Product Overview
Johanson Technology's Multi-Layer High-Q Capacitors are engineered for high-performance applications, including High-Q and microwave circuits. The S-Series offers ultra-high Q performance with NP0 temperature characteristics, while the L-Series provides mid-high Q performance, also with NP0 characteristics. The E-Series delivers excellent high-Q performance across HF to Microwave frequencies, suitable for high voltage and high current applications. All unleaded parts are RoHS compliant, and automotive versions (AEC-Q200) are available upon request for select series.
Product Attributes
- Brand: Johanson Technology
- Certifications: RoHS Compliance (standard for unleaded parts), AEC-Q200 (available on request for select series)
- Material: Multilayer Ceramic
- Color: Green (for Ni/Sn and Ni/Au terminations)
Technical Specifications
| Series | Case Size | Capacitance (pF) | Tolerance | WVDC | Dielectric | Termination Options |
| S-Series (R07S, R14S, R15S) | R07 (0402), R14 (0603), R15 (0805) | Refer to chart | A, B, C, D, F, G, J, K | 25, 50, 200, 250, 500, 1500, 3600, 7200 | NPO (Ultra High Q) | Nickel Barrier (Ni/Sn, Ni/Au), Leadless (Cu/Sn) |
| L-Series (R05L) | R05 (0201) | Refer to chart | A, B, C, D, F, G, J, K | 25, 50, 200, 250, 500, 1500, 3600, 7200 | NPO (Mid-High Q) | Nickel Barrier (Ni/Sn, Ni/Au), Leadless (Cu/Sn) |
| E-Series (S42E, S48E, S58E) | S42 (1111), S48 (2525), S58 (3838) | Refer to chart | F, G, J, K | 25, 50, 200, 250, 300, 500, 600, 1000, 1500, 2500, 3600, 7200 | NPO (Ultra High Q, High Voltage, High Power) | Nickel Barrier (Ni/Sn, Ni/Au), Leadless (Cu/Sn) |
| All Series | Various | 0.1 pF to 10000 pF | Refer to chart | Refer to chart | NPO | Nickel Barrier, Leadless, Leaded (Microstrip, Axial Ribbon/Wire, Radial Ribbon/Wire) |
Mechanical & Environmental Characteristics
| Characteristic | Specification | Test Parameters | Performance Criteria |
| Solderability | Solder coverage 90% of metalized areas | Preheat chip to 120-150C for 60 sec., dip terminals in rosin flux, then dip in Sn62 solder @ 2405C for 51 sec | No termination degradation |
| Resistance to Soldering Heat | No mechanical damage | Preheat device to 80-100C for 60 sec., followed by 150-180C for 60 sec. | Capacitance change: 2.5% or 0.25pF, Q>500, I.R. >10 G Ohms, DWV: 2.5 x WVDC |
| Terminal Adhesion | Termination should not pull off | Linear pull force exerted on axial leads soldered to each terminal | Ceramic should remain undamaged |
| PCB Deflection | No mechanical damage | Glass epoxy PCB: 2 mm deflection | Capacitance change: 5% or 0.5pF whichever is greater |
| Life Test | No mechanical damage | Applied voltage: 200% of WVDC for capacitors rated at 500V DC or less; 100% of WVDC for capacitors rated at 1250V DC or less. Temperature: 1253C. Test time: 1000+48-0 hours | Capacitance change: 3.0% or 0.3 pF, Q>500, I.R. >1 G Ohms, DWV: 2.5 x WVDC |
| Thermal Cycle | No mechanical damage | 5 cycles of: 303 min @ -55C, 2-3 min @ 25C, 303 min @ +125C, 2-3 min @ 25C | Capacitance change: 2.5% or 0.25pF, Q>2000, I.R. >10 G Ohms, DWV: 2.5 x WVDC |
| Humidity, Steady State | No mechanical damage | Relative humidity: 90-95%, Temperature: 402C. Test time: 500 +12/-0 Hours | Capacitance change: 5.0% or 0.50pF max, Q>300, I.R. 1 G-Ohm, DWV: 2.5 x WVDC |
| Humidity, Low Voltage | No mechanical damage | Applied voltage: 1.5 VDC, 50 mA max. Relative humidity: 852%, Temperature | Capacitance change: 5.0% or 0.50pF max |
2412161841_Johanson-Dielectrics-251R14S180GV4T_C3881816.pdf
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