Product Overview
High-Voltage Multi-layer Ceramic Capacitors (MLCCs) are designed for surface mounting and offer excellent high-voltage reliability. Built upon advanced MLCC technology, these capacitors are suitable for various DC high-voltage circuits, effectively enhancing electronic circuit performance. They feature a monolithic structure of laminated layers for high reliability, superior soldering and resistance capabilities suitable for reflow and wave soldering, and high, stable capacitance. These capacitors comply with GB/T 21041-2007 and GB/T 21042-2007 standards.
Key Applications: Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters.
Product Attributes
- Manufacturer: FENGHUA ()
- Product Type: High-Voltage Multi-layer Ceramic Capacitors (HIGH VOLTAGE MLCC)
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Executive Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Feature | Description |
|---|---|
| Series | High Voltage Series Of Ceramic Chip Capacitors |
| Sizes (EIA) | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 |
| Capacitance Range | Refer to detailed tables for specific dielectric, size, and voltage ratings. |
| Voltage Ratings | 6.3V to 5000V (specific values vary by size and dielectric) |
| Capacitance Tolerance | 0.05pF, 0.10pF, 0.25pF, 0.50pF, 1%, 2%, 5%, 10%, 20% |
| Temperature Coefficient/Characteristics | C0G: 0 30ppm/ (-55125) X7R: 15% (-55125) |
| Termination Material | Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A) |
| Package Styles | Braided 7 inch disc packing (T), Braided 13 inch disc packing (D) |
| Product Structure Components | Ceramic dielectric, Inner electrode, Substrate electrode, Nickel Layer, Tin Layer |
| Dimensions (Example: 0402) | L: 1.000.05 mm, W: 0.500.05 mm, T: 0.500.05 mm, WB: 0.250.05 mm |
| Dielectric Withstanding Voltage Test Method | Varies by rated voltage range (e.g., 200% rated voltage for 5s for Vr < 500V, max 50mA current). |
| Reliability Tests | Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, Life Test. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70%. Guaranteed solderability period: 12 months. |
| Soldering Methods Recommended | Reflow Soldering (R), Wave Soldering (W), Manual Soldering. Specific temperature profiles provided. |
2511191605_FH-0603B472K500NT_C53987.pdf
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