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quality Chip Multilayer Ceramic Capacitors 3 Terminals Low ESL muRata NFM18CC221R1C3D for Electronic Devices factory
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quality Chip Multilayer Ceramic Capacitors 3 Terminals Low ESL muRata NFM18CC221R1C3D for Electronic Devices factory
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Specifications
Mfr. Part #:
NFM18CC221R1C3D
Model Number:
NFM18CC221R1C3D
Package:
SMD-3P,1.6x0.8mm
Key Attributes
Product Description

3 Terminals Low ESL Chip Multilayer Ceramic Capacitors (EMIFIL)

These 3 Terminals Low ESL Chip Multilayer Ceramic Capacitors (EMIFIL) are designed for general electronic equipment, offering low Equivalent Series Inductance (ESL) for enhanced performance. They are suitable for a wide range of general-purpose applications.

Product Attributes

  • Brand: MURATA
  • Part Number System: NFM18CC221R1C3
  • Packaging: 180mm Reel, PAPER W8P4, 4000 pcs./Reel

Technical Specifications

ItemSpecificationTest Method
Nominal Capacitance220 pFFrequency (Cap.): 10.1kHz, Voltage: 10.2V(rms)
Capacitance Tolerance20 %
DC Rated VoltageDC 16 V
DC Resistance1000Mmin.Measured with 100mA max.
Rated Current500mA(DC)
DC Resistance300mmax.
Operating /Storage Temp. Range-55 to 125 C
Insulation Resistance(I.R.)JEMCPS-02209D
AppearanceNo defects or abnormalities.Visual inspection.
DimensionsWithin the specified dimensions.Using Measuring instrument of dimension.
SolderabilityElectrodes shall be at least 90% covered with new solder coating.Flux: Solution of rosin ethanol 25(mass)%, Pre-heat: 15010C, 60 to 90s, Solder: Sn-3.0Ag-0.5Cu, Solder Temperature: 2403C, Immersion Time: 31s
Resistance to soldering heatProducts shall be no failure after tested.Flux: Solution of rosin ethanol 25(mass)%, Pre-heat: 15010C, 60 to 90s, Solder: Sn-3.0Ag-0.5Cu, Solder Temperature: 2705C, Immersion Time: 101s
Bending StrengthMeet Table 2.Soldered on glass-epoxy substrate(t=1.0mm), Deflection: 2mm, Keeping Time: 30s
DropIt shall be dropped on concrete or steel board.Free fall, Height: 1m, Attitude: 3 directions
Bonding StrengthIt shall be soldered on the glass-epoxy substrate.Applying Force (F): 9.8N, Applying Time: 30s
VibrationMeet Table 3.Soldered on glass-epoxy substrate, Oscillation Frequency: 10 to 2000 to 10Hz for 20 minutes. Total amplitude 1.5 mm or Acceleration amplitude 196m/s2 whichever is smaller. Time: 2 hours in each of 3 mutually perpendicular directions.
Temperature CyclingMeet Table 1.1 Cycle: -55+0/-3 / 30+3/-0 min, Room Temperature / within 3 min, +125+3/-0 / 30+3/-0 min, Room Temperature / within 3 min. Total of 10 cycles.
HumidityMeet Table 4.Temperature: 402C, Humidity: 90 to 95%(RH), Time: 500+24/-0 hours
Heat LifeTemperature: 1252C, Test Voltage: Rated Voltage x 200%, Charge Current: 50mA max., Time: 1000+48/-0 hours
Cold ResistanceTemperature: -552C, Time: 500+24/-0 hours
Taping SpecificationMissing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous.
Pull Strength of Top Tape5Nmin.
Peeling off force of top tape0.1N to 0.6NSpeed of Peeling off: 300 mm / min

2409300133_muRata-NFM18CC221R1C3D_C88292.pdf

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