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Specifications
Voltage Rating:
50V
Capacitance:
220pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805B221K500NT
Model Number:
0805B221K500NT
Package:
0805
Key Attributes
Product Description
Product Overview
High-Voltage Multi-layer Ceramic Capacitors (MLCCs) are designed for surface mounting and are suitable for various high-voltage DC circuits, offering improved circuit performance. They feature a monolithic structure of laminated layers for high reliability, excellent soldering and resistance properties for reflow and wave soldering, and provide high and stable capacitance. These capacitors comply with GB/T 21041-2007 and GB/T 21042-2007 standards. Applications include analog/digital modems, LAN/WAN interfaces, lighting ballast circuits, voltage multipliers, DC-DC converters, and back-lighting inverter circuits.
Product Attributes
- Manufacturer: FENGHUA
- Product Type: High-Voltage Multi-layer Ceramic Capacitors
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Executive Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Feature | Description |
|---|---|
| Sizes (EIA) | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 |
| Dimensions (mm) | Refer to 'Product Dimensions' table for specific L, W, T, WB values per size code. |
| Capacitance Range | 0.5pF to 10F (Class I & II, varies by size and voltage) |
| Rated Voltage (V) | 6.3V to 5000V (e.g., 6R3, 500, 1000, 2000, 2500, 3000, 4000, 5000) |
| Capacitance Tolerance | 0.05pF, 0.10pF, 0.25pF, 0.50pF, 1%, 2%, 5%, 10%, 20% |
| Temperature Coefficient/Characteristics | C0G: 030ppm/ (-55125) X7R: 15% (-55125) |
| Termination Material | Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A) |
| Package Styles | Braided 7 inch disc packing (T), Braided 13 inch disc packing (D) |
| Dielectric Withstanding Voltage Test Method | Varies based on rated voltage (e.g., 250% of Vr for 5s for Vr=100V, 120% of Vr for 5s for 2000V < Vr <= 5000V) |
| Reliability Tests | Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, Life Test |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70% |
| Soldering Methods | Reflow Soldering (R), Wave Soldering (W), Manual Soldering |
2511191605_FH-0805B221K500NT_C1727.pdf
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