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Specifications
Voltage Rating:
50V
Capacitance:
1pF
Temperature Coefficient:
C0G
Mfr. Part #:
0603CG1R0C500NT
Model Number:
0603CG1R0C500NT
Package:
0603
Key Attributes
Product Description
Product Overview
General Series Multi-layer Ceramic Capacitors (MLCCs) are designed with a monolithic structure for high reliability. They offer excellent soldering and solder resistance properties, making them suitable for reflow and wave soldering processes. These capacitors provide high and stable capacitance. Class I capacitors (C0G, C0H) offer the most stable electrical performance, ideal for low-loss, high-stability high-frequency circuits. Class II capacitors (X7R, X5R, X7S, X7T, X6S, X6T) feature a higher dielectric constant and capacitance compared to Class I, with stable temperature characteristics suitable for a wide range of applications including DC-blocking, coupling, bypassing, and frequency discrimination.
Product Attributes
- Brand: Fenghua (implied by context and revision history)
- Type: General Series Multi-layer Ceramic Capacitors (MLCC)
- Dielectric Materials: C0G, X7R, X7S, X7T, X6S, X6T, X5R
- Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
Product Structure:
| No. | Name |
|---|---|
| Ceramic dielectric | |
| Inner electrode | |
| Substrate electrode | |
| Nickel Layer | |
| Tin Layer |
Product Dimensions (EIA Size Code):
| Size Code | Metric (LW) mm | Dimensions (LWT) mm |
|---|---|---|
| 01005 | 0.400.20 | 0.400.02 0.200.02 0.200.02 |
| 0201 | 0.600.30 | 0.600.03 0.300.03 0.300.03 |
| 0402 | 1.000.50 | 1.000.05 0.500.05 0.500.05 |
| 0603 | 1.600.80 | 1.600.10 0.800.10 0.800.10 |
| 0805 | 2.001.25 | 2.000.20 1.250.20 0.800.20 |
| 1206 | 3.201.60 | 3.200.30 1.600.30 0.800.20 |
| 1210 | 3.202.50 | 3.200.30 2.500.30 1.250.25 |
| 1808 | 4.502.00 | 4.500.40 2.000.20 1.600.30 |
| 1812 | 4.503.20 | 4.500.40 3.200.30 1.600.30 |
Temperature Coefficient / Characteristics:
| Dielectric | Reference Temperature Point | Temperature Coefficient | Operation Temperature Range |
|---|---|---|---|
| C0G | 25 | 030ppm/ | -55125 |
| X7R | 25 | 15% | -55125 |
| X7S | 25 | 22% | -55125 |
| X7T | 25 | -33%~+22% | -55125 |
| X6S | 25 | 22% | -55105 |
| X6T | 25 | -33%~+22% | -55105 |
| X5R | 25 | 15% | -5585 |
Capacitance Range and Voltage (Partial Data for Class II):
| Dimension | Dielectric | Voltage | Capacitance Code |
|---|---|---|---|
| 1005 (0.4mm*0.2mm) | X7R Series | 6.3V | AA |
| 1005 (0.4mm*0.2mm) | X7R Series | 50V | AA |
| 1005 (0.4mm*0.2mm) | X5R Series | 50V | AA |
| 0201 (0.6mm*0.3mm) | X7R Series | 6.3V | BA |
| 0201 (0.6mm*0.3mm) | X7R Series | 50V | BA |
| 0201 (0.6mm*0.3mm) | X5R Series | 50V | BA |
| 0402 (1.0mm*0.5mm) | X7R Series | 6.3V | CA |
| 0402 (1.0mm*0.5mm) | X7R Series | 50V | CA |
| 0402 (1.0mm*0.5mm) | X5R Series | 50V | CA |
| 0603 (1.6mm*0.8mm) | X7R Series | 6.3V | DA |
| 0603 (1.6mm*0.8mm) | X7R Series | 50V | DA |
| 0603 (1.6mm*0.8mm) | X5R Series | 50V | DA |
| 0805 (2.0mm*1.25mm) | X7R Series | 6.3V | EA |
| 0805 (2.0mm*1.25mm) | X7R Series | 50V | EA |
| 0805 (2.0mm*1.25mm) | X5R Series | 50V | EA |
| 1206 (3.2mm*1.6mm) | X7R Series | 6.3V | FA |
| 1206 (3.2mm*1.6mm) | X7R Series | 50V | FA |
| 1206 (3.2mm*1.6mm) | X5R Series | 50V | FA |
| 1210 (3.2mm*2.5mm) | X7R Series | 6.3V | GA |
| 1210 (3.2mm*2.5mm) | X7R Series | 50V | GA |
| 1210 (3.2mm*2.5mm) | X5R Series | 50V | GA |
| 1812 (4.5mm*3.2mm) | X7R Series | 6.3V | IB |
| 1812 (4.5mm*3.2mm) | X7R Series | 50V | IB |
| 1812 (4.5mm*3.2mm) | X5R Series | 50V | IB |
Reliability Test Methods:
| Item | Technical Specification | Test Method and Remarks |
