Product Overview
The TCC1206X5R476M100HT is a Multilayer Chip Ceramic Capacitor (MLCC) utilizing X5R dielectric material. This Class II capacitor offers a high dielectric constant and a wide capacitance range, suitable for applications requiring stable temperature characteristics. It is designed for use in circuits such as DC-blocking, decoupling, bypassing, and frequency discriminating.
Product Attributes
- Product Name: Multilayer Chip Ceramic Capacitor
- Part Number: TCC1206X5R476M100HT
- Approval Sheet No.: DRAAW108M/1-2023
- Issued Date: 2024/1/24
- Manufacturer: TCC
- Customer: Specified by customer
- Dielectric Material: X5R
Technical Specifications
| Specification | Description | Testing Condition |
| Appearance | Visual inspection. | Visual inspection. |
| Dimensions | 1206 Chip Size: L 3.200.30mm, W 1.600.30mm, T 1.600.30mm. e: 0.3~0.8mm, g min. | Using calipers on micrometer. l1/8L,w1/8W,t1/8T |
| Capacitance | X5R: 37.6~56.4uF (for 476 code) | 0.50.1Vrms, 12024Hz. Test Temp: 253, Humidity: <70%RH. Aging treatment required for Class II dielectrics (150 for 1 hour, rest for 48 hours). |
| Dissipation Factor (DF) | X5R: DF10% | 0.50.1Vrms, 12024Hz. Test Temp: 253, Humidity: <70%RH. Aging treatment required. |
| Insulation Resistance (IR) | X5R: 2.13M | Test Voltage: 10V; Charge Time: 605sec; Temperature: 25. |
| Dielectric Strength | X5R: UR=10V | Apply 25VDC for 5 seconds. Max. current should not exceed 50mA. |
| Temperature Coefficient of Capacitance | X5R: Capacitance change within 15% over specified temperature range. | Test Temperatures: -553, 252, 853. Compared to capacitance at 25. Test Temp: 253, Humidity: <70%RH. Aging treatment required. |
| Adhesion | X5R: No removal of terminations or other defects. | Pressurizing force: 6N, duration: 101 sec. |
| Solderability of Termination | X5R: 95% tin coverage on terminal electrodes, <5% pinholes/rough spots. No visual damage. | Solder temperature: 2705; Preheating: 120~150/60sec; Dipping time: 101 sec. Both terminal electrodes completely soaked. |
| Resistance to Leaching | X5R: 95% tin coverage on terminal electrodes, <5% pinholes/rough spots. | Solder temperature: 2455; Dipping time: 21 sec. Both terminal electrodes completely soaked. |
| Bending | X5R: No visual damage; Cp change 10%. | Capacitor soldered on substrate, bent 1mm at a rate of 1.0mm/sec. |
| Resistance to Soldering Heat | X5R: No visual damage; Cp change within 7.5%; DF and IR meet initial requirements. | Soldering temperature: 2705; Preheating: 120~150/60sec; Dipping time: 101 sec. Measured after 484hrs at room temp. Initial measurement after heat treatment (140~150/1hr) and 48hrs rest. |
| Temperature Cycle | X5R: No visual damage; Cp change within 7.5%. | 5 cycles: -553 (30min) 25 (2-3min) +853 (30min) 25 (2-3min). Measured after 484hrs at room temp. Initial measurement as above. |
| Moisture Resistance, steady state | X5R: Cp change within 12.5%; DF 2x initial value; IR 0.21M. | Test Temp: 402; Humidity: 90~95% RH; Testing time: 500 12hrs. Measured after 484hrs at room temp. Initial measurement as above. |
| Damp heat with load | X5R: No visual damage; Cp change 12.5%; DF 2x initial value; IR 0.11M. | Test Temp: 402; Humidity: 90~95% RH; Voltage: 100% rated voltage; Testing time: 500 12hrs; Charge/discharge current: 50mA. Measured after 484hrs at room temp. Initial measurement after soldering and 484hrs rest. Post-test: 150/1h, then 48h rest. |
| Life Test | X5R: No visual damage; Cp change 12.5%; DF 2x initial value; IR 0.11M. | Test Temp: Max. Operating Temp. 3; Voltage: 100% rated voltage; Charge/discharge current: 50mA; Testing time: 1000 hrs. Measured after 484hrs at room temp. Initial measurement after soldering and 484hrs rest. Post-test: 150/1h, then 48h rest. |
2410121439_CCTC-TCC1206X5R476M100HT_C5448950.pdf
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