Product Overview
High-Voltage Multi-layer Ceramic Capacitors (MLCC) are designed for surface mount applications, offering excellent high-voltage reliability. Built on advanced MLCC technology, these capacitors are suitable for various DC high-voltage circuits, effectively enhancing electronic circuit performance. They feature a monolithic laminated structure for high reliability, superior soldering and heat resistance for reflow and wave soldering, and provide high and stable capacitance. These capacitors comply with GB/T 21041-2007 and GB/T 21042-2007 standards.
Key Applications: Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters.
Product Attributes
- Manufacturer: FENGHUA
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Compliance Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Feature | Description |
|---|---|
| Product Name | High-Voltage Multi-layer Ceramic Capacitors |
| Series | High Voltage Series Of Ceramic Chip Capacitors |
| Available Sizes (EIA) | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 |
| Dielectric Codes | C0G, X7R |
| Capacitance Tolerance Codes | A (0.05pF), B (0.10pF), C (0.25pF), D (0.50pF), F (1%), G (2%), J (5%), K (10%), M (20%) |
| Rated Voltage Express Methods | e.g., 6R3 (6.3V), 500 (500V), 201 (2000V) |
| Termination Material Styles | Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A) |
| Package Styles | Braided 7 inch disc packing (T), Braided 13 inch disc packing (D) |
| Operating Temperature Range | -55125 |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70% |
| Guaranteed Solderability Period | 12 months (under delivered package condition) |
Dimensions (Example: 0402)
| Type | Dimensions (mm) | Size Code | L | W | T | WB |
|---|---|---|---|---|---|---|
| 0402 | (1.000.50) | 0402 | 1.000.05 | 0.500.05 | 0.500.05 | 0.250.05 |
| 0603 | (1.600.80) | 0603 | 1.600.10 | 0.800.10 | 0.800.10 | 0.350.20 |
Capacitance Range and Voltage (Class I - C0G)
| Material | Dimension | Capacity/Voltage (Examples) |
|---|---|---|
| C0G | 0402 (1.0mm*0.5mm) | 100V: 0.5pF, 1pF, 1.2pF, 1.5pF, 1.8pF, 2.0pF, 2.2pF, 2.7pF, 3.0pF, 3.3pF, 3.6pF, 3.9pF, 4.7pF, 5.0pF, 5.6pF, 6.8pF, 8.0pF, 8.2pF, 10pF, 12pF, 15pF, 18pF, 22pF, 27pF, 33pF, 39pF, 47pF, 56pF, 68pF, 100pF, 120pF, 150pF, 180pF, 220pF, 270pF, 300pF, 330pF, 390pF, 470pF, 560pF, 680pF, 1nF 200V: 1.5pF, 1.8pF, 2.0pF, 2.2pF, 2.7pF, 3.0pF, 3.3pF, 3.6pF, 3.9pF, 4.7pF, 5.0pF, 5.6pF, 6.8pF, 8.0pF, 8.2pF, 10pF, 12pF, 15pF, 18pF, 22pF, 27pF, 33pF, 39pF, 47pF, 56pF, 68pF, 100pF, 120pF, 150pF, 180pF, 220pF, 270pF, 300pF, 330pF, 390pF, 470pF, 560pF, 680pF, 1nF 250V: 1.8pF, 2.0pF, 2.2pF, 2.7pF, 3.0pF, 3.3pF, 3.6pF, 3.9pF, 4.7pF, 5.0pF, 5.6pF, 6.8pF, 8.0pF, 8.2pF, 10pF, 12pF, 15pF, 18pF, 22pF, 27pF, 33pF, 39pF, 47pF, 56pF, 68pF, 100pF, 120pF, 150pF, 180pF, 220pF, 270pF, 330pF, 390pF, 470pF, 560pF, 680pF, 1nF 500V: 2.2pF, 2.7pF, 3.0pF, 3.3pF, 3.6pF, 3.9pF, 4.7pF, 5.0pF, 5.6pF, 6.8pF, 8.0pF, 8.2pF, 10pF, 12pF, 15pF, 18pF, 22pF, 27pF, 33pF, 39pF, 47pF, 56pF, 68pF, 100pF, 120pF, 150pF, 180pF, 220pF, 270pF, 330pF, 390pF, 470pF, 560pF, 680pF, 1nF 1KV: 10nF 2KV: 10nF |
| C0G | 1206 (3.2mm*1.6mm) | 100V: 0.5pF to 10nF 200V: 0.5pF to 10nF 250V: 0.5pF to 10nF 500V: 0.5pF to 10nF 630V: 0.5pF to 10nF 1KV: 1nF to 10nF 2KV: 1nF to 10nF 3KV: 1nF to 10nF |
Capacitance Range and Voltage (Class II - X7R)
| Material | Dimension | Capacity/Voltage (Examples) |
|---|---|---|
| X7R | 0402 (1.0mm*0.5mm) | 100V: 100pF to 4.7F 200V: 100pF to 4.7F 250V: 100pF to 4.7F 500V: 100pF to 4.7F 630V: 100pF to 4.7F 1000V: 100pF to 2.2F 2000V: 100pF to 2.2F 2500V: 100pF to 2.2F |