|---|---|---|
| Capacitance | Class I: Should be within the specified tolerance. Class II: Should be within the specified tolerance. | Class I: Measuring Frequency 1000pF: 1MHz10%, >1000pF: 1KHz10%; Measuring Voltage: 1.00.2Vrms. Class II: Test Temperature: 253. C10F: Test Frequency: 1KHz10%, Test Voltage: 1.00.2Vrms. C>10F: Test Frequency: 12024 Hz, Test Voltage: 0.50.1Vrms. Class II dielectric requires aging before measurement. |
| Insulation Resistance (IR) | Class I: C10 nF, Ri50000M; C>10 nF, RiCR500S. Class II: C25 nF, Ri10000M; C>25 nF, RiCR100S. | Test Voltage: Rated Voltage (Max 500V). Duration: 605s. Test Humidity: 75%. Test Temperature: 253. Test Charge/Discharge Current: 50mA. |
| Dissipation Factor (DF, tan) | Class I: DF 1/(400+20C). Class II: Varies by voltage and capacitance (see document for details). | Class I: C30pF: Measuring Frequency 1MHz10% (C1000pF, 1KHz10%), Measuring Voltage: 1.00.2Vrms. C30pF: DF 0.1%. Class II: C10F: Test Frequency: 1KHz10%, Test Voltage: 1.00.2Vrms. C>10F: Test Frequency: 12024 Hz, Test Voltage: 0.50.1Vrms. |
| Dielectric Withstanding Voltage (DWV) | No breakdown or damage. | Measuring Voltage: Class I: 300% Rated Voltage; Class II: 250% Rated Voltage. Duration: 1~5s. Charge/Discharge Current: 50mA max. (Excludes high-voltage MLCCs). |
| Solderability | At least 95% of the terminal electrode is covered by new solder. Visual Appearance: No visible damage. | Preheating conditions: 80 to 120; 10~30s. Lead-free soldering: Solder Temperature: 2455; Duration: 20.5s. |
| Resistance to Soldering Heat | C/C: Class I: 2.5% or 0.25pF (whichever is larger); Class II: 15%. DF: Same to initial value. IR: Same to initial value. Appearance: No visible damage, at least 95% of the terminal electrode is covered by new solder. | Preheating conditions: 100 to 200; 60-120 seconds. Solder Temperature: 2655; Duration: 101s. Recovery Time: 242h at Room temperature. |
| Resistance to Flexure of Substrate (Bending Strength) | C/C: Class I: 5% or 0.5pF (whichever is larger); Class II: 10%. Appearance: No visible damage. | Test Board: PCB. Warp: 1mm. Speed: 1mm/sec. Measurement during bending. |
| Termination Adhesion | No visible damage. | Slowly apply a T force to the porcelain body on the side of the capacitor and hold for 60+1 seconds. Specification for force T: 0402: 2N; 0603: 5N. |
| Temperature Cycle | C/C: Class I: 1% or 1pF (whichever is larger); Class II: -15% ~ +15%. Appearance: No visible damage. | Cycling Times: 5 cycles (4 steps per cycle). Temperature ranges: -55 (30min), +20 (2-3min), Upper category temp. (125 for C0G/X7R/X7T/X7S, 85 for X5R, 105 for X6S/X6T) (30min), +20 (2-3min). Recovery time: 242h. |
| Humidity Load | C/C: Class I: 7.5% or 0.75pF (whichever is larger); Class II: 12.5%. DF: 2 times initial value. IR: Class I: Ri5000M or RiCR50S (whichever is smaller); Class II: Ri1000M or RiCR10S (whichever is smaller). Appearance: No visible damage. | Temperature: 402; Humidity: 90~95%RH; Voltage: Rated Voltage; Duration: 500h. Recovery Time: 242h. Class 2 specific capacitance/size requirements apply for post-test heat treatment. |
| Life Test | C/C: Class I: 3% or 0.3pF (whichever is larger); Class II: -20% ~ +20%. DF: 2 times initial value. IR: Class I: Ri4000M or RiCR40S (whichever is smaller); Class II: Ri2000M or RiCR50S (whichever is smaller). Appearance: No visible damage. | Low-Voltage (<100V): Applied Voltage: 2*Ur (except table 1); Duration: 1000h; Temperature: 125 (C0G/X7R/X7S), 85 (X5R), 105 (X6S/X6T). Charge/Discharge Current: 50mA max. Recovery Time: 24h2h. Class 2 specific capacitance/size requirements apply for post-test heat treatment. Voltage for capacitance measurement varies by size and capacitance. |
