Multi-Layer High-Q Capacitors
These multilayer capacitors are engineered for High-Q and microwave applications, offering superior performance in demanding environments. The series include S-Series for ultra-high Q with NP0 characteristics, L-Series for mid-high Q with NP0 characteristics, E-Series for excellent high-Q performance from HF to Microwave frequencies suitable for high voltage and high current applications, and W-Series for large capacitance values in an ultra-small 0201 package with X7R temperature characteristics. RoHS compliance is standard for all unleaded parts.
Product Attributes
- Brand: Johanson Technology
- Certifications: RoHS compliance (standard for unleaded parts)
Technical Specifications
| Series | Model Numbers | Key Features | Temperature Characteristics | Typical Applications | Form Factor | Termination Options |
| S-Series | R03S, R07S, R14S, R15S | Ultra-high Q performance | NP0 | High-Q and microwave applications | Chip | Ni barrier or Non-Magnetic Pt.-Ag |
| L-Series | R05L | Mid-high Q performance | NP0 | High-Q and microwave applications | Chip | Ni barrier or Non-Magnetic Pt.-Ag |
| E-Series | S42E, S48E, S58E | Excellent high-Q performance from HF to Microwave frequencies | NP0 | High voltage, high current applications | Chip or Non-Magnetic Leaded | Ni barrier or Non-Magnetic Pt.-Ag (Chip); Non-Magnetic (Leaded) |
| W-Series | R05W | Large capacitance value in ultra-small 0201 package | X7R | Miniature Size - Portable Electronics, RF Power Applications | Chip | Ni barrier or Non-Magnetic Pt.-Ag |
| Part Number Example | Voltage (DC) Codes | Case Size Codes | Capacitance Codes | Tolerance Codes | Marking Codes | Termination Codes | Packaging Codes | Dielectric Codes |
| 252S48E470KV4E | 6R3, 101, 160, 250, 500, 201, 251, 301, 501, 102, 152, 202, 252, 362, 502, 722 | R03, R05, R07, R14, R15, S42, S48, S58 | Capacitance (pF): 1st two digits significant, 3rd digit denotes zeros, R=decimal (e.g., 470 = 47 pF, 100 = 10 pF, 101 = 100 pF) | A (0.05pF), B (0.10pF), C (0.25pF), D (0.50pF), F (1%), G (2%), J (5%), K (10%) | 3 (Cap Code & Tolerance), 4 (No Marking), 6 (EIA Code) | V (Ni/Sn), T (Ni/SnPb), G (Ni/Au), U (Cu/Sn), C (Cu/SnPb) - Chip; 1, 2, 3, 4, 5 - Leaded | S (Bulk), W (Waffle Pack), Y (Paper 5 Reel), T (Paper 7 Reel), R (Paper 13 Reel), J (Paper 5 Reel - Horiz.), N (Paper 5 Reel - Vert.), L (Paper 7 Reel - Horiz.), V (Paper 7 Reel - Vert.), Z (Embossed 5 Reel), E (Embossed 7 Reel), U (Embossed 13 Reel), M (Embossed 5 Reel - Horiz.), Q (Embossed 5 Reel - Vert.), G (Embossed 7 Reel - Horiz.), P (Embossed 7 Reel - Vert.) | S (Ultra High Q NPO), L (High Q NPO), E (Ultra High Q NPO, High Voltage, High Power), T (High Temp 175C Ultra High Q NPO), W (X7R) |
| Mechanical & Environmental Characteristics | Specification | Test Parameters |
| Solderability | Solder coverage 90% of metalized areas | Preheat chip to 120-150C for 60 sec., dip terminals in rosin flux then dip in Sn62 solder @ 2405C for 51 sec. No termination degradation. |
| Resistance to Soldering Heat | No mechanical damage. Capacitance change: 2.5% or 0.25pF. Q>500. I.R. >10 G Ohms. Breakdown voltage: 2.5 x WVDC. | Preheat device to 80-100C for 60 sec., followed by 150-180C for 60 sec. Dip in 2605C solder for 101 sec. Measure after 242 hour cooling period. |
| Terminal Adhesion | Termination should not pull off. Ceramic should remain undamaged. | Linear pull force* exerted on axial leads soldered to each terminal. *0402 2.0lbs, 0603 2.0lbs (min.) |
| PCB Deflection | No mechanical damage. Capacitance change: 2% or 0.5pF Max. | Glass epoxy PCB: 0.5 mm deflection. |
| Life Test | No mechanical damage. Capacitance change: 3.0% or 0.3 pF. Q>500. I.R. >1 G Ohms. Breakdown voltage: 2.5 x WVDC. | MIL-STD-202, Method 108l. Applied voltage: 120% of WDVC for capacitors rated at 500 volts DC or less; 100% of WDVC for capacitors rated at 1250 volts DC or less. Temperature: 1253C. Test time: 1000+48-0 hours. |
| Thermal Cycle | No mechanical d |
2410121912_Johanson-Dielectrics-160R15W225KV4E_C2917696.pdf
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