Johanson Technology Multi-Layer High-Q Capacitors
These multilayer capacitors are engineered for high-Q and microwave applications, offering superior performance in demanding environments. The series include S-Series for ultra-high Q and NP0 characteristics, L-Series for mid-high Q and NP0 characteristics, E-Series for excellent high-Q performance from HF to Microwave frequencies suitable for high voltage and high current applications, and W-Series for large capacitance values in an ultra-small 0201 package with X7R temperature characteristics. RoHS compliance is standard for all unleaded parts.
Product Attributes
- Brand: Johanson Technology
- Certifications: RoHS compliance (standard for unleaded parts)
Technical Specifications
| Series | Part Number Example | Description | Capacitance Range | Voltage Range | Temperature Characteristic | Termination Options |
| S-Series | R03S, R07S, R14S, R15S | Ultra-high Q performance | 0.1 pF - 100 pF (approx.) | 6.3 V - 1000 V (varies by model) | NP0 | Ni barrier (Ni/Sn, Ni/Au), Non-Magnetic Pt.-Ag, Non-Magnetic Leaded |
| L-Series | R05L | Mid-high Q performance | 0.1 pF - 10 pF (approx.) | 16 V - 1000 V (varies by model) | NP0 | Ni barrier, Non-Magnetic Leaded |
| E-Series | S42E, S48E, S58E | Excellent high-Q performance from HF to Microwave frequencies. Suitable for high voltage, high current applications. | 0.1 pF - 10000 pF (approx.) | 16 V - 10000 V (varies by model) | NP0 (High Voltage, High Power) | Chip (Ni barrier or Non-Magnetic Pt.-Ag), Non-Magnetic Leaded |
| W-Series | R05W | Large capacitance value in an ultra-small 0201 package size. | 0.1 pF - 100 pF (approx.) | 16 V - 250 V (varies by model) | X7R | Chip (Ni barrier) |
Ordering Information
Part Number Structure Example: 252S48E470KV4E
Key Components:
- Voltage (DC): 6R3 (6.3V) to 502 (5000V)
- Case Size: R03 (01005) to S58 (3838)
- Capacitance (pF): e.g., 470 (47pF)
- Tolerance: A (0.05pF) to K (10%)
- Marking: 3 (Cap Code & Tolerance), 4 (No Marking), 6 (EIA Code)
- Termination: V (Ni/Sn), T (Ni/SnPb), G (Ni/Au), U (Cu/Sn), C (Cu/SnPb), Leaded options
- Dielectric: S (Ultra High Q NPO), L (High Q NPO), E (Ultra High Q NPO, High Voltage, High Power), T (High Temp 175C Ultra High Q NPO), W (X7R)
- Packaging: S (Bulk), W (Waffle Pack), Y (Paper 5 Reel), T (Paper 7 Reel), Z (Embossed 5 Reel), E (Embossed 7 Reel)
Mechanical & Environmental Characteristics
| Characteristic | Specification | Test Parameters |
| Solderability | Solder coverage 90% of metalized areas | Preheat 120-150C for 60 sec., dip in rosin flux, then dip in Sn62 solder @ 2405C for 51 sec. |
| Resistance to Soldering Heat | No mechanical damage; Capacitance change: 2.5% or 0.25pF; Q>500; I.R. >10 G Ohms; Breakdown voltage: 2.5 x WVDC | Preheat device to 80-100C for 60 sec., followed by 150-180C for 60 sec. Dip in 2605C solder for 101 sec. Measure after 242 hour cooling period. |
| Terminal Adhesion | Termination should not pull off; Ceramic should remain undamaged. | Linear pull force* exerted on axial leads soldered to each terminal. *0402 2.0lbs, 0603 2.0lbs (min.) |
| PCB Deflection | No mechanical damage; Capacitance change: 2% or 0.5pF Max | Glass epoxy PCB: 0.5 mm deflection |
| Life Test | No mechanical damage; Capacitance change: 3.0% or 0.3 pF; Q>500; I.R. >1 G Ohms; Breakdown voltage: 2.5 x WVDC | MIL-STD-202, Method 108l. Applied voltage: 120% of WDVC (for 500VDC) or 100% of WDVC (for 1250VDC). Temperature: 1253C. Test time: 1000+48-0 hours. |
| Thermal Cycle | No mechanical damage | (Details not fully provided in source text) |
2410121912_Johanson-Dielectrics-100R14W225KV4T_C2917682.pdf
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