| X7R | 1206 (3.2mm*1.6mm) | 100V: 100pF to 10F 200V: 100pF to 10F 250V: 100pF to 10F 500V: 100pF to 10F 630V: 100pF to 10F 1000V: 100pF to 22nF 2000V: 100pF to 22nF 2500V: 100pF to 22nF |
Measurement Method of Dielectric Withstanding Voltage
| Rated Voltage Range | Measuring Method |
|---|---|
| Vr=100V | Apply 250% Rated voltage for 5 seconds, max current not exceeding 50mA. |
| 100V < Vr < 500V | Apply 200% Rated voltage for 5 seconds, max current not exceeding 50mA. |
| 500V Vr 1000V | Apply 150% Rated voltage for 5 seconds, max current not exceeding 50mA. |
| 1000V < Vr 2000V | Apply 120% Rated voltage for 5 seconds, max current not exceeding 50mA. |
| 2000V < Vr 5000V | Apply 120% Rated voltage for 5 seconds, max current not exceeding 10mA. |
Reliability Test Summary
| Item | Class I (C0G) Specification | Class II (X7R) Specification | Test Method |
|---|---|---|---|
| Capacitance Change (C/C) | 1% or 1pF, whichever is larger | -15% ~ +15% | Refer to detailed test conditions |
| Dissipation Factor (DF) | Refer to specification | Refer to specification | Refer to detailed test conditions |
| Insulation Resistance (IR) | Refer to specification | Refer to specification | Refer to detailed test conditions |
| Solderability | At least 95% of terminal electrode covered by new solder. Visual Appearance: No visible damage. | Lead-free soldering: 2455 for 20.5s | |
| Resistance to Soldering Heat | C/C 2.5% or 0.25pF, whichever is larger; DF same as initial; IR same as initial. | C/C 15%; DF same as initial; IR same as initial. | Preheating 100-200 for 60-120s, Solder Temp 2655 for 101s. |
| Resistance to Flexure of Substrate | C/C: 5% or 0.5pF, whichever is larger | C/C: 10% | Bending depth 1mm, Speed 1mm/sec. |
| Temperature Cycle | No visible damage. C/C: C0G 1% or 1PF, whichever is larger. | 5 cycles: -55 (30min) +20 (2-3min) +125 (30min) +20 (2-3min). | |
| Termination Adhesion | No visible damage. Force T: 0402 2N, 0603 5N. | Apply force T for 60+1 seconds. | |
| Humidity Load | C/C: 7.5% or 0.75pF, whichever is larger. DF 2x initial. IR: Refer to spec. | C/C: -12.5% ~ +12.5%. DF 2x initial. IR: Refer to spec. | 402, 90-95%RH, Rated Voltage, 500 hours. |
| Life Test | C/C: 3% or 0.3pF, whichever is larger. DF 2x initial. IR: Refer to spec. | C/C: -20% ~ +20%. DF 2x initial. IR: Refer to spec. | 125, Applied Voltage (1.2-1.5Ur), 1000 hours. |
Package
| Type | Description |
|---|---|
| Paper Taping | Available for 0402, 0603, 0805, 1206 sizes. Reel dimensions: 7" (1782.0mm) and 13" (3302.0mm). Top cover tape peeling strength: 0.1N < strength < 0.7N. |
| Embossed Taping | Available for 0805~1812 sizes. Specific dimensions provided for various sizes and tape widths. |
| Packing Quantity | Varies by size, thickness, and reel type (7" or 13"). Examples: 0402, 0.500.05mm thickness: 10000 pcs (7" paper tape), 50000 pcs (13" paper tape). |
| Outer Packing | Includes first package (e.g., 10 reels) and second package (e.g., 6 cases). Labels include Part No., Quantity, and Date. |
Recommended Soldering Profile
Reflow Soldering: Temperature difference between soldering temperature and chip surface temperature should be maintained at T 150.
Wave Soldering: Peak temperature 240270. Temperature difference between soldering temperature and chip surface temperature should be maintained at T 150.
Hand Soldering: Max temperature 350, Max power 20W, Recommended tip diameter 1mm, Max soldering time 3s, Solder paste amount 1/2 chip thickness. Avoid direct contact between soldering iron head and ceramic components.
2511191605_FH-1206B471K102NT_C9189.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible