp: 2455, Dipping time: 21 sec |
| Resistance to Leaching | 95% coverage, <5% pinholes/rough spots, no cracking | Preheat: 120-150/60s, Solder temp: 2705, Dipping time: 101 sec |
| Bending Strength | No visible damage; Cp change 10% | Bending 1mm at 1.0mm/s rate on test fixture |
2410121256_CCTC-TCC1206X7R471K102DTS_C377098.pdf
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