Packaging:
| Type | Description | Dimensions (mm) |
|---|---|---|
| Embossed Plastic Taping | Applies to 1005 type | W: 80.1, P0: 40.1, P1: 20.05, E: 1.750.1, F: 3.50.05, D0: 1.550.05, A0: 0.250.02, B0: 0.450.02, K0: 0.240.02 |
| Paper Taping | For 1005, 0201 types | A0: 0.240.02, B0: 0.450.02, W: 8.00.10, F: 3.500.05, E: 1.750.10, P1: 2.00.05, P2: 2.00.05, P0: 4.00.10, D0: 1.50 -0/+0.10, T: 0.30 |
| Paper Taping | For 0402, 0603, 0805, 1206 types | A0: 0.590.03, B0: 1.120.03, W: 8.00.10, F: 3.50.05, E: 1.750.10, P1: 2.00.05, P2: 20.05, P0: 4.00.10, D0: 1.550.05, T: 0.600.03 |
| Embossed Taping | For 0402, 0603, 0805, 1206 types | (See document for detailed dimensions A, B, C, D, E, F, G, H, J, T) |
| Embossed Taping | For 0805~1812 types | (See document for detailed dimensions A, B, C, D, E, F, G, H, J, T) |
| Reel Dimensions | 7' REEL / 13' REEL | (See document for detailed dimensions A, B, C, D, E, F, G) |
| Taping Specification (Peeling Strength) | Standard: 0.1N < peeling strength < 0.7N | N/A |
| Packing Quantity | Varies by size, thickness, and reel type (7-inch/13-inch, PT/ET). (See document for detailed quantities per size) | N/A |
Storage Precautions:
- Storage Conditions: Relative humidity 20-70%, temperature 5-40 (recommended below 30).
- Use immediately after delivery. High temperature/humidity or long-term storage may degrade packaging and oxidize end electrodes. Check packaging/appearance after 6 months, and solderability after 1 year.
- Do not store in environments with corrosive gases (HS, SO, Cl, NH, etc.).
- Avoid storage under direct sunlight or high humidity.
Precautions Before Use:
- Do not reuse capacitors removed from equipment.
- Confirm electrical characteristics (capacitance, voltage).
- Confirm capacitor characteristics under applied voltage.
- Confirm mechanical stress under use conditions.
- Confirm solderability of long-term stored capacitors.
- Perform heat treatment on long-term stored capacitors before measurement.
Application Restrictions:
- Intended for general consumer electronic devices (household appliances, office equipment, information and communication devices, AV/OA equipment, mobile phones, PCs).
- Not recommended for high-reliability applications such as aerospace, medical, aviation, atomic energy, disaster/crime prevention, electric heating, combustion, public information networks, data processing, military, power generation control, safety, vehicle-mounted, traffic signal, transportation, and underwater equipment.
- Fenghua is not liable for damages arising from use in restricted applications without prior written consent.
Soldering Conditions and Recommended Methods:
- Reflow Soldering: Temperature difference between soldering temperature and chip surface 150.
- Wave Soldering: Temperature difference between soldering temperature and chip surface 150.
- Manual Soldering: Avoid direct contact of soldering iron tip with ceramic body. Max temperature 350, max power 20W, recommended tip diameter 1mm, max soldering time 3s, solder paste amount 1/2 chip thickness.
- Recommended Soldering Method: Varies by size, temperature characteristic, and capacitance (Reflow soldering 'R', Wave soldering 'W').
- Recommended Reflow Pad Size (mm): Varies by capacitor size (See document for detailed dimensions L, W, A, B, C).
- Recommended Soldering Temperature Profile: (Refer to document for graphical representation).
2512241501_FH-0603CG1R0C500NT_C37117.pdf